JPS63139672A - Semiconductor wafer grindstone - Google Patents

Abstract

PURPOSE:To make it possible to continuously use one grindstone for finishing a wafer having a predetermined thickness and a predetermined surface-roughness by integrally incorporating rough-grinding and finishing grindstones with each other so as to arrange them in a ring-like pattern. CONSTITUTION:When a wafer 6 sucked and secured to a chuck table 7 is advanced toward the center from the outer peripheral surface of a grindstone, the wafer 6 is at first rough-ground by a rough-grinding grindstone part 1 in the outer peripheral part of a grindstone to a depth of DELTAt1. Further, the rough- ground surface is then subsequently ground by a finishing grindstone 2 by DELTAt2 so that the thickness of the wafer 6 then has a value such as t-(DELTAt1+DELTAt2), and the wafer is finished having a surface-roughness corresponding to the particle size of the finishing grind stone 2.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a grinding wheel that is attached to a wafer back grinding device used in the manufacture of semiconductors.

[Conventional technology]

Conventionally, with this Ume grinding wheel, grinding was carried out by attaching independent grinding wheels to separate rotating shafts for each particle size, or by attaching independent grinding wheels to separate rotating shafts for each particle size.

[Problem that the invention seeks to solve]

If separate rotating shafts are used for each grain size, the grinding equipment becomes larger, more complex, and more expensive. At the same time, the height of each rotating shaft must be adjusted, which increases the frequency of height earthquakes. In this case, the problem arises that the proportion of the height adjustment time becomes large.

In addition, when separate grinding wheels are used for each grain size, it takes twice as long to attach, remove, and adjust the grinding wheels as there are grinding wheels, and at the same time, there is a problem that the risk of wafer cracking increases.

[Means for solving problems]

According to the present invention, the outer periphery is used for rough grinding and the inner periphery is used for finish grinding, and the grinding wheels 7 and 7 are arranged in a ring shape so that the grinding wheel rotates concentrically when attached to the rotating shaft, and Shape of the lower surface of the grinding wheel By using a grinding wheel with a structure that has a moderate slope downward from the entire outer periphery to the center, it is possible to perform rough grinding with the aim of cutting to approximately a predetermined thickness, and to a predetermined thickness and thickness. Finish grinding for the purpose of achieving a rough finish can be performed with a single rotary shaft and one grinding wheel.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a longitudinal sectional view of an embodiment of the present invention.

Moreover, FIG. 2 is an enlarged view of the grinding wheel shown in FIG. 1. The grinding wheel consists of a rough grinding wheel 1 and a finish grinding wheel 2, and the wheel base and mount disk 4
The rotary shaft 5 is connected to the rotary shaft 5 through the rotary shaft 5, and rotated at high speed by the rotary shaft 5.

When the wafer 6, which has been suctioned and fixed by the chuck table 7, is introduced from the outer periphery of the grinding wheel toward the center,
The wafer 6 is first roughly ground by Δtl by the rough grinding wheel 1. Next, the rough ground surface is continuously ground by Δt2 by the grinding wheel 2, and finally the wafer 6 becomes J'l−Sa1−(Δ11−Δt2), and the finish is by the grinding wheel 2. Finished with a roughness commensurate with the grain size.

〔Effect of the invention〕

According to the present invention, wafers can be continuously finished to a predetermined thickness and roughness using a single rotating shaft and one grinding wheel within the range of the maximum allowable cutting allowance of the rough grinding wheel.

Since it has a single rotating shaft and one grinding AiJ grinding wheel, attachment/detachment and adjustment of the grinding wheel are simplified, and the risk of wafer cracking caused by the grinding wheel can be minimized. Also,
This has the effect of making the grinding device simpler, simpler, and cheaper.

[Brief explanation of the drawing]

FIG. 1 is a longitudinal sectional view of an embodiment of the present invention, and FIG. 2 is an enlarged view of section A in FIG. 1... Grindstone for rough grinding, 2... Grindstone for finish grinding, 3... Wheel, 4... Mount disc, 5... Rotating axis, 6...
・Wafer, 7...Chuck table.

Claims (1)

[Claims] A grinding wheel for semiconductor wafers, which is a grinding device for semiconductor wafers that requires rough grinding and finish grinding, characterized in that the grindstones for rough grinding and finish grinding are integrated and arranged in a ring shape.