JPS58160050A - Chamfering method of wafer and grinding wheel used therefor - Google Patents
Chamfering method of wafer and grinding wheel used thereforInfo
- Publication number
- JPS58160050A JPS58160050A JP4052782A JP4052782A JPS58160050A JP S58160050 A JPS58160050 A JP S58160050A JP 4052782 A JP4052782 A JP 4052782A JP 4052782 A JP4052782 A JP 4052782A JP S58160050 A JPS58160050 A JP S58160050A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- grinding wheel
- peripheral surface
- grinding
- ground
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は新規かつ改良されたウェハーの面取シ加工法詔
よびこれに使用する砥石の構造に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a new and improved wafer chamfering method and the structure of a grindstone used therein.
従来、半導体シリコンとかＧＧＧのウェハー周縁部の面
取り加工は、第１図に示すように、ディスク状砥石１０
周面に被加工ウェハー２の周縁部に得ようとする彎曲面
２ａに合致する内周面３ａをもつ凹溝３を形成した、い
わゆる総形砥石を使用し、最初は目のあらい総形砥石を
用いて荒研削し、ついで目の細い総形砥石を用いて仕上
げ研削するというように、少なくとも２個の砥石を用い
て面取り部上を行なっていた。Conventionally, chamfering of the peripheral edge of semiconductor silicon or GGG wafers has been carried out using a disk-shaped grindstone 10, as shown in FIG.
A so-called full-form grindstone is used, which has a groove 3 formed on its circumferential surface with an inner circumferential surface 3a that matches the curved surface 2a to be obtained at the peripheral edge of the wafer 2 to be processed. At least two grindstones were used to perform rough grinding on the chamfered part, followed by final grinding using a fine-toothed full-form grindstone.
しかしながら、かかる従来法では砥石、特には荒研削用
の総形砥石の消耗が著しいうえに、荒研削、仕上げ研削
毎に砥石あるいはウェハーをセットし直さなければなら
ないという不利、欠点があった。However, this conventional method has disadvantages in that the grindstone, especially the full-form grindstone for rough grinding, is considerably worn out, and the grindstone or wafer must be reset after each rough grinding and finish grinding.
本発明はかかる従来法における不利、欠点を解決してな
る新規かつ改良され九ウェハーの面取り加工法を提供す
るものであって、これはディスク状砥石を用いて、ａ、
該砥石の回転軸に平行な側周面にてディスゲ状ウェハー
の側周面を研削する工程と、ｂ、ｇ砥石の周縁部上下に
設けた傾斜面にて該ウェハー周縁部の上下稜線部分を研
削する工程と、Ｃ１該砥石の側周面に設けた少なくとも
１条の凹溝内周面にて該ウェハーの周縁部全体を研削す
る工程、とを経てワエハーの周縁部を研削することを特
徴とするものであシ一本発明はまた、上記加工法に用い
る砥石に関するものであって。The present invention solves the disadvantages and shortcomings of the conventional methods and provides a new and improved method for chamfering nine wafers.
A process of grinding the side circumferential surface of the disc-shaped wafer with a side circumferential surface parallel to the rotation axis of the grindstone, and g. The periphery of the wafer is ground through a step of grinding, and a step of grinding the entire periphery of the wafer using the inner circumferential surface of at least one concave groove provided on the side circumferential surface of the grindstone. The present invention also relates to a grindstone used in the above processing method.
これはディスゲ状砥石の周縁部上下にそれぞれ傾斜面を
形成してディスク状ウェハー周縁部の稜線部分の研削面
とし、上記２つの傾斜面にはさまれた回転軸に平行な側
周面に少なくとも１条の凹溝を形成して該凹溝内周面を
上記ウェハーの周縁部研削面とし、上記２つの傾斜面と
凹溝の闇に残された側周面を上記ウェハーの側周面研削
面としてなることを特徴とするものである。This is done by forming inclined surfaces at the top and bottom of the circumferential edge of the disc-shaped grinding wheel to serve as the grinding surface for the ridgeline portion of the circumferential edge of the disk-shaped wafer, and at least a side circumferential surface parallel to the rotation axis sandwiched between the two inclined surfaces. A single groove is formed and the inner peripheral surface of the groove is used as the peripheral edge grinding surface of the wafer, and the two sloped surfaces and the side peripheral surface left behind the groove are ground as the side peripheral surface of the wafer. It is characterized by its appearance as a surface.
以下、第２図、第３図を参照して本発明の詳細な説明す
る。The present invention will be described in detail below with reference to FIGS. 2 and 3.
まず、第１図は本発明の方法において用いる砥石の代表
的実施例を示すものであって、この砥石はディスク状砥
石本体１００周縁部にそれぞれ２つの傾斜面１１．１２
と、２つの凹溝１３．１４を形成してなる４のであシ、
この砥石の局面にはたとえばダイヤモンド粒子からなる
砥粒層１６が設けられている。この実施例の砥石におけ
る上記傾斜面１１および１２は、被処理ウェハー２の周
一部の稜線部分の研削面として作用させ、また上記凹溝
１３．１４はその彎曲内周面をそれぞれウェハー周縁部
全体の荒研削面および仕上げ研削面として作用させ、さ
らに、上記傾斜面１１．１２と凹溝１３，１４との間に
残されたディスク四転軸に平行な側周面１５はウェハー
の側周面研削面として作用させることを意図するもので
あり、そのためにこの実施例では上記砥粒層１６につい
て、仕上げ研削面として作用させる凹溝１４の内周面を
形成する砥粒層については比較的目の細いものとされ、
この他の傾斜面１１．１２、凹溝１３の内周面等につい
ては比較的目の荒い砥粒層をもって構成されている。First, FIG. 1 shows a typical embodiment of a grindstone used in the method of the present invention, and this grindstone has two inclined surfaces 11 and 12 on the peripheral edge of a disc-shaped grindstone body 100.
and 4 holes formed by forming two grooves 13 and 14,
An abrasive grain layer 16 made of, for example, diamond particles is provided on the surface of this grindstone. The inclined surfaces 11 and 12 of the grinding wheel of this embodiment function as grinding surfaces for the ridgeline part of the circumference of the wafer 2 to be processed, and the grooves 13 and 14 have curved inner circumferential surfaces that cover the entire wafer periphery. Furthermore, the side circumferential surface 15 parallel to the disk rotation axis left between the inclined surface 11, 12 and the grooves 13, 14 serves as the side circumferential surface of the wafer. It is intended to act as a grinding surface, and for this reason, in this embodiment, relative attention is paid to the abrasive layer 16 that forms the inner peripheral surface of the groove 14 that acts as a final grinding surface. It is said to be thin,
The other inclined surfaces 11 and 12, the inner peripheral surface of the groove 13, etc. are constructed with a relatively coarse abrasive grain layer.
第２図に示すディスク状砥石を用い本発明方法に従って
、実際にたとえば半導体ｖリコンウエへ−の面取り加工
を行なうには、まず砥石１０を回転させると共に、必要
に応じウェハー２も回転させ、その第１工程においては
、第３図（ａｔに示すように、砥石１００回転軸に平行
な側周面にて、ウェハ−２の側周面を研削してクエへ−
周縁部を真円に矯正する、つぎにその第２工程において
は同図（ｂ）に示すように、クエへ−２の下方の稜線部
を砥石１０の上方傾斜面１１に当接して研削し、ついで
その第３工程においては同図（ｃｌに示すようにウェハ
−２の上方の稜線部を砥石１０の下方傾斜面１２に：髪
触させて研削する。このようにして上下の稜線部の研削
が行なわれたウェハーは、つづいてその第４工程におい
て同図（ｄ）に示すようにその周縁部全体を砥石側局面
の第１凹溝１３の内周面に接触させて、ウェハーの周縁
部に得ようとする彎曲面２ａに荒研削し、最後にこの荒
研削されたウェハー周縁部２ａを砥石の第２［！］溝１
４の内周面に当播させて仕上げ研削を行ない面取シ加工
を終了する。In order to actually chamfer, for example, a semiconductor v-recon wafer using the disc-shaped grindstone shown in FIG. In the first step, as shown in FIG.
In the second step of straightening the peripheral edge into a perfect circle, as shown in FIG. Then, in the third step, as shown in FIG. Subsequently, in the fourth step, the wafer that has been ground is brought into contact with the inner peripheral surface of the first groove 13 on the grinding wheel side surface so that the entire peripheral edge of the wafer is polished, as shown in FIG. The rough-ground wafer peripheral edge 2a is then roughly ground into the curved surface 2a that is to be obtained.
Finish grinding is performed on the inner peripheral surface of No. 4 to complete the chamfering process.
以上説明した通シ、本発明においては、単一の砥石を用
いてウェハーの面取り加工を完全に行なうことができて
、従来法のように１１敬個の砥石を用いて面取り加工を
行なっていた場合に比較して。As explained above, in the present invention, it is possible to completely chamfer a wafer using a single grindstone, whereas the conventional method used 11 grindstones to chamfer the wafer. Compared to the case.
その加工時間、加工能率を著しく同上でき、を九、これ
に使用するディスク状砥石についてもその周縁部の研削
面を極めて効率的に利用でき、特にウェハー周縁部全体
を研削する凹溝からなる研削面の口塞り、消耗の寝台が
従来公知の総形砥石に比較してはるかに小さく、シたが
ってその実用的価値はすこぶる畠いものとされる。The processing time and processing efficiency can be significantly reduced, and 9. The grinding surface of the peripheral edge of the disc-shaped grindstone used for this can be used extremely efficiently, especially when grinding with concave grooves for grinding the entire wafer periphery. The clogging of the surface and the wear table are much smaller than those of conventionally known full-form whetstones, and therefore its practical value is said to be extremely high.
【図面の簡単な説明】
第１図は従来法にしたがってウェハーの面取り加工を行
なうときの砥石とウェハーの関係を示す側面図である。
第２図は本発明にしたがって面取シ加工を行なうときの
砥石とウェハーの関係を示すものであって、砥石を一部
切欠断面で表わした側面図、第３図（ａ）〜（ｅｌＦｉ
その面取）加工の工程を説明するための要ｓａ略断面図
である。
１０・・・砥石、 １１．１２・・・傾斜面。
１３．１４・・・凹溝、 １５・・・側周面。
１６・・・砥粒ｍ、 ２・・・９エバー。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a side view showing the relationship between a grindstone and a wafer when chamfering a wafer according to a conventional method. FIG. 2 shows the relationship between the grinding wheel and the wafer when chamfering is performed according to the present invention.
FIG. 3 is a schematic cross-sectional view for explaining the chamfering process. 10...Whetstone, 11.12...Slanted surface. 13.14...concave groove, 15...side peripheral surface. 16...abrasive grain m, 2...9 ever.
Claims (1)
研削する工程と、ｂ、該砥石の周縁部上下に設けた傾斜
面にて該ウェハー周縁部の上下稜線部分を研削する工程
と、Ｃ１該砥石の側周面に設けた少なくとも１条の凹溝
内周面にて該ウェハーの周縁部全体を研削する工程、と
を経てウェハーの周縁部を研削することを特徴とするウ
ェハーの面取り加工法。 ２６ ディスク状砥石の周縁部上下にそれぞれ傾斜面
を形成してディスク状つエノ１−周縁部の稜線部分の研
削面とし、上記２つの傾斜面にはさまれた（２）転軸に
平行な側周面に少なくとも１条の凹溝を形成して該Ｉ！
！Ｉ溝内周面を上記ワエハーの周縁部研削面とし、上記
２つの傾斜面と凹溝の闇に桟された側周面を上記ワエハ
ーの側周面研削面としてなることを特徴とするウェハー
面取り加工用砥石。[Claims] 1. Using a disc-shaped grindstone, a step of grinding the side circumferential surface of the disk grinder 1- with the side circumferential surface parallel to the 3° rotational axis of the i grindstone; b. A step of grinding the upper and lower ridgeline portions of the wafer periphery with inclined surfaces provided above and below the periphery of the grindstone; A wafer chamfering method characterized by grinding the entire periphery of the wafer. 26 Inclined surfaces are formed on the upper and lower sides of the periphery of the disc-shaped whetstone to serve as the grinding surface at the ridgeline portion of the periphery of the disc-shaped grindstone, and (2) parallel to the rolling axis is sandwiched between the two slanted surfaces. At least one concave groove is formed on the side circumferential surface and the I!
! Wafer chamfering characterized in that the inner circumferential surface of the I-groove serves as the peripheral edge grinding surface of the wafer, and the side circumferential surface flanked by the two inclined surfaces and the dark groove of the concave groove serves as the side circumferential grinding surface of the wafer. Grindstone for processing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4052782A JPS58160050A (en) | 1982-03-15 | 1982-03-15 | Chamfering method of wafer and grinding wheel used therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4052782A JPS58160050A (en) | 1982-03-15 | 1982-03-15 | Chamfering method of wafer and grinding wheel used therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58160050A true JPS58160050A (en) | 1983-09-22 |
Family
ID=12582949
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4052782A Pending JPS58160050A (en) | 1982-03-15 | 1982-03-15 | Chamfering method of wafer and grinding wheel used therefor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58160050A (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6322259A (en) * | 1986-07-10 | 1988-01-29 | Hitachi Cable Ltd | Semiconductor wafer grinding method and device thereof |
| JPS63197062U (en) * | 1987-06-08 | 1988-12-19 | ||
| JPS6420959A (en) * | 1987-07-15 | 1989-01-24 | Toshiba Ceramics Co | Chamfering device |
| US5727990A (en) * | 1994-06-17 | 1998-03-17 | Shin-Etsu Handotai Co., Ltd. | Method for mirror-polishing chamfered portion of wafer and mirror-polishing apparatus |
| JPH10329037A (en) * | 1994-08-22 | 1998-12-15 | Kiyokuei Kenma Kako Kk | Round hole grinding tool for annular board and round hole grinding method utilizing the same |
| KR100845967B1 (en) | 2006-12-28 | 2008-07-11 | 주식회사 실트론 | Method of grinding wafer edge and grinding wheel |
| CN102490099A (en) * | 2011-11-26 | 2012-06-13 | 深圳市合川科技有限公司 | Grinding knife of vertical leather edge grinding machine |
| CN103659512A (en) * | 2014-01-03 | 2014-03-26 | 曹仁风 | Edge grinding machine |
| CN103692306A (en) * | 2013-12-31 | 2014-04-02 | 福建华日汽车配件有限公司 | Automatic feeding and chamfering machine |
| CN104175243A (en) * | 2014-08-14 | 2014-12-03 | 天津贝利泰陶瓷有限公司 | Formation grinding wheel, grinding bed and grinding formation arc edge ceramic tiles |
| CN105397593A (en) * | 2015-12-24 | 2016-03-16 | 福建省金牛机械发展有限公司 | Unidirectional single-stone-slab edge grinding device for inclined stone slab |
| CN110948326A (en) * | 2019-11-29 | 2020-04-03 | 武汉天马微电子有限公司 | Grinding cutter, grinding method for display panel, display panel and device |
| CN110977660A (en) * | 2019-12-05 | 2020-04-10 | Tcl华星光电技术有限公司 | Rubstone grinding wheel and edge grinding machine |
| CN112059799A (en) * | 2020-09-30 | 2020-12-11 | 郭小江 | Hardware kitchen ware grinding device and method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS512796B1 (en) * | 1969-07-24 | 1976-01-28 |
-
1982
- 1982-03-15 JP JP4052782A patent/JPS58160050A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS512796B1 (en) * | 1969-07-24 | 1976-01-28 |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6322259A (en) * | 1986-07-10 | 1988-01-29 | Hitachi Cable Ltd | Semiconductor wafer grinding method and device thereof |
| JPS63197062U (en) * | 1987-06-08 | 1988-12-19 | ||
| JPS6420959A (en) * | 1987-07-15 | 1989-01-24 | Toshiba Ceramics Co | Chamfering device |
| US5727990A (en) * | 1994-06-17 | 1998-03-17 | Shin-Etsu Handotai Co., Ltd. | Method for mirror-polishing chamfered portion of wafer and mirror-polishing apparatus |
| JPH10329037A (en) * | 1994-08-22 | 1998-12-15 | Kiyokuei Kenma Kako Kk | Round hole grinding tool for annular board and round hole grinding method utilizing the same |
| KR100845967B1 (en) | 2006-12-28 | 2008-07-11 | 주식회사 실트론 | Method of grinding wafer edge and grinding wheel |
| CN102490099A (en) * | 2011-11-26 | 2012-06-13 | 深圳市合川科技有限公司 | Grinding knife of vertical leather edge grinding machine |
| CN103692306A (en) * | 2013-12-31 | 2014-04-02 | 福建华日汽车配件有限公司 | Automatic feeding and chamfering machine |
| CN103659512A (en) * | 2014-01-03 | 2014-03-26 | 曹仁风 | Edge grinding machine |
| CN104175243A (en) * | 2014-08-14 | 2014-12-03 | 天津贝利泰陶瓷有限公司 | Formation grinding wheel, grinding bed and grinding formation arc edge ceramic tiles |
| CN105397593A (en) * | 2015-12-24 | 2016-03-16 | 福建省金牛机械发展有限公司 | Unidirectional single-stone-slab edge grinding device for inclined stone slab |
| CN110948326A (en) * | 2019-11-29 | 2020-04-03 | 武汉天马微电子有限公司 | Grinding cutter, grinding method for display panel, display panel and device |
| CN110948326B (en) * | 2019-11-29 | 2021-09-17 | 武汉天马微电子有限公司 | Grinding cutter, grinding method for display panel, display panel and device |
| CN110977660A (en) * | 2019-12-05 | 2020-04-10 | Tcl华星光电技术有限公司 | Rubstone grinding wheel and edge grinding machine |
| CN112059799A (en) * | 2020-09-30 | 2020-12-11 | 郭小江 | Hardware kitchen ware grinding device and method |
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