JPS63134156A - Grinding or polishing method - Google Patents
Grinding or polishing methodInfo
- Publication number
- JPS63134156A JPS63134156A JP27809086A JP27809086A JPS63134156A JP S63134156 A JPS63134156 A JP S63134156A JP 27809086 A JP27809086 A JP 27809086A JP 27809086 A JP27809086 A JP 27809086A JP S63134156 A JPS63134156 A JP S63134156A
- Authority
- JP
- Japan
- Prior art keywords
- tool
- workpiece
- grinding
- machining surface
- machining
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 13
- 238000000034 method Methods 0.000 title claims description 5
- 238000003754 machining Methods 0.000 claims abstract description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 3
- 239000000843 powder Substances 0.000 claims abstract 4
- 239000003921 oil Substances 0.000 claims abstract 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract 3
- 229910001868 water Inorganic materials 0.000 claims abstract 3
- 229910000420 cerium oxide Inorganic materials 0.000 claims abstract 2
- 229910003460 diamond Inorganic materials 0.000 claims abstract 2
- 239000010432 diamond Substances 0.000 claims abstract 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims abstract 2
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims abstract 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910052814 silicon oxide Inorganic materials 0.000 claims abstract 2
- 229910001928 zirconium oxide Inorganic materials 0.000 claims abstract 2
- 239000007788 liquid Substances 0.000 claims description 7
- 238000007667 floating Methods 0.000 abstract description 5
- 230000003746 surface roughness Effects 0.000 abstract description 4
- 230000002265 prevention Effects 0.000 abstract description 3
- 239000011259 mixed solution Substances 0.000 abstract 2
- 239000006061 abrasive grain Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005188 flotation Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000003190 viscoelastic substance Substances 0.000 description 1
Landscapes
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
Description
【発明の詳細な説明】
発明の居する分野の説明
本発明はシリコン、石英、炭化硅素、無電解ニッケル、
モニブデン、タングステンなどでできた平面1球面1円
筒面形状の光学読の表面を、粗さ数十〜数人の超平滑面
にするための研削又は研磨法に関するものである。[Detailed Description of the Invention] Description of the field in which the invention pertains The present invention relates to silicon, quartz, silicon carbide, electroless nickel,
The present invention relates to a grinding or polishing method for making an optically readable surface made of monybdenum, tungsten, etc., which has a flat, spherical, and cylindrical shape, into an ultra-smooth surface with a roughness of several tens to several degrees.
従来の技術の説明
表面粗さが0. 01 μm (=10OA) Rma
x以下の高精度な仕上には古くからピッチのポリシャが
用いられてきたが、ピッチは粘弾性体であるため、高精
度な機械加工が難しく、作業者の手づくりに頼っており
、均一なものが得られにくい。又、研磨中に熱その他の
原因により、塑性変形がおこり易く、研磨工具としての
寿命が短い等の欠点がある。Description of conventional technology Surface roughness is 0. 01 μm (=10OA) Rma
Pitch polishers have been used for a long time for high-precision finishing of x or less, but since pitch is a viscoelastic material, high-precision machining is difficult, and it relies on the handwork of workers, and it is difficult to achieve a uniform finish. is difficult to obtain. In addition, plastic deformation tends to occur during polishing due to heat or other causes, and the service life of the polishing tool is short.
それらを解決するために、硬質工具を用い、工具を加工
物の間に液と砥粒を流し動圧を発生させ、非接触状態で
除去を行うフロートポリシングー等の新研磨法が考えら
れた。しかし、浮上に十分な動圧が得にくいことや、加
工面外周辺から砥粒を供給する方式のため、必ずしも多
数の砥粒が加工面に到達するわけでもなく、加工能率が
低いことが指摘されている。To solve these problems, new polishing methods such as float polishing, which uses a hard tool and generates dynamic pressure by flowing liquid and abrasive particles between the workpiece and removes the workpiece without contact, have been devised. . However, it has been pointed out that it is difficult to obtain sufficient dynamic pressure for flotation, and because the abrasive grains are supplied from outside the machining surface, many abrasive grains do not necessarily reach the machining surface, resulting in low machining efficiency. has been done.
発明の目的
本発明は、以上の欠点をなくして、浮上・に十分な圧力
と、多数の研磨砥粒を加工物と工具の間に供給すること
を可能にし、更に、加工物への砥粒の衝突方向を最も有
効な方向に規制することを可能にすることを目的として
いる。Purpose of the Invention The present invention eliminates the above-mentioned drawbacks, makes it possible to supply sufficient pressure for floating and a large number of abrasive grains between a workpiece and a tool, and furthermore, makes it possible to supply sufficient pressure for floating and a large number of abrasive grains between a workpiece and a tool. The purpose is to make it possible to regulate the direction of collision in the most effective direction.
発明の構成および作用の説明
第1図は本発明の実施例で、lは加工される鏡、2は液
を噴出する工具(ノズル)、3は工具保持具(ノズルホ
ルダー)、4は工具抑圧用エアシリンダ、5は横方向ス
ライド、6は噴出用ポンプ、8は吸上管、9は液供給管
、10は液流出防止用オケである。DESCRIPTION OF THE STRUCTURE AND OPERATION OF THE INVENTION FIG. 1 shows an embodiment of the present invention, where l is a mirror to be machined, 2 is a tool (nozzle) that spouts liquid, 3 is a tool holder (nozzle holder), and 4 is a tool suppressor. 5 is a horizontal slide, 6 is a jetting pump, 8 is a suction pipe, 9 is a liquid supply pipe, and 10 is a liquid outflow prevention cage.
吸い上げられた研磨液はポンプで圧力を高められ、工具
内面を通って噴出工具で流れの方向をそろえられて加工
面にぶつかる。加工面には圧力が発生するため、噴出工
具は加工面から押し上げられるが、一方、工具は上方か
らエアシリンダで加圧されており、結局、噴出圧とエア
シリンダ圧のバランスしたところで工具位置が決まる。The pressure of the sucked up polishing liquid is increased by a pump, and the flow is aligned through the inner surface of the tool by a jetting tool and hits the machined surface. Since pressure is generated on the machining surface, the jetting tool is pushed up from the machining surface, but on the other hand, the tool is pressurized from above by the air cylinder, and the tool position is eventually reached when the jetting pressure and air cylinder pressure are balanced. It's decided.
噴出された液は加工面に沿って流れ、再び吸上管を通っ
て循環する。The ejected liquid flows along the processing surface and circulates through the suction pipe again.
噴出圧が大きい程浮上量は増し、エアシリンダ圧が大き
い程、浮上ユは小さくなる。一方、浮上量が小さい方が
除去能率がよいことが知られており、エアシリンダ圧と
噴出圧の両方を調整して、接触しない範囲内で、できる
だけ浮上量を小さくすることが望ましい。The higher the jet pressure is, the higher the floating height is, and the higher the air cylinder pressure is, the smaller the floating height is. On the other hand, it is known that the smaller the flying height is, the better the removal efficiency is, and it is desirable to adjust both the air cylinder pressure and the jet pressure to make the flying height as small as possible without contact.
均一に除去するためには、加工物を中心軸まわりに回転
させ、同時に噴出工具を加工面に沿りて平行に移動させ
た方がよい。In order to remove the particles uniformly, it is better to rotate the workpiece around the central axis and simultaneously move the jetting tool parallel to the workpiece surface.
第2図は球面を加工する時の配置図で、加工物の曲率中
心まわりに旋回させ、噴出工具の先端部は加工物の曲率
に合うように予め加工をしておく。Fig. 2 is a layout diagram for machining a spherical surface, in which the tool is rotated around the center of curvature of the workpiece, and the tip of the jetting tool is machined in advance to match the curvature of the workpiece.
以上の実施例では、加圧手段はすべてエアシリンダで行
ったが、荷重、スプリング等の加圧手段を用いても何ら
差支えない。In the above embodiments, all the pressurizing means are air cylinders, but there is no problem in using a pressurizing means such as a load or a spring.
効果の説明
以上、加圧面に流体圧を作用することにより、工具と工
作物の非接触状態が維持でき、接触時のキズ防止が図れ
、良好な面粗さの加工が可能となる。As described above, by applying fluid pressure to the pressurized surface, it is possible to maintain a non-contact state between the tool and the workpiece, prevent scratches during contact, and enable machining with good surface roughness.
又、砥粒の流れをそろえて、加工面に衝突することがで
きるため、能率的な加工ができる効へかある。Furthermore, since the abrasive grains can collide with the machining surface in a uniform flow, it is effective for efficient machining.
第1図は平面の加工面を研磨するときの機械構成を示し
た図、第2図は凸球面を研磨するときの機械構成を示し
たものである。
1−−−一加工物 2−一一一ノズル
3−−−−ノズルホルダー 4−一一一エアシリンダ6
−−−−ボンブFIG. 1 shows a machine configuration for polishing a flat processed surface, and FIG. 2 shows a machine configuration for polishing a convex spherical surface. 1----1 workpiece 2-111 nozzle 3---nozzle holder 4-111 air cylinder 6
----- Bomb
Claims (2)
酸化硅素、ダイヤモンド等の硬質微粉と水、油の混合液
を、直径10μ〜100μの面状に配置された多数の貫
通穴を有する工具から噴出させ、該工具を加工面に押圧
し、回転又は移動させながら加工面に沿って横移動させ
る研削又は研磨方法。(1) Cerium oxide, zirconium oxide, aluminum oxide,
A mixed liquid of hard fine powder such as silicon oxide or diamond, water, and oil is ejected from a tool having a large number of through holes arranged in a plane with a diameter of 10 μm to 100 μm, the tool is pressed against the processing surface, and the tool is rotated or A grinding or polishing method that involves moving laterally along the machined surface.
度傾斜を有することを特徴とする特許請求の範囲第(1
)項記載の研削又は研磨方法。(2) The direction of the through hole of the jetting tool has an angular inclination with respect to the machining surface.
) Grinding or polishing method described in section 2.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27809086A JPS63134156A (en) | 1986-11-20 | 1986-11-20 | Grinding or polishing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27809086A JPS63134156A (en) | 1986-11-20 | 1986-11-20 | Grinding or polishing method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63134156A true JPS63134156A (en) | 1988-06-06 |
Family
ID=17592495
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP27809086A Pending JPS63134156A (en) | 1986-11-20 | 1986-11-20 | Grinding or polishing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63134156A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014069303A (en) * | 2012-10-01 | 2014-04-21 | Toyo Advanced Technologies Co Ltd | Vertical grinder |
CN109048676A (en) * | 2018-07-28 | 2018-12-21 | 繁昌县众运机械制造有限公司 | A kind of 3D printing object polissoir |
-
1986
- 1986-11-20 JP JP27809086A patent/JPS63134156A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014069303A (en) * | 2012-10-01 | 2014-04-21 | Toyo Advanced Technologies Co Ltd | Vertical grinder |
CN109048676A (en) * | 2018-07-28 | 2018-12-21 | 繁昌县众运机械制造有限公司 | A kind of 3D printing object polissoir |
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