JPS6313393A - Mounting structure of electronic parts - Google Patents

Mounting structure of electronic parts

Info

Publication number
JPS6313393A
JPS6313393A JP15748086A JP15748086A JPS6313393A JP S6313393 A JPS6313393 A JP S6313393A JP 15748086 A JP15748086 A JP 15748086A JP 15748086 A JP15748086 A JP 15748086A JP S6313393 A JPS6313393 A JP S6313393A
Authority
JP
Japan
Prior art keywords
electronic component
mounting structure
lead frame
lead
tab
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15748086A
Other languages
Japanese (ja)
Other versions
JPH0719943B2 (en
Inventor
森　史男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP61157480A priority Critical patent/JPH0719943B2/en
Publication of JPS6313393A publication Critical patent/JPS6313393A/en
Publication of JPH0719943B2 publication Critical patent/JPH0719943B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 ［産業上の利用分野］ 本発明は、電子部品の実装構造に関し、特にテープキャ
リア方式で組立てられたＩＣ（以下ＴＡＢＩＣとし）う
）のセラミックパッケージにおける電子部品の実装構造
に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a mounting structure for electronic components, and particularly to a mounting structure for electronic components in a ceramic package of an IC (hereinafter referred to as TABIC) assembled using a tape carrier method. Regarding.

［従来の技術］ 従来この種の電子部品の実装構造においては、第３図の
様にテープキャリアから切り踵し、直角に折り曲げ成形
されたリードフレーム３の一端部がセラミック基板４上
のリード接続端子５に接続され、他端部が電子部品たと
えばＴＡＢ、ＩＣ１のリード線に対し接続されていた。[Prior Art] Conventionally, in this type of electronic component mounting structure, as shown in FIG. It was connected to the terminal 5, and the other end was connected to a lead wire of an electronic component such as TAB or IC1.

リードフレーム３とＴＡＢ　ＩＣＩとの間には、短絡防
止のためにバンブ２が配置されていた。A bump 2 was placed between the lead frame 3 and the TAB ICI to prevent short circuits.

［発明が解決しようとする問題点］ 上述した従来の電子部品の実装構造では、第４図に示す
ようにＴＡＩＩＩＩＣＩがその取扱時あるい゛はダイポ
ンディング時などに矢印Ｂに示すようにセラミック基板
４に向けて押圧されるとリードフレーム３か塑性変形し
、ＴＡＢＩ（：１のエツジに接触しショートを起こすと
いう欠点かあった。[Problems to be Solved by the Invention] In the conventional electronic component mounting structure described above, as shown in FIG. 4, the lead frame 3 plastically deforms and comes into contact with the edge of TABI (:1), causing a short circuit.

［問題点を解決するための手段コ そのために本発明は、セラミック基板上のリード接続端
子にリードフレームの一端部が接続され、かつ他端部が
電子部品のリート線に接続されてなる電子部品の実装構
造において、 前記リードフレームの中間部が、一端部から直立された
第１の部分と、前記第１の部分に対し前記電子部品に接
近する方向に直立された第２の部分と、前記第２の部分
に対し所定の角度で前記電子部品に接近する方向に起立
され他端部に連続された第３の部分とを包有してなるこ
とを特徴とする電子部品の実装構造を提供するものであ
る。[Means for Solving the Problems] Therefore, the present invention provides an electronic component in which one end of a lead frame is connected to a lead connection terminal on a ceramic substrate, and the other end is connected to a lead wire of an electronic component. In the mounting structure, an intermediate portion of the lead frame includes a first portion that stands upright from one end, a second portion that stands upright with respect to the first portion in a direction approaching the electronic component, and Provided is a mounting structure for an electronic component, characterized in that it includes a third portion that stands up in a direction approaching the electronic component at a predetermined angle with respect to the second portion and is continuous to the other end. It is something to do.

［実施例］ 次に本発明について添付図面を参照しつつ具体的に説明
する。[Example] Next, the present invention will be specifically described with reference to the accompanying drawings.

第１図は、本発明の電子部品の実装構造の一実施例を示
す縦断面図である。第２図は、第１図実施例の動作状態
を示す断面図である。FIG. 1 is a longitudinal sectional view showing an embodiment of the electronic component mounting structure of the present invention. FIG. 2 is a sectional view showing the operating state of the embodiment shown in FIG.

先ず本発明の電子部品の実装構造の構成について説明す
る。First, the configuration of the electronic component mounting structure of the present invention will be explained.

１は電子部品たとえばＴＡＢ　ＩＣすなわちテープキャ
リア方式で組立てられたＩＣで、セラミック基板４に対
して実装されている。３はＴＡＢＩＣＩとセラミック基
板４との間に配置されたリードフレームで、一端部がセ
ラミック基板４上のリード接続端子５に接続され、他端
部がＴＡＢ　ＩＣＩのリード線に対し接続されている。Reference numeral 1 denotes an electronic component such as a TAB IC, that is, an IC assembled using a tape carrier method, which is mounted on a ceramic substrate 4. Reference numeral 3 denotes a lead frame disposed between the TABICI and the ceramic substrate 4, one end of which is connected to a lead connection terminal 5 on the ceramic substrate 4, and the other end connected to the lead wire of the TABICI.

リードフレーム３の中間部は、一端部から直立された第
１の部分３ａと、前記第１の部分３ａに対しＴＡＢ　Ｉ
ＣＩに接近する方向に直立された第２の部分３ｂと、前
記第２の部分３ｂに対し所定の角度たとえばほぼ４５度
の角度でＴＡＢ　ＩＣＩに接近する方向に起立され他端
部に連続された第３の部分３Ｃとを包有している。The middle part of the lead frame 3 includes a first part 3a standing upright from one end, and a TAB I with respect to the first part 3a.
A second portion 3b stands upright in the direction approaching the CI, and a second portion 3b stands upright in the direction approaching the TAB ICI at a predetermined angle, for example, approximately 45 degrees, with respect to the second portion 3b and is continuous to the other end. It includes a third portion 3C.

２はバンプで、ＴＡＢ　ＩＣＩとリードフレーム３の他
端部との間に配置されており、ＴＡＢＩＣＩとリードフ
レーム３との間の短絡を防止している。A bump 2 is arranged between the TAB ICI and the other end of the lead frame 3 to prevent a short circuit between the TAB ICI and the lead frame 3.

更に本発明の電子部品の実装構造の作用について説明す
る。Furthermore, the operation of the electronic component mounting structure of the present invention will be explained.

セラミック基板４のリード接続端子５に対しリードフレ
ーム３の一端部を接続したのち、リードフレーム３の他
端部にバンブ２を配置しＴＡＢ　ＩＣＩののリード線に
対して接続する。After one end of the lead frame 3 is connected to the lead connection terminal 5 of the ceramic substrate 4, a bump 2 is arranged at the other end of the lead frame 3 and connected to the lead wire of the TAB ICI.

ＴＡＢ　ＩＣＩがセラミック基板４に向けて矢印Ａに示
すように押圧されると、リードフレーム３の中間部が特
に第１の部分３ａと第２の部分３ｂとの連続部で第２図
に示すように曲折される。When the TAB ICI is pressed toward the ceramic substrate 4 as shown by the arrow A, the middle part of the lead frame 3 is pressed as shown in FIG. It is bent to

したがって、リードフレーム３の第３の部分３ｃがその
他端部に対して大きく曲折されることを回避できるので
、ＴＡＢ　ＩＣＩがリードフレーム３に対して接触され
短絡されることを防止できる。Therefore, it is possible to prevent the third portion 3c of the lead frame 3 from being bent significantly with respect to the other end, thereby preventing the TAB ICI from coming into contact with the lead frame 3 and being short-circuited.

［発明の効果コ 上述より明らかなように本発明は、セラミック基板上の
リード接続端子にリードフレームの一端部が接続され、
かつ他端部が電子部品のリード線に接続されてなる電子
部品の実装構造において、前記リードフレームの中間部
が、一端部から直立された第１の部分と、前記第１の部
分に対し前記電子部品に接近する方向に直立された第２
の部分と、前記第２の部分に対し所定の角度で前記電子
部品に接近する方向に起立され他端部に連続された第３
の部分とを包有してなるので、（１）電子部品がセラミ
ック基板に接近する方向に押圧されてもリードフレーム
と電子部品との間の間隔がほとんど狭小となることを回
避できる効果を有し、ひいては（２）リードフレームと
電子部品とが接触し短絡することを防止できる効果を有
し、また（３）リードフレームと電子部品あるいはセラ
ミック基板のリード接続端子との間の接続部に印加され
る力を低減できる効果も有する。[Effects of the Invention] As is clear from the above, the present invention provides a method in which one end of a lead frame is connected to a lead connection terminal on a ceramic substrate,
In the mounting structure for an electronic component, the other end of the lead frame is connected to a lead wire of the electronic component, and the middle part of the lead frame has a first part that stands upright from one end, and a first part that is connected to the first part. The second one is erected in the direction approaching the electronic components.
and a third portion that stands up in a direction approaching the electronic component at a predetermined angle with respect to the second portion and is continuous to the other end.
(1) Even if the electronic component is pressed in a direction approaching the ceramic substrate, the gap between the lead frame and the electronic component can be prevented from becoming narrow. In addition, (2) it has the effect of preventing contact between the lead frame and electronic components and short-circuiting, and (3) it has the effect of preventing short circuits caused by contact between the lead frame and electronic components, and (3) it has the effect of preventing contact between the lead frame and electronic components or lead connection terminals of the ceramic substrate. It also has the effect of reducing the force applied.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明の電子部品の実装構造の一実施例を示す
断面図、 第２図は第１図実施例の動作状態を示す断面図、 第３図は従来の電子部品の実装構造を示す断面図、 第４図は第３図従来例の動作状態を示す断面図である。 １：ＴＡＢＩＣ２：バンプ ３：リードフレーム　４：セラミック基板５：リード接
続端子Fig. 1 is a sectional view showing an embodiment of the electronic component mounting structure of the present invention, Fig. 2 is a sectional view showing the operating state of the embodiment of Fig. 1, and Fig. 3 is a sectional view showing the conventional electronic component mounting structure. 4 is a sectional view showing the operating state of the conventional example shown in FIG. 3. FIG. 1: TABIC 2: Bump 3: Lead frame 4: Ceramic board 5: Lead connection terminal

Claims (1)

【特許請求の範囲】 　セラミック基板上のリード接続端子にリードフレーム
の一端部が接続され、かつ他端部が電子部品のリード線
に接続されてなる電子部品の実装構造において、 前記リードフレームの中間部が、一端部から直立された
第１の部分と、前記第１の部分に対し前記電子部品に接
近する方向に直立された第２の部分と、前記第２の部分
に対し所定の角度で前記電子部品に接近する方向に起立
され他端部に連続された第３の部分とを包有してなるこ
とを特徴とする電子部品の実装構造。[Scope of Claims] An electronic component mounting structure in which one end of a lead frame is connected to a lead connection terminal on a ceramic substrate, and the other end is connected to a lead wire of an electronic component, comprising: an intermediate portion of the lead frame; a first part standing upright from one end, a second part standing upright in a direction approaching the electronic component with respect to the first part, and at a predetermined angle with respect to the second part. A mounting structure for an electronic component, comprising a third portion that stands up in a direction approaching the electronic component and is continuous to the other end.
JP61157480A 1986-07-04 1986-07-04 Electronic component mounting structure Expired - Lifetime JPH0719943B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61157480A JPH0719943B2 (en) 1986-07-04 1986-07-04 Electronic component mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61157480A JPH0719943B2 (en) 1986-07-04 1986-07-04 Electronic component mounting structure

Publications (2)

Publication Number Publication Date
JPS6313393A true JPS6313393A (en) 1988-01-20
JPH0719943B2 JPH0719943B2 (en) 1995-03-06

Family

ID=15650597

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61157480A Expired - Lifetime JPH0719943B2 (en) 1986-07-04 1986-07-04 Electronic component mounting structure

Country Status (1)

Country Link
JP (1) JPH0719943B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170002944A (en) * 2015-06-30 2017-01-09 삼성전기주식회사 Lead frame and stack package module having thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58134454A (en) * 1982-02-05 1983-08-10 Sharp Corp Lead bonding structure
JPS6050932A (en) * 1983-08-31 1985-03-22 Oki Electric Ind Co Ltd Mounting method for semiconductor chip

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58134454A (en) * 1982-02-05 1983-08-10 Sharp Corp Lead bonding structure
JPS6050932A (en) * 1983-08-31 1985-03-22 Oki Electric Ind Co Ltd Mounting method for semiconductor chip

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170002944A (en) * 2015-06-30 2017-01-09 삼성전기주식회사 Lead frame and stack package module having thereof

Also Published As

Publication number Publication date
JPH0719943B2 (en) 1995-03-06

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