JPS631334U - - Google Patents

Info

Publication number
JPS631334U
JPS631334U JP1986094805U JP9480586U JPS631334U JP S631334 U JPS631334 U JP S631334U JP 1986094805 U JP1986094805 U JP 1986094805U JP 9480586 U JP9480586 U JP 9480586U JP S631334 U JPS631334 U JP S631334U
Authority
JP
Japan
Prior art keywords
wire
capillary
insertion hole
bonding device
wire insertion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986094805U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986094805U priority Critical patent/JPS631334U/ja
Publication of JPS631334U publication Critical patent/JPS631334U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案ボンデイング装置の要部側面模
式図、第２図はキヤピラリ先端の断面図、第３図
はキヤピラリの下面図、第４図乃至第７図は本考
案ワイヤボンデイング装置を用いたボンデイング
方法の一例を示す要部側面模式図、第８図は第７
図の要部拡大断面図、第９図、第１０図は本考案
装置を用いてシヨツトキーバリア型ＦＥＴを形成
した半導体チツプにワイヤボンデイングを施した
ときの上面図及び側面図、第１１図は傾斜のある
ボンデイングパツドにワイヤボンドをするときの
断面模式図、第１２図第１３図は従来のボンデイ
ング装置に使用されるキヤピラリの要部側面図及
び下面図である。 １…ワイヤスプール、２…ワイヤクランプ、３
…キヤピラリ、４…ワイヤ押圧部、５…挿通穴、
６…ヒートシンク、７…トーチ、９…ワイヤ、１
０…ボール、１１…ヒートコラム、１２…パツケ
ージ、１３…半導体チツプ、１４，１５…電極パ
ツド。

Claims (1)

    【実用新案登録請求の範囲】
  1. スプールから引き出した導体ワイヤをワイヤ挿
    通穴を有した筒状のキヤピラリで保持し、このキ
    ヤピラリの降下によつてキヤピラリ下端より延び
    るワイヤ部分を押し潰してワイヤボンデイングす
    るワイヤボンデイング装置において、キヤピラリ
    下端のワイヤ押圧部をワイヤ挿通穴周囲部に部分
    的に形成するとともに、キヤピラリをワイヤ挿通
    穴を軸として回転自在に設けたことを特徴とする
    ワイヤボンデイング装置。
JP1986094805U 1986-06-20 1986-06-20 Pending JPS631334U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986094805U JPS631334U (ja) 1986-06-20 1986-06-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986094805U JPS631334U (ja) 1986-06-20 1986-06-20

Publications (1)

Publication Number Publication Date
JPS631334U true JPS631334U (ja) 1988-01-07

Family

ID=30958637

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986094805U Pending JPS631334U (ja) 1986-06-20 1986-06-20

Country Status (1)

Country Link
JP (1) JPS631334U (ja)

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