JPS63132435A - Semiconductor element - Google Patents

Semiconductor element

Info

Publication number
JPS63132435A
JPS63132435A JP27785786A JP27785786A JPS63132435A JP S63132435 A JPS63132435 A JP S63132435A JP 27785786 A JP27785786 A JP 27785786A JP 27785786 A JP27785786 A JP 27785786A JP S63132435 A JPS63132435 A JP S63132435A
Authority
JP
Japan
Prior art keywords
chips
group
bonding agent
easily
tetraglycylglyamine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP27785786A
Other versions
JPH0793331B2 (en
Inventor
Hiroshi Inaba
Teru Okunoyama
Original Assignee
Toshiba Chem Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chem Corp filed Critical Toshiba Chem Corp
Priority to JP27785786A priority Critical patent/JPH0793331B2/en
Publication of JPS63132435A publication Critical patent/JPS63132435A/en
Publication of JPH0793331B2 publication Critical patent/JPH0793331B2/en
Anticipated expiration legal-status Critical
Application status is Expired - Fee Related legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

Abstract

PURPOSE: To bond-fix and remove IC chips or condenser chips easily at low temperature and within a short time by means of using tetraglycylglyamine represented by specific structural formulas and conductive bonding agent containing conductive powder.
CONSTITUTION: Tetraglycylglyamine represented by structural formulas and conductive bonding agent containing conductive powder are applicable to the title semiconductor element. In said formulas, R represents dialiphatic group, diaromatic group and dialicyclic group. IC chips are condenser chips can be easily bonded to one another at low temperature and within a short time using said bonding agent. The bonded chips are provided with bonding strength resistant to wire bonding process at 200°C. In order to replace any defective chips, they can removed easily at the temperature of around 250°C.
COPYRIGHT: (C)1988,JPO&Japio
JP27785786A 1986-11-22 1986-11-22 Semiconductor element Expired - Fee Related JPH0793331B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27785786A JPH0793331B2 (en) 1986-11-22 1986-11-22 Semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27785786A JPH0793331B2 (en) 1986-11-22 1986-11-22 Semiconductor element

Publications (2)

Publication Number Publication Date
JPS63132435A true JPS63132435A (en) 1988-06-04
JPH0793331B2 JPH0793331B2 (en) 1995-10-09

Family

ID=17589246

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27785786A Expired - Fee Related JPH0793331B2 (en) 1986-11-22 1986-11-22 Semiconductor element

Country Status (1)

Country Link
JP (1) JPH0793331B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04501635A (en) * 1989-09-05 1992-03-19
JP2011237645A (en) * 2010-05-11 2011-11-24 Nitto Denko Corp Resin composition for optical waveguide formation and optical waveguide using the same
JP2016017148A (en) * 2014-07-09 2016-02-01 三菱化学株式会社 Epoxy compound, epoxy compound-containing composition and cured product

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060116865A1 (en) 1999-09-17 2006-06-01 Www.Uniscape.Com E-services translation utilizing machine translation and translation memory
US7983896B2 (en) 2004-03-05 2011-07-19 SDL Language Technology In-context exact (ICE) matching
US8521506B2 (en) 2006-09-21 2013-08-27 Sdl Plc Computer-implemented method, computer software and apparatus for use in a translation system
US9262403B2 (en) 2009-03-02 2016-02-16 Sdl Plc Dynamic generation of auto-suggest dictionary for natural language translation
GB2468278A (en) 2009-03-02 2010-09-08 Sdl Plc Computer assisted natural language translation outputs selectable target text associated in bilingual corpus with input target text from partial translation
US9128929B2 (en) 2011-01-14 2015-09-08 Sdl Language Technologies Systems and methods for automatically estimating a translation time including preparation time in addition to the translation itself

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04501635A (en) * 1989-09-05 1992-03-19
JP2011237645A (en) * 2010-05-11 2011-11-24 Nitto Denko Corp Resin composition for optical waveguide formation and optical waveguide using the same
JP2016017148A (en) * 2014-07-09 2016-02-01 三菱化学株式会社 Epoxy compound, epoxy compound-containing composition and cured product

Also Published As

Publication number Publication date
JPH0793331B2 (en) 1995-10-09

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees