JPS63132181A - Semiconductor testing device - Google Patents

Abstract

PURPOSE:To restart an electric connection part and to secure contact and to improve the efficiency of a simultaneous test by detecting the defect in the contact of the electric connection part which connects a semiconductor to a tester when plural semiconductor elements are tested simultaneously. CONSTITUTION:Semiconductors are crimped on an electronic connecting device 4 which connects the semiconductor elements. If there is a semiconductor element having a defect in contacting among those elements, the tester 1 sends a contact defect signal 22 to a measurement control part 21. The measurement control part 21 receives this signal and then sends a restart signal 23 to the electric connecting device 4, which is restarted to crimped the semiconductor elements. The defect in contact is eliminated by this restarting and a simultaneous tests is enabled. Thus, even if there is the semiconductor element having the defect in contact, there is not any waste of time for retesting the elements after other elements are tested completely and all the semiconductor elements can be tested at the same time, so the efficiency of the simultaneous testing device is enhanced.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor testing device that simultaneously tests a plurality of semiconductor devices.

[Conventional technology] FIG. 2 is a configuration diagram of a conventional semiconductor testing device.

(1) During testing - semiconductor test means (hereinafter referred to as tester) that provides measurement signals (2) and judges measurement results;
(3) is an automatic transport means that is connected to the tester (1) and is capable of processing multiple semiconductor devices under test at the same time, automatically transporting them to the measurement position, and classifying and storing them into good or defective items based on the test results. (hereinafter referred to as a handler), (4) is attached to the handler (3), and one semiconductor element can be attached to each at the same time, and the electrical connection part (J: J, lower contact (referred to as a device). (5
) is a test start signal from the handler (3) that prompts the tester (1) to start the test.

FIG. 3 is a side view of the semiconductor element positioning device in the measurement section of the handler (3). In the figure, (6) is a measuring section. (7) is a semiconductor element, and (8) is a guide rail for guiding the semiconductor element (7) to a measurement position. (9) is an auxiliary stopper that stops the semiconductor element (7) just before the measurement position, and a stopper that stops the α old semiconductor element (7) at the measurement position.

FIG. 4 is a front view of the contact device (4) in the measurement section. In the figure, (7a) is the signal or power supply pin of the semiconductor device (7), and the lid is in contact with the signal or power supply pin (7a) and transmits the measurement signal (2) from the tester (1) to the semiconductor device (7). contact pin, f
12 is an earth plate, and aJ is a substrate of a contact device (4).

FIG. 5 is a perspective view of the contact device (4) shown in FIG. 4.

Next, the operation will be explained. A plurality of semiconductor devices to be tested (7) attached to a delivery device (not shown) of the handler (3) are sent to the measurement section (6) along the guide rail (8). In the measurement part (6), the guide rail '8
) is first temporarily stopped by the auxiliary stopper (9) immediately before the measurement position, and after this is released, the semiconductor element (7) is stopped at the measurement position by the main stopper aO.

Here, when the contact device (4) inserts the semiconductor element (7), the signal or power supply pin (7a) and the contact pin contact come into contact, and a measurement-enabled state is established. After that, a test start signal (5) is sent to the tester (1), and upon receiving it, the tester (1) simultaneously sends the measurement signal (2) to the plurality of semiconductor devices (7) at the measurement position, thereby starting the test. Begins.

When the handler (3) receives test completion signals for all the semiconductor devices (7) being tested,
The main stopper GO+ is released at the same time, and the semiconductor element (7)
The products are sent along the guide rail (8) to a sorting and storage device (not shown) of the handler (3), where they are sorted into non-defective items or defective items.

[Problem that the invention seeks to solve]

Conventional semiconductor devices are configured as described above, so
When testing multiple semiconductor devices (7) simultaneously, for example, 1
The second semiconductor element (7) is the signal or power supply pin (7a)
Even if the pin contact failure occurs because the contact bin αD is not in reliable contact with the other semiconductor element, the test will be carried out if the pin contact failure occurs in other semiconductor elements. Since the semiconductor device (7) has to wait without being tested until the test of the semiconductor device is completed, the test cannot be performed due to a problem other than the defect in the semiconductor device itself, and the semiconductor device (7) with the defective pin contact must be retested. There was a problem that testing efficiency decreased.

This invention was made to solve the above-mentioned problems, and aims to provide a semiconductor testing device with improved testing efficiency.

(Means for Solving Problems) The semiconductor testing device according to the present invention is characterized in that the automatic transport means is provided with restart means for restarting the electrical connection section when the test means detects a poor connection with the semiconductor element. It is something that

[Effect]

In this invention, even if there is a poor connection between the semiconductor element and the electrical connection section, the electrical connection section is restarted and the connection with the semiconductor device is re-established.

[Example] FIG. 1 is a diagram showing an embodiment of the present invention.

(1) to (13) are the same as the above-mentioned conventional one, and their explanation will be omitted. (21) is a control unit for the measuring unit (6) which receives and receives the pin contact failure signal from the tester (1), gives a restart signal to the contact device (4), and restarts the contact device (4). be. C24) is a handler equipped with this control unit Qυ.

In the semiconductor test equipment configured as described above, after the simultaneous measurement of multiple semiconductor elements (7) is started, if one semiconductor element (7) has a contact failure in the pin contact test, for example, the measurement is stopped. The tester (1) transmits a pin contact failure signal to the measurement section control section (21), which sends a restart signal to the contact device (4). By opening the contact device (4), contact with the semiconductor element (7) is temporarily interrupted, and by pinching again, the contact is restarted. As a result, contact of the semiconductor element (7) with the signal or power supply pin (11) can be made more secure the second time than the first time.

What happened is the semiconductor element (7) and the contact bottle (1υ
This is because the positional relationship between the main stopper (1G+) and the main stopper (1G+) is adjusted in a static state.

After that, the test start signal (5) is sent from the handler (3) to the tester (1) again, and the tester (1) receives it and sends a measurement signal to the semiconductor element (7) to start again from the first pin contact test. Ru. However, this series of control times (
For example, execution twice) can be arbitrarily set by the measurement unit control unit 2υ.

In the above embodiment, the test efficiency of simultaneous testing of multiple semiconductor devices (7) is increased by restarting the contact device (4), but the measurement unit control unit (21) does not receive the pin contact failure signal. After removing the auxiliary stopper (9),
Measurement 1 f6 with semiconductor element (7) controlling the main stopper (101, i.e. pin contact failure)
After releasing the main stopper (101) and thereby removing the semiconductor element (7) from the measurement position, release the auxiliary stopper (101).
9) and move on to the next semiconductor element (7) waiting for measurement.
) to the measurement position and perform another simultaneous test, the same effect can be expected.

〔Effect of the invention〕

As explained above, the present invention tests a plurality of semiconductor devices simultaneously by providing the automatic transport means with a restart means that restarts the electrical connection by detecting a poor connection between the test means and the semiconductor element. This ensures pin contact at the same time, which has the effect of increasing test efficiency in simultaneous tests.

[Brief explanation of the drawing]

FIG. 1 is a block diagram showing a semiconductor test device according to an embodiment of the present invention, FIG. 2 is a block diagram showing a conventional semiconductor test device, and FIG. FIG. 4 is a side view of the device, FIG. 4 is a front view of the electrical connection portion (contact device) in the measuring section, and FIG. 5 is a perspective view of the electrical connection portion (contact device) shown in FIG. 4. In the figure, (1) is a semiconductor testing means (tester), (2)
(4) is the electrical connection (contact device)
, (5) is the test start signal, and (21) is the measurement unit control unit 1.
n is a contact failure signal, n is a restart signal, and an example is an automatic transport means (handler). Note that the same reference numerals in each figure indicate the same or corresponding parts. Agent Masuo Oiwa Figure 1 Figure 2 Figure 3 Figure 5 Figure 2. Name of the invention Semiconductor testing equipment 03 (213) 3421 Permit Department) (Begono 6,
Subject of amendment (1) Column 6 of detailed explanation of the invention in the specification, contents of amendment (2) Figure 1 of the drawings is corrected as shown in the attached sheet. 7. List of attached documents (1) Drawings (Fig. 1) Above is Fig. 1

Claims (1)

[Claims] A device comprising a test means for testing a semiconductor element, and an automatic transport means for connecting the semiconductor element to the test means, having an electrical connection part, and loading and unloading, wherein the test means and the semiconductor element are connected to each other. A semiconductor testing apparatus characterized in that the automatic transport means is provided with a restart means for restarting the electrical connection section by detecting a connection failure in the semiconductor test apparatus.