JPH03293741A - Inspecting apparatus for semiconductor device - Google Patents

Abstract

PURPOSE:To prevent printing ink liquid from sagging by detecting presence or absence of each semiconductor device in a lead frame, and printing only actually present defective semiconductor device. CONSTITUTION:A semiconductor device detector 51 for detecting the presence or absence of each semiconductor device 30b in a lead frame 30 to output detection data S1, and a characteristic inspecting unit 52 for inspecting electric characteristics of each semiconductor device 30b to output characteristic inspection data S2 are disposed near a supply unit 50. Further, a marking unit 53 for printing the device having defective characteristics, a printing process discriminator 54 for deciding propriety of ink adherence, and container 55 for containing the frame 30 after deciding are sequentially disposed. The presence or absence of the device is detected, electric characteristic is inspected, and only actually present defective device is printed. Thus, it can prevent printing ink liquid from sagging.

Description

Detailed Description of the Invention (Industrial Application Field) The present invention tests the characteristics of a plurality of semiconductor devices supported by a lead frame, and performs printing processing on the semiconductor devices based on whether the test results are good or bad. The present invention relates to testing equipment for semiconductor devices.

(Conventional technology) In recent years, packages of semiconductor devices have been made smaller and lighter, and the pitch between leads has also been reduced. In order to improve the performance of semiconductor devices, multiple devices are supported by a lead frame.In the process of testing the characteristics of each semiconductor device, positioning is performed using the excellent shape and dimension accuracy of this lead frame. The test is being carried out while being supported by the

Conventionally, there have been the following technologies in this type of field. This will be explained below using figures.

FIG. 2 is a configuration block diagram showing an example of the configuration of conventional semiconductor device testing equipment.

This inspection device has a supply section 1 that sequentially supplies a plurality of lead frames stored in a magazine to a measurement stage by a drive mechanism (not shown). The supply part 1
Near the , there is a characteristic testing section 2 that tests the electrical characteristics of a plurality of packaged semiconductor devices supported by a lead frame and outputs characteristic test data, and a characteristic testing section 2 that performs printing processing on each semiconductor device based on the characteristic test data. A marking unit 3 that performs marking, a printing process determining unit 4 that checks whether the printing process is normal or abnormal based on the characteristic test data and the printing process results of the marking unit 3, and a storage unit 5 that stores the checked lead frame are sequentially operated. It is located.

The characteristic testing section 2 includes a tester 2a for measuring the characteristics of each semiconductor device and a characteristic testing mechanism 2b. 6.

Next, the operation will be explained.

The lead frames stored in the magazine are extracted one by one from the supply section 1 at a partial pitch by a drive mechanism (not shown) and transported to the measurement stage. The characteristics of each semiconductor device of the lead frame placed on the measurement stage are each inspected by the characteristic inspection section 2, and characteristic inspection data as the inspection results are stored in the data management section 6. The lead frame that has undergone the characteristic test is transferred to the marking section 3, and a printing process is performed on each semiconductor device based on the characteristic test data managed by the data management section 6. Furthermore, after the printing process is checked to see if it is normal or abnormal in the printing process determination section 4, it is stored in the storage section 5.

In this way, the characteristics of each electronic component, which is a semiconductor device, is inspected based on the shape of the lead frame, and a printing process is performed on defective products.

(Problem to be Solved by the Invention) However, in the semiconductor device inspection equipment having the above configuration,
The following issues were encountered.

For example, if there is a defective semiconductor device among multiple semiconductor devices, such as one where resin is not properly injected,
Usually, the defective semiconductor device is cut out from the lead frame in advance of the characteristic test.

As a result, as shown in FIG. 3, among the plurality of lead frames, a defective lead frame 30 having a missing part 30a where a semiconductor device is not present is generated, and this defective lead frame 30 is sent to the characteristic inspection section 2. If this happens, the following problems will occur:

(1) Naturally, the characteristic test result of the missing portion 30a of the defective lead frame 30 is defective. When this defective lead frame 30 is conveyed to the marking section 3, the missing part 30
Assuming that a defective semiconductor device exists for a, a printing process is performed to attach ink. However, since the semiconductor device 30b is not actually present, the printing ink liquid ends up dripping onto the stage.

(2> The determination result in the print processing determining section 4 is also determined to be defective, and the device stops operating due to the occurrence of a failure.

Due to these problems (1) and (2>), there is a problem that the operability of the device is reduced, and it has been difficult to solve this problem.

The present invention provides a semiconductor device testing device that solves the problems of the prior art, such as dripping of printing ink and deterioration in operability.

(Means for Solving the Problems) In order to solve the above problems, the present invention tests the electrical characteristics of a plurality of semiconductor devices supported by a lead frame, and outputs characteristic test data according to the test results. a characteristic inspection section; a marking section that performs a printing process on each of the semiconductor devices based on the characteristic inspection data; and a marking section that determines whether the printing process is normal or abnormal based on the characteristic inspection data and the printing process results of the marking section. The present invention is an inspection device for a semiconductor device including a print processing determination section, which takes the following measures.

A semiconductor device detection section is provided that detects the presence or absence of each of the semiconductor devices in the lead frame and outputs detection data according to the detection result, and the marking section compares the characteristic inspection data and the detection data, The printing process determining unit includes a first comparison unit that outputs printing process data according to the comparison result, and a printing process execution unit that executes the printing process according to the printing process data, and the printing process determination unit Comparison of a printing result data generating means for generating printing result data according to the printing processing result of the execution means, a second comparing means for comparing the printing processing data and the printing result data, and the second comparing means. and a printing result determining means for determining whether the printing process is normal or abnormal based on the result.

Furthermore, the printing result determining means may be configured to determine that the printing process is normal when the printing process data and the printing result data match, and that the printing process is abnormal when they do not match.

(Function) Since the present invention has the semiconductor device testing equipment configured as described above, the semiconductor device detecting section inspects the presence or absence of each semiconductor device in the lead frame, and the characteristic testing section checks the electrical characteristics of each semiconductor device. After being inspected, only the defective semiconductor devices that actually exist are subjected to printing processing by the marking section.

The print processing determination section determines whether the print processing result is normal or abnormal.

Therefore, the above problem can be solved.

(Embodiment) FIG. 1 is a block diagram of the configuration of a semiconductor device testing device showing an embodiment of the present invention, and common elements with those in FIG. 3 are given the same reference numerals.

This inspection equipment includes a plurality of semiconductor devices 30 sealed with resin.
The apparatus includes a supply section 50 that supplies the lead frame 30 having a diameter of 1.b to a measurement stage by a drive mechanism (not shown). In the vicinity of the supply section 50, the presence or absence of each semiconductor device 30b on the lead frame 30 is detected by an optical sensor or the like, and the detection result is [0'° if present,
The semiconductor device detection unit 51 outputs the detection data S1 which takes the case of "1°" and inspects the electrical characteristics of each semiconductor device 30b, and if the detection result is "good", it is "0" or "defective".
A characteristic testing section 52 is provided which outputs characteristic testing data S2 in which the case of 1' is set as "1'°."A marking section 53 which performs a printing process to apply ink to a semiconductor device with defective characteristics is disposed. A printing process determining unit 54 that determines whether or not ink has been properly attached to the corresponding semiconductor device in the printing process, and a storage unit 55 that stores the lead frame 30 after the determination are arranged in this order.

Here, the semiconductor device detection section 51 has a detection mechanism such as an optical sensor, and the characteristic inspection section 52 has an inspection mechanism consisting of a tester 52a for measuring characteristics, contact pins, etc., and these semiconductor device detection section 51, characteristic inspection The section 52, the marking section 53, and the print processing determining section 54 are connected to a data management section 56 consisting of a computer. The data management section 56 has a memory such as a RAM (random access memory) that stores detection data S1, characteristic test data S2, and print processing data S3 in separate areas for each chip.

The marking unit 53 corresponds to "'1" of the print processing data S3 and a first comparing means 53a such as an ALU that compares the characteristic inspection data S2 and the detection data S1 through arithmetic processing and outputs the print processing data S3. Printing process execution means 5 that executes printing process of attaching ink to the semiconductor device to be printed.
3b.

The print processing determination section 54 includes a print result data generating means such as an optical sensor that detects the presence or absence of ink adhesion as a print processing result of the print processing execution means 53b and generates print result data S4, and print processing data S3. and the print result data S4, and a second comparison means 54b that compares the print result data S
Printing result determining means 54c for determining that the printing process is normal when 3 matches the printing result data S4, and abnormal when they do not match.
It is made up of.

Fig. 4 is the operation flowchart of Fig. 1, and Fig. 5 (a>,
(b) is an explanatory diagram of the operation of the semiconductor device detection section 51, (a) is a diagram showing the lead frame 30 having a missing part 30a, and (b) is a diagram showing the storage format of the detection data S1. Figure 6(a).

(b) is an explanatory diagram of the operation of the characteristic testing section 52, and the same figure (a)
7(b) is a diagram showing the storage format of the characteristic testing data S2, FIG. 7(a),
(b) is an explanatory diagram of the operation of the marking section 53;
) is a diagram showing the storage format of print processing data S3, and the same figure (
b) is a diagram showing the semiconductor device after being subjected to printing processing;

The operation of FIG. 1 will be explained with reference to these figures.

The magazine containing the lead frame 30 is transferred to the supply unit 50.
After setting, the lead frame 30 is pulled out one by one from the supply section 50 by a predetermined operation and transported to the measurement stage by a drive mechanism (not shown) (step 70). The lead frame 30 placed on this measurement stage is detected in a horizontal row (for example, four semiconductor devices 30b) by an optical sensor or the like in the semiconductor device detection section 51.
The presence or absence of the semiconductor device 30b on the lead frame 1.30 is detected. Thereafter, the detection result is stored in the data management unit 56 as detection data S1 (step 71). As shown in FIG.
If 0b exists, "O" is set in the corresponding memory area, and if there is no semiconductor device 30b, "1pa" is set.

After completing the data set, the lead frame 1.30 is pitched on the stage and the next row is detected in the same way. When the presence or absence of all the semiconductor devices 30b on one lead frame 3o has been detected, the lead frame 3
0 is transported to the characteristic inspection section 52.

In the characteristic testing section 52, first, the stage on which the lead frame 30 is placed is raised, and the lead pieces of the semiconductor device WL30b are brought into contact with the contact pins.

After that, a start signal is sent to the tester 52a,
The tester 52a starts a characteristic test. After the test is completed, the test end signal and the test result are sent from the tester 52a. If the test result is "good", the data is "0'°," and if the test result is "defective" (semiconductor device 30b-1 shown in FIG. 6(a)), the data is "'1". 6th
As shown in FIG. 7B, the data is stored as individual characteristic test data s2 of the semiconductor device (step 72).

In this way, the characteristic test data s2 for all semiconductor devices of one lead frame 3o is stored in the data management section 56, and the lead frame 3o is transferred to the marking section 53. In the marking section 53, the first comparison means 5
3a, the characteristic test data S2 and the detection data s1 are compared, and the following print processing data s3 corresponding to the comparison result is generated. That is, the characteristic 1*test data s2 is "1".

Among the semiconductor devices corresponding to (defective), semiconductor devices 1 and 2 whose detection data Sl is '0' (exist) have data '1' (steps 73, 74, 75>), and other semiconductor devices On the other hand, data "o" (-step 76) is
The data is written into the memory of the data management section 56 as print processing data S3.

Subsequently, as shown in FIG. 7, the printing processing execution means 53b performs printing processing on the semiconductor device 30b-2 whose printing processing data s3 corresponds to '1'. After the printing process is completed, the lead frame 3° is conveyed to the printing process determining section 54. In this print processing data S3 generation means 54a,
The presence or absence of ink adhesion on the semiconductor device is sensed using an optical sensor. As a result, the print result data S4 is output as "1" if ink is attached to the semiconductor device, and "O" if no ink is attached. The second comparator Fi 54b compares the print result data S4 and the print processing data S3. As a result, if the data match with each other as "1" and "O", the printing process is normal, and if they do not match, it is judged as abnormal by the print result judgment means 54c, and the judgment result is reported to the operator. Ru. Then, they are finally stored in the storage section 55 one after another.

Note that the present invention is not limited to the illustrated embodiment, and various modifications are possible. For example, there are the following variations.

The semiconductor device detecting unit 51 of the above-mentioned embodiment sets “I Q ?1” when a semiconductor device is present, and “1” when a semiconductor device does not exist.
Although the detection data S1 is output as "°", it is also possible to output the detection data S1 as "1" if a semiconductor device is present and "0" if there is no semiconductor device. .

Further, the characteristic testing section 52 of the above embodiment tests the electrical characteristics of each semiconductor device and indicates that the detection result is "good".
0”, “Characteristics inspection data S2 characterized by the case of defective J
However, the reverse characteristic test data S, which is characterized by ``1 pass'' for the case of ``good J'' and ``characteristic test data S for the case of bad J''
2 may be output.

In these cases, the print processing execution means 53b needs to execute the print processing on the semiconductor device corresponding to "0 pass" of the print processing data S3.

Further, although a horse chestnut-sealed packaged semiconductor device is used as the semiconductor device 30b in the above embodiment, the present invention is not limited thereto, and, for example, a hermetically sealed packaged semiconductor device or the like may be used.

(Effects of the Invention) As described above in detail, according to the present invention, the presence or absence of each semiconductor device on the lead frame is detected, and printing is performed only on defective semiconductor devices that actually exist. It is possible to prevent the ink liquid from dripping. Furthermore, it is possible to prevent the device from stopping due to the occurrence of a failure, and the operation side is improved.

[Brief explanation of the drawing]

FIG. 1 is a block diagram of the configuration of semiconductor device inspection equipment showing an embodiment of the present invention, FIG. 2 is a configuration block diagram of conventional semiconductor device inspection equipment, and FIG. 3 shows a group of semiconductor devices in a lead frame. 4 is an operation flowchart of FIG. 1, and FIG. 5(a). (b) is an explanatory diagram of the operation of the semiconductor device detection section, and FIG. 6 (a)
, (b) is an explanatory diagram of the operation of the characteristic testing section, and FIG. 7 (a>, (
b) is an explanatory diagram of the operation of the marking section. 30... Lead frame, 51... Semiconductor device detection section, 52... Characteristic inspection section, 53...
... Marking section, 53a ... First comparison means, 53b ... Print processing execution means, 54.
. . . Print processing determination section, 54a . . . Print result data generation means, 54b . . . Second comparison means, 54c . ...
...Data management section, Sl...Detected data, S2
...Characteristics inspection data, S3...Print processing data, S4...Print result data. Figure 1 operation flowchart Figure 4 Node 2 n44 Lee Yadunk''r(a) luxury #'i heather sword]! Table 52 (b) Explanation of the operation of the commentary/commentary section 52 Fl1 character processing 53 (0) Ep character tag 171' cow conductor Ken Ib) Mark's work L Etsuaki of 53 Figure 7

Claims (1)

[Scope of Claims] 1. A characteristic testing section that tests the electrical characteristics of a plurality of semiconductor devices supported by a lead frame and outputs characteristic testing data according to the test results; Inspection of a semiconductor device, comprising: a marking section that performs printing processing on the semiconductor device; and a printing processing determining section that judges whether the printing processing is normal or abnormal based on the characteristic inspection data and the printing processing results of the marking section. The device includes a semiconductor device detection section that detects the presence or absence of each of the semiconductor devices in the lead frame and outputs detection data according to the detection result, and the marking section detects the characteristic inspection data and the detection data. The print processing determining unit comprises: a first comparison unit that compares and outputs print processing data according to the comparison result; and a print process execution unit that executes the printing process according to the print processing data. , a printing result data generation means for generating printing result data according to the printing processing result of the printing processing execution means; a second comparing means for comparing the printing processing data and the printing result data; An inspection device for a semiconductor device, comprising: printing result determining means for determining whether the printing process is normal or abnormal based on the comparison result of the comparing means. 2. The semiconductor device inspection equipment according to claim 1, wherein the printing result determining means determines that the printing process is normal when the printing process data and the printing result data match, and that the printing process is abnormal when they do not match. Equipment inspection equipment.