JPS631318U - - Google Patents
Info
- Publication number
- JPS631318U JPS631318U JP9442486U JP9442486U JPS631318U JP S631318 U JPS631318 U JP S631318U JP 9442486 U JP9442486 U JP 9442486U JP 9442486 U JP9442486 U JP 9442486U JP S631318 U JPS631318 U JP S631318U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- resin film
- adhesive
- adhesive material
- component unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000002788 crimping Methods 0.000 claims 1
- 229920001169 thermoplastic Polymers 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
- 239000004416 thermosoftening plastic Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Containers And Plastic Fillers For Packaging (AREA)
- Packages (AREA)
- Details Of Resistors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案に係るリードレス電子部品ユニ
ツトを示す断面図、第２及び３図は同ユニツトの
電子部品を基板面に装着する工程の説明図、第４
図は同ユニツトを多連に構成したものを示す断面
図、第５〜９図は同ユニツトの製造工程を示す説
明図である。
１０：リードレス電子部品、１０ａ，１０ｂ：
電極、１１：樹脂フイルム、１１ａ：凹所、１１
ｂ：鍔平面、１２：粘着材、１３：接着剤、１４
ａ，１４ｂ：半田チツプ。
FIG. 1 is a sectional view showing a leadless electronic component unit according to the present invention, FIGS.
The figure is a cross-sectional view showing a structure in which the same unit is constructed in series, and FIGS. 5 to 9 are explanatory views showing the manufacturing process of the same unit. 10: Leadless electronic components, 10a, 10b:
Electrode, 11: Resin film, 11a: Recess, 11
b: Tsuba plane, 12: Adhesive material, 13: Adhesive, 14
a, 14b: Solder chip.
補正 昭６１．９．２９
図面の簡単な説明を次のように補正する。
明細書第８頁第１９行記載の「第５〜９図」を
「第５〜８図」と訂正する。Amendment September 29, 1981 The brief description of the drawing is amended as follows. "Figs. 5 to 9" written on page 8, line 19 of the specification is corrected to "Figs. 5 to 8."
Claims (1)
の凹所内にリードレスの電子部品を剥離可能に粘
着材で保持し、その電子部品の樹脂フイルムから
露出する表面部分に基板圧着用の接着剤を備え、
更に電子部品の各電極近傍で樹脂フイルムの鍔平
面に電極固着用の半田チツプを剥離可能に粘着材
で保持してなることを特徴とするリードレス電子
部品ユニツト。 (2) 上記樹脂フイルム並びに粘着材が、熱可塑
性のものでなるところの実用新案登録請求の範囲
第１項記載の電子部品ユニツト。 (3) 上記接着剤が、熱硬化性のものでなるとこ
ろの実用新案登録請求の範囲第１項記載の電子部
品ユニツト。[Scope of Claim for Utility Model Registration] (1) A leadless electronic component is removably held in a recess of a resin film formed into a roughly hat-shaped cross section with an adhesive material, and the surface of the electronic component exposed from the resin film Equipped with adhesive for board crimping,
A leadless electronic component unit further comprising a solder chip for fixing the electrodes on the flange plane of the resin film near each electrode of the electronic component, and is releasably held with an adhesive material. (2) The electronic component unit according to claim 1, wherein the resin film and the adhesive material are thermoplastic. (3) The electronic component unit according to claim 1, wherein the adhesive is thermosetting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9442486U JPS631318U (en) | 1986-06-19 | 1986-06-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9442486U JPS631318U (en) | 1986-06-19 | 1986-06-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS631318U true JPS631318U (en) | 1988-01-07 |
Family
ID=30957871
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9442486U Pending JPS631318U (en) | 1986-06-19 | 1986-06-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS631318U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10999936B2 (en) | 2018-09-07 | 2021-05-04 | Lumileds Llc | Method for applying electronic components |
-
1986
- 1986-06-19 JP JP9442486U patent/JPS631318U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10999936B2 (en) | 2018-09-07 | 2021-05-04 | Lumileds Llc | Method for applying electronic components |
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