JPS6011439U - Chip type multilayer capacitor - Google Patents
Chip type multilayer capacitorInfo
- Publication number
- JPS6011439U JPS6011439U JP10210683U JP10210683U JPS6011439U JP S6011439 U JPS6011439 U JP S6011439U JP 10210683 U JP10210683 U JP 10210683U JP 10210683 U JP10210683 U JP 10210683U JP S6011439 U JPS6011439 U JP S6011439U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- multilayer capacitor
- type multilayer
- chip type
- adhesive tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は来者実弟１の実施例の製造工程中のチップコン
デンサの正面図。第２図は来者実弟１の実施例の完成品
の正面図。第３図は来者実弟２の実施例の完成品の正面
図。
図中の符号、１・・・・・・コンデンサ本体、１ａ・・
・・・・（コンデンサ本体に設けた）外部電極、２・・
・・・・（熱硬化性の）粘着テープ。FIG. 1 is a front view of a chip capacitor in the manufacturing process of an embodiment of visitor's younger brother 1. FIG. 2 is a front view of the completed product of the embodiment of the visitor's younger brother 1. FIG. 3 is a front view of the completed product of the second embodiment of the visitor's younger brother. Symbols in the diagram: 1...Capacitor body, 1a...
...External electrode (provided on the capacitor body), 2...
...(thermosetting) adhesive tape.
Claims (1)
部に熱硬化性樹脂からなる粘着テープを付着し、該粘着
テープを介して複数個のチップコンデンサを組合せ積層
接続したことを特徴とするチップ形積層コンデンサ。 −（２）前記チップコンデンサをあらかじめ一定の静電
容量帯域別に区分けし、特定の静電容量帯のチップコン
デンサを複数個組合せ接続したことを特徴とする実用新
案登録請求の範囲第１項記載のチップ形積層コンデンサ
。(1) An adhesive tape made of thermosetting resin is attached to a part of the surface of the chip-type capacitor except for the external electrode surface, and a plurality of chip capacitors are combined and connected in a layered manner through the adhesive tape. Chip type multilayer capacitor. -(2) The utility model registration claim 1, characterized in that the chip capacitors are divided in advance into predetermined capacitance bands, and a plurality of chip capacitors of specific capacitance bands are connected in combination. Chip type multilayer capacitor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10210683U JPS6011439U (en) | 1983-07-01 | 1983-07-01 | Chip type multilayer capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10210683U JPS6011439U (en) | 1983-07-01 | 1983-07-01 | Chip type multilayer capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6011439U true JPS6011439U (en) | 1985-01-25 |
Family
ID=30240831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10210683U Pending JPS6011439U (en) | 1983-07-01 | 1983-07-01 | Chip type multilayer capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6011439U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03272122A (en) * | 1990-03-22 | 1991-12-03 | Mitsubishi Materials Corp | Compound ceramic capacitor |
| JPH0518021U (en) * | 1991-08-08 | 1993-03-05 | 株式会社ピーエフユー | Capacitor array |
| JP2002203709A (en) * | 2000-12-28 | 2002-07-19 | Matsushita Electric Ind Co Ltd | Composite electronic part manufacturing method and device |
-
1983
- 1983-07-01 JP JP10210683U patent/JPS6011439U/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03272122A (en) * | 1990-03-22 | 1991-12-03 | Mitsubishi Materials Corp | Compound ceramic capacitor |
| JPH0518021U (en) * | 1991-08-08 | 1993-03-05 | 株式会社ピーエフユー | Capacitor array |
| JP2002203709A (en) * | 2000-12-28 | 2002-07-19 | Matsushita Electric Ind Co Ltd | Composite electronic part manufacturing method and device |
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