JPS63124752U - - Google Patents
Info
- Publication number
- JPS63124752U JPS63124752U JP1672687U JP1672687U JPS63124752U JP S63124752 U JPS63124752 U JP S63124752U JP 1672687 U JP1672687 U JP 1672687U JP 1672687 U JP1672687 U JP 1672687U JP S63124752 U JPS63124752 U JP S63124752U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- width
- power transistor
- heatsink
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims 1
- 239000004519 grease Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第1図は本考案の第一の実施例を示す放熱器の
斜視図、第2図は第1図に示す放熱器の断面図、
第3図は本考案の第二の実施例を示す放熱器の斜
視図である。
1…プリント板、2…パワートランジスタ、3
…リード線、4…絶縁板部、5…放熱器、6…放
熱板部、7…保持部、8…配線パターン、9…シ
リコングリース、10…端子、11…はんだ。
FIG. 1 is a perspective view of a radiator showing a first embodiment of the present invention, FIG. 2 is a sectional view of the radiator shown in FIG. 1,
FIG. 3 is a perspective view of a heat sink showing a second embodiment of the present invention. 1...Printed board, 2...Power transistor, 3
...Lead wire, 4...Insulating plate part, 5... Heat sink, 6... Heat sink part, 7... Holding part, 8... Wiring pattern, 9... Silicone grease, 10... Terminal, 11... Solder.
Claims (1)
熱する放熱器において、熱伝導性の良好な金属の
薄板からなる放熱板部と、その一端を折り返して
前記パワートランジスタの絶縁板部に装着しうる
ばね形状の保持部とを有することを特徴とする放
熱器。 2 放熱板部の幅を、複数のパワートランジスタ
を取付ける幅としている実用新案登録請求の範囲
第1項記載の放熱器。[Claims for Utility Model Registration] 1. A heat sink for dissipating heat generated by a power transistor to the outside, including a heat sink portion made of a thin metal plate with good thermal conductivity, and one end of which is folded back to insulate the power transistor. A radiator characterized by having a spring-shaped holding part that can be attached to a plate part. 2. The heatsink according to claim 1, wherein the width of the heatsink plate portion is a width for attaching a plurality of power transistors.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1672687U JPS63124752U (en) | 1987-02-06 | 1987-02-06 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1672687U JPS63124752U (en) | 1987-02-06 | 1987-02-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63124752U true JPS63124752U (en) | 1988-08-15 |
Family
ID=30808845
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1672687U Pending JPS63124752U (en) | 1987-02-06 | 1987-02-06 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63124752U (en) |
-
1987
- 1987-02-06 JP JP1672687U patent/JPS63124752U/ja active Pending
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