JPS63122128A - Bonding apparatus - Google Patents

Abstract

PURPOSE:To be able to automatically select bulky materials to be bonded and placed dispersively and to automate a bonding apparatus without regularly disposing the materials by providing a visual unit for detecting the distribution of material group to be bonded on a supply stage. CONSTITUTION:When the distributed image of a pellet 1 group on a placing plate 6 is input from a first camera 9 to a controller 19, the controller 19 suitably selects a normal pellet 1 on the basis of the image, controls to move an XY table 4 in X and Y directions, thereby aligning the pellet 1 on an optical axis of a second camera 10. Then, the pattern 1a of the pellet 1 is photographed by the camera 10, and its image is input to the controller 19. The controller 19 prealigns the XY positions of the pattern 1a. Then, the pellet 1 in which a collet 16 is selected is held by suction to be moved on a stem 1 in which a bonding stage 20 is positioned to bond the pellet 1 to the stem 2.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to bonding technology, particularly its automation technology, for example, in the production of infrared light emitting diodes.
This invention relates to an effective technique for bonding hemispherical dome-shaped pellets to stems.

[Conventional technology]

In the production of infrared light-emitting diodes, this device is used to bond hemispherical dome-shaped pellets to stems.While observing a television monitor, workers operate a collet that attracts and transfers pellets to bond them onto stems. There are some that are configured like this.

An example of the pellet bonding technology described is ``Introduction to Automatic Assembly of Electronic Components,'' published by Nikkan Kogyo Shimbun, July 30, 1980, pages 69 to 76.

[Means for solving problems]

However, the inventor of the present invention has revealed that in such a bonding device, there is a problem in that productivity is low because operations such as suction holding, transfer, alignment, and bonding are all performed manually. Ta.

An object of the present invention is to provide a bonding technique that can facilitate automation.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Problem that the invention seeks to solve]

A brief overview of typical inventions disclosed in this application is as follows.

That is, a first visual device detects the distribution of one group of objects to be bonded on the supply stage, a bonding stage on which the other object to be bonded is positioned, and a first visual device that detects the distribution of one group of objects to be bonded on the supply stage; A holder for bonding to an object, a second visual device that recognizes the object to be bonded held by the holder, a third visual device that recognizes the object to be bonded on the bonding stage, and a third visual device that recognizes the object to be bonded on the bonding stage. A controller for controlling the holder is provided, the object to be bonded is selected and held by the holder based on the distribution image of the first visual device, and is held so that the images by the second and third visual devices are aligned with each other. The bonding device is configured to perform bonding by controlling the tool.

[Effect]

According to the above-described means, even when a group of objects to be bonded is supplied to the supply stage in bulk, the distribution of the objects to be bonded can be perceived by the first visual device, so that the controller can detect one object to be bonded. The destination can be automatically selected and held by the collet. Therefore, the bonding apparatus can be fully automated without having to regularly arrange the objects to be bonded one by one in advance.

〔Example〕

Fig. 1 is a schematic front view showing a bonding device which is an embodiment of the present invention, Fig. 2 is a schematic plan view thereof, Fig. 3 is an exploded perspective view showing an infrared light emitting diode, and Fig. 4 is an assembled same. FIG.

In the present embodiment, the bonding apparatus is used in manufacturing an infrared light emitting diode, in which a hemispherical dome-shaped bullet 1 as one object to be bonded is placed on a stem 2 as the other object to be bonded, and a pattern is formed on the half surface thereof. The stage 3 for supplying the pellets 1 and the stage 20 for bonding the pellets 1 onto the stem 2 are placed at positions apart from each other (hereinafter referred to as left and right). ) are equipped respectively.

The supply stage 3 is equipped with an XY table 4,
The XY table 4 is configured to move a support 5 fixed to the upper surface so as to protrude to the right in the left-right (X) and front-back (Y) directions, and to vibrate slightly in the left-right direction. There is. A pellet mounting plate 6 is held horizontally on the receiver 5, and the pellet mounting plate 6 is constructed by fitting a glass plate 8 into a square frame 7.

Directly above the pellet mounting plate 6, a first television camera (hereinafter referred to as a camera) 9 as a visual device for detecting the pellet distribution condition was placed on the pellet mounting plate 6 to photograph the entire upper surface thereof. It is equipped to detect the arrangement of one group of pellets. Further, a second camera 10 as a visual device for recognizing the pellet pattern is arranged directly below the pellet mounting plate 6 so that its optical axis can be aligned with the first camera 9. The camera 10 is configured to be able to see through the glass plate 8 and recognize the pattern 1a on the pellet 1 on the mounting plate 6 facing on its optical axis. Further, an illumination device 18 is arranged around the second camera 10, and this illumination device 18 can illuminate the entire group of pellets on the mounting plate 6 through the glass plate 8, and
It is configured so that the pattern 1a of the pellet 1 located on the optical axis of the second camera 10 can be brightly illuminated.

A stem feeder 11 is installed on the bonding stage 20, and the feeder 11 is configured to run while straddling the stem 2 and to be positioned using a positioning pin 12. A third camera 13 is installed directly above the bonding stage 20 so as to face downward, and the third camera 13 is configured to be able to recognize the pattern 2a of the stem 2 positioned on the feeder 11. An illumination device 13A is installed around the third camera 13 so as to illuminate the stem 2.

There is an XY table 14 on the right side of the bonding stage 20.
The XY table 14 is configured to move an arm 15 provided on the top surface of the XY table 14 so as to protrude leftward in the XY direction. A collet 16 as a holder for sucking and holding the pellet 1 is installed downward at the tip of the arm 15, and the collet 16 is configured to be raised, lowered and rotated by a drive device 17 consisting of a servo motor or the like. ing.

The first, second, and third cameras 9, 10, and 13 are connected to a controller 19 consisting of an image processing device, a computer, etc.
The controller 19 is configured to control the XY tables 4 and 14, the collet drive device 17, etc. based on images from each camera.

Next, the effect will be explained.

When a large number of pellets 1 as objects to be bonded are placed on the glass plate B, the XY table 4 causes the pellet placement plate 6 to slightly vibrate left and right (or in the front-back direction). Due to this microvibration, a group of pellets placed separately on the glass plate 8 are aligned so that the half surface on which the pattern 1a is formed faces downward.

The first camera 9 photographs the distribution of the first group of pellets arranged downward on the mounting plate 6 over the entire mounting plate 6. When the distribution image of this group of pellets 1 is input from the first camera 9 to the controller 19, the controller 19 appropriately selects normal pellets 1 based on this image and controls the movement of the XY table 4 in the XY directions. The pellet 1 is aligned on the optical axis of the second camera 10.

When the pellet 1 is aligned with the optical axis, the pattern 1a of the pellet 1 is photographed by the second camera 10, and the image is input to the controller 19. Controller 19 is XY
By operating the table 14, the collet 16 is moved onto the optical axis of the second camera 10, and the XY tables 4 and 14 are moved based on the image from the second camera 10.
By operating collet 1, which is set in advance.
The XY position of the pellet pattern 1a with respect to the reference line No. 6 is pre-aligned. Subsequently, the collet 16 is lowered by the drive device 17, and the selected pellet 1 is attracted and held on its hemispherical side.

After holding by suction, the collet 16 is aW! , is slightly raised vertically above the plate 6 along the optical axis.

After ascending, the pellet 1 held by the collet 16 is transmitted through the glass plate 8 by the second camera 10 and formed into a pattern 1a.
is titted again, and the image is input to the controller 19. At this time, the pattern 1a of the pellet is effectively spot-illuminated by the illumination device 18. The controller 19 controls pellet pattern 1 during this adsorption/holding.
By operating the XY table 14 and the drive device 17 based on the image for a, the position of the pellet pattern 1a in the XY and θ directions during suction and holding can be determined by the collet pattern 2a captured by the third camera 13 (to be described later).
Perform fine alignment.

On the other hand, the stem 2 of the diode is supplied to the bonding stage 10 by the feeder 11, and the stem 2 that is positioned mechanically by the bin 12 has its pattern 2a photographed by the third camera 13. The image signal is transmitted to the controller 19.

The controller 19 compares the pattern 2a of the stem 2 captured by the third camera 13 with the pellet pattern la captured by the second camera 10, and fine-aligns the pellet pattern 1a with the stem-side pattern 2a by moving the collet 16 as described above. let That is, the collet 16 holding the pellet 1 by suction is placed on the XY table 14.
The position in the XY direction is corrected by collet drive device 1.
7, the orientation in the θ direction is corrected. At this time, since prealignment is performed in the supply stage 3, the fine alignment time is shortened.

When the mutual image alignment is completed, pellet 1
The collet 16 holding the collet 16 by suction is moved in parallel to right above the stem 2 positioned on the bonding stage 20 by the right movement of the arm 15 by the XY table 14.

Subsequently, the collet 16 is lowered to bond the pellet 1 onto the stem 2. At this time, both patterns 1a
and 2a have undergone fine alignment between the images, so they will be properly aligned.

After bonding, the collet 16 is released from adsorbing and holding the pellet 1 and is returned to the optical axis position of the second camera 10 on the supply stage 3.

Thereafter, by repeating the above operations, the pellets are properly aligned with the stem and sequentially bonded.

According to the embodiment described above, the following effects can be obtained.

(By installing a visual device on the supply stage 11 to detect the distribution of the group of objects to be bonded, it is possible to automatically select the objects to be bonded that are placed separately to one (IIll). The bonding equipment can be fully automated without regular arrangement.

(2) By providing the supply stage with a visual device for detecting the distribution of the group of objects to be bonded and a visual device for recognizing the objects to be bonded on the supply stage, it is possible to perform pre-alignment while selecting the objects to be bonded. Therefore, fine alignment between the object to be bonded and the substrate can be simplified.

(3) A controller that is provided with a visual device that recognizes the object to be bonded held in the holder and a visual device that recognizes the substrate of the bonding stage, and that controls the holder so that images from both visual devices are aligned with each other. By providing this, the objects to be bonded can be automatically aligned with each other, so that the bonding apparatus can be fully automated.

(4) Automation can save labor, shorten work time, equalize quality, and improve reliability.

Although the invention made by the present inventor has been specifically explained based on Examples above, the present invention is not limited to the Examples (although it is possible to make various changes without departing from the gist of the invention). Not even.

For example, the visual device that recognizes the object to be bonded held by the holder is not limited to being placed on the supply stage, but may be placed elsewhere.

The lighting device corresponding to the visual device for detecting the distribution of the group of objects to be bonded and the lighting device corresponding to the visual device for recognizing the bonding object held by the holder may be configured separately.

The means for aligning the bonding surfaces of the pellets on the supply stage, the structure for moving a holder such as a collet, the structure of the pellet supply stage, the stem feeder, etc. are not limited to the above embodiments.

In the above description, the invention made by the present inventor was mainly applied to a bonding device for bonding pellets to a stem in the field of application of infrared light emitting diodes, which is the background of the invention, but the invention is limited thereto. Not a laser diode,
It can be used in electronic devices such as transistors, semiconductor integrated circuit devices, etc., especially those in which pellets are bonded onto a substrate.

〔Effect of the invention〕

A brief explanation of the effects obtained by typical inventions disclosed in this application is as follows.

By installing a visual device on the supply stage to detect the distribution of the group of objects to be bonded, it is possible to automatically select one object to be bonded that has been placed separately. The bonding equipment can be fully automated without any arrangement.

[Brief explanation of the drawing]

Fig. 1 is a schematic front view showing a bonding device which is an embodiment of the present invention, Fig. 2 is a schematic plan view thereof, Fig. 3 is an exploded perspective view showing an infrared light emitting diode, and Fig. 4 is an assembled same. FIG. 1... Pellet (object to be bonded), 2. -...
Stem (object to be bonded), 3... supply stage,
4... XY table, 5... Receiver, 6... Pellet placement plate, 7... Frame, 8... Glass plate, 9...
1st television camera (visual device for detecting distribution of objects to be bonded), 10... 2nd television camera (visual device for pellet pattern), 11... stem feeder, 12...
Positioning pin, 14... 19...Controller. Figure 1/Q-Funito Figure 2

Claims (1)

[Claims] 1. A first visual device that detects the distribution of one group of objects to be bonded on a supply stage, a bonding stage where the other object to be bonded is positioned, and a bonding stage that holds the object to be bonded on the supply stage. a holder for bonding to an object to be bonded on a bonding stage;
a second visual device that recognizes an object to be bonded held on a holder; a third visual device that recognizes an object to be bonded on a bonding stage; and a controller that controls the holder based on images from each visual device. The holder selects and holds the object to be bonded one by one based on the distribution image of the first visual device, and controls the holder so that the images by the second and third visual devices are aligned with each other. A bonding device configured to perform bonding. 2. The bonding apparatus according to claim 1, wherein the second visual device is disposed on the supply stage so that its optical axis coincides with that of the first visual device.