JPS63121748A - Ultrasonic flaw detector - Google Patents

Abstract

PURPOSE:To clarify the relation of the whole shape of parts or materials to flaws or defects by measuring respective distance relations of receiving signals for a surface echo, a flaw echo and a bottom echo, finding out the end face state of an object such as a surface and a bottom and displaying it. CONSTITUTION:A square-shaped object 2 is C-scanned by a probe 3 and a flaw echo detecting signal F is obtained by an arithmetic processor 10 through a pulser receiver 5, a gate circuit 7 and an A/D converter 8. A C-scope image corresponding to the C-mode is obtained and the plane outline image of the object 2 and the video of a defect are simultaneously displayed on a display 13. Then B-scanning is executed, receiving data are received by the processor 10 through the pulser receiver 5 and a waveform memory device 9 and arithmetically processed, face state information and bottom state information are formed and a B-scope image is displayed on the display 13 together with the defect image.

Description

[Detailed Description of the Invention] [Industrial Application Field] This invention relates to an ultrasonic flaw detection device, and more specifically,
When performing various inspections of electronic components such as semiconductors using ultrasonic waves, including defect detection of materials such as ceramics, composite materials, and other new materials, we inspect the specimen for scratches and defects. This invention relates to an ultrasonic flaw detection device that can be clearly grasped by the form including the external shape.

[Prior Art] Ultrasonic flaw detection equipment is capable of inspecting defects in materials such as ceramics and composite materials, electronic components, etc., as well as performing various treatments such as mutual comparison, heat treatment, tension, compression, pressurization, and depressurization. It is used for various tests on materials and electronic components, such as condition inspection after testing.

This type of ultrasonic flaw detection equipment is equipped with an XYZ scanning device that scans the object within the x, y, and z coordinates,
A predetermined inspection is performed by C-scanning changes in the state of a subject such as an electronic component, obtaining a C-scope image, and observing or processing the obtained image.

In such an inspection, the inspection part as the object to be inspected,
There is a demand for understanding the condition of materials and defects in the vertical cross-sectional direction, and some ultrasonic flaw detection devices equipped with a C-scan function perform a C-scan, output an image, and display a cursor on the display. After setting the position using the cursor, there are some models that allow B-scan within the set range.

In this case, the B scope image is created by simply receiving the ultrasonic waves transmitted from the probe and reflected from the surface, defects, and bottom of the object, and converting the received echo signals into image information. It is displayed on the screen as "-".

[Problems to be solved] However, when inspecting materials and electronic components, it is important to check not only the location of defects and the state of scratches, but also the surface of the material parts and the overall appearance of the bottom surface. It is necessary to understand the defect position, condition, relationship between scratches, etc. from the relationship with the physical shape.

In order to meet such demands, in the above-mentioned scope image, even if the cross-sectional form of the part is displayed on the screen, this only shows the relative state of defects etc. in the vertical cross-sectional direction. Therefore, it is difficult to grasp the overall relationship to defects and scratches seen from the external shape of the object. Especially when the surface of the object to be examined or the bottom surface is sloped,
If the specimen is placed at an angle, or if there are steps on the surface, it is necessary to know the relationship between the surface or bottom of the specimen and any defects or scratches. In some cases, as mentioned above, with a simple scope image that receives and displays surface echoes, defect echoes, and bottom echoes individually, the actual situation such as a flaw seen from the entire subject is unclear. .

[Purpose of the Invention] The present invention is intended to solve these problems, and to clarify the relationship between the entire object to be inspected, such as materials and electronic components, and scratches and defects, including its external shape. It is an object of the present invention to provide an ultrasonic flaw detection device that can display a B-scope image in an easy-to-understand state.

[Means for Solving the Problems] The means in the ultrasonic flaw detection apparatus of the present invention for achieving such an object is to detect the position of the received signal of the defect echo obtained by B-scan and the position of the received signal of the surface echo, or The position of the received signal of the bottom echo and the position of the received signal of the defective echo are measured, and the position of the received signal of each surface echo or bottom echo is line-combined to obtain the state information of the end face, and the state information of this end face and the position of the received signal of the defective echo are measured. Based on this information, a B-scope image including the condition of the end face is displayed.

[Operation] In this way, the respective distance relationships are measured for the individual surface echo reception signals, defect echo reception signals, and bottom echo reception signals, and the end surface such as the actual surface condition or bottom surface condition of the object is measured. Since the condition is obtained, defects and scratches can be displayed including the end surface condition.

Therefore, it is possible to clearly understand the relationship between the end face such as the actual surface or bottom state of the object and defects, scratches, etc., especially when the end face is displayed or there is a step on the object due to the nature of ultrasonic waves. This step part can also be displayed.

As a result, even when the object to be inspected is tilted or has a step, defects and scratches can be identified, including these defects, and the relationship between defects and other defects seen from the overall shape of the part or material becomes clear. Efficient inspection becomes possible.

[Example] Hereinafter, an example of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a flowchart of image processing for inspecting nine parts of materials to which the present invention is applied, and FIG.
FIG. 3 is a block diagram of an ultrasonic flaw detection apparatus to which the present invention is applied, which has an A-scope image display function and a B-scope image processing function in addition to a C-scope image processing function for inspecting one part of a material, etc. An explanatory diagram of the general ultrasonic flaw detection method,
Fig. 4 is an explanatory diagram of the A scope image, Fig. 5 is an explanatory diagram of the C scan, Fig. 6 is an explanatory diagram of the C mode processing of the received echo signal, and Fig. 7 is an explanatory diagram of the C scope image. FIG. 8 is an explanatory diagram of an example of the display screen, FIG. 8 is an explanatory diagram when setting the B-scan position, FIG. 9 is an explanatory diagram of the B-scan state, and FIG. 10 is an explanatory diagram of the display screen. .

In FIG. 2, 20 is an ultrasonic flaw detector,
It consists of a YZ scanning device 1 and an image processing device 16. XYz
The scanning device 1 has an XYz-axis scanning device 1a, and each of the X, Y, and Z axes is driven according to a control signal from the image processing device 16.

Note that the X, Y, and Z axes correspond to the axes in the three-dimensional coordinate system of x, y, and z, and are reference axes for linear movement of the probe 3.

A water tank 4 is disposed below the XYZ-axis scanning device 1a, and the water tank 4 is filled with a medium 4a (for example, water), and the object 2 (for example, a ceramic material or an electronic component) is placed in this medium. 4a, and the attachment is in member 4b.
It is attached in the aquarium 4 via.

- On the other hand, the probe 3 is fixed to the Z-axis scanning section 21 of the XYZ-axis scanning device 1a, this Z-axis scanning section 21 is supported by the X- and Y-axis scanning sections 22, and the probe 3 is fixed to the X-axis scanning section 21.

It is movable in the Y and Z directions.

The image processing device 16 includes a pulser receiver 5 connected to the probe 3 that sends a transmission pulse signal to the probe 3 and receives a reception signal of an ultrasonic echo from the pulse signal, and a pulser receiver 5 that amplifies or An oscilloscope 6 that monitors the received echo signal by providing a gate on the attenuated received echo signal and obtaining an analog output that matches the intensity of the received ultrasonic echo within the gate;
a gate circuit 7 for selecting a specific received echo signal by providing a gate for the received echo signal from the gate; and an arithmetic processing unit 10 for converting the received echo signal (analog output signal) selected by the gate circuit 7 into a digital signal. A to send to
/D converter 8 and a waveform memory that receives the received echo signal from the pulser receiver 5, digitizes this analog waveform in time series, temporarily stores it, and sequentially sends the digitized received echo signal to the arithmetic storage device 10. It includes a device 9, an arithmetic processing device 10, and the like.

Here, the arithmetic processing device 10 is a microprocessor 10
a and a memory 10b, and the memory tab has the following information:
A B-scan control program 23a that performs B-scan control on each axis of the XYZ scanning device 1, a C-scan control program 23b that performs C-scan control on each axis, and the time between these signals from the data of the transmitted pulse signal and each received echo signal. A time measurement program 23c for calculating intervals, a time table creation program for received echo signals 23d1, a surface and bottom state information generation program 23e1, digital received echo signals from the A/D converter 8, and XYZ of the XYZ scanning device 1 of the probe 3. Coordinate values in a coordinate system, etc. are stored. Furthermore, flaw detection data and image processing data input from the keyboard 11 are also stored in the memory 10b.

On the other hand, the microprocessor 10a performs predetermined arithmetic processing based on these data stored in the memory 10b and various processing programs, and generates image data in C mode (C scope image) corresponding to the flaw detection results. , sends position control data to the motor controller 15 to perform position control in two directions, X and Y. Further, the microprocessor 10a sends various data inputted from the keyboard 11 and data of the current control state to the CRT display 14, and performs display processing such as a flaw detection table inputted from the keyboard 11.

The keyboard 11 is used to input selective settings of A mode, B mode, and C mode, image processing data, data such as scanning range, etc., and the microprocessor 10a receives these data and writes a memo U10b. Store these data in . The image person output device 12 is the arithmetic processing device 1
The data transmitted from 0 is stored as image data, and the data is sent to the display 13 as a B scope image or C scope image to be displayed. In addition, the cursor position on the display screen is determined and calculations are performed. The data is transferred to the processing device 10.

The motor controller 15 controls the XYZ scanning device 1 according to the position control data from the arithmetic processing unit 10, and sends drive signals for moving the probe 3 by a predetermined amount along each of the XYZ axes to scan the XYZ axes. It is supplied to each axis of the device 1a.

Next, a description will be given of the important processing of the arithmetic processing unit 10, which is creation of a time table of received echo signals in B mode and generation of end face state information such as front and bottom state information.

As shown in Figure 3, the ultrasonic waves transmitted from the probe 3 are reflected on the surface of the object 2 to form a surface echo (B wave), a defect echo (F wave) reflected from the defect, and a defect echo reflected from the bottom surface. A bottom echo (B wave) shown in Fig. 4 is obtained.
The scope waveform is displayed on the oscilloscope 6. Here, the symbol S is a received echo signal corresponding to the B wave which is a surface echo, the symbol F is a received echo signal corresponding to the F wave which is a defective echo, and the symbol Bs is a received echo signal corresponding to the B wave which is a bottom echo. is the corresponding received echo signal. Further, T corresponds to the transmission pulse signal.

Such an A-scope waveform is simultaneously sent to the waveform storage device 9 from the pulser receiver 5 and stored in the waveform storage device 9.
is stored in a digitized state according to its chronological order. Here, when the arithmetic processing device 10 is set to the B mode state, the arithmetic storage device 10 starts the B scan control program 23a, and
The waveform storage device 9 is activated in accordance with the activation of step a, and the following programs are activated in accordance with a predetermined sequence: a time measurement program 23c, a received echo signal time table creation program 23d1, and a front and bottom state information generation program 23e. .

Now, when the B scan control program 23a is started and the arithmetic processing unit 10 is set to the B mode state, the arithmetic storage device 10 moves the probe 3 to the subject 2 as shown in FIG. The control shifts to B-scan control. In addition, in the figure, Fl and F2 are defects to be detected. Then, the digital signal of the received echo signal corresponding to the above-mentioned FIG. Time L s 1 and time L from received echo signal S to received echo signal F of defective echo
The time measurement program 23c calculates the time Lb from the received echo signal S of the f1 surface echo to the received echo signal Bs of the bottom echo for each flaw detection pitch of the B scan.
This is done sequentially.

On the other hand, each time data obtained for each flaw detection pitch by the time measurement program 23c is processed by the received echo signal time table creation program 23d each time.
Corresponding to each flaw detection pitch 1 to n, the time Ls until the received echo signal S, the time Lf1 until the received echo signal F1, the time Lb until the received echo signal Bs, and the first
A matrix table is created by storing the information in each column of the time table 24 as shown in FIG.

This time table 24 is referred to by the top and bottom surface condition information generation program 23e at the same time as the B scan or after the B scan, and the time data is converted into distance data, and the distance of each flaw detection pitch is Corresponding to this, the positions of the received signals of the respective surface echoes are line-combined to generate surface state information indicating the outer shape of the surface. Furthermore, the positions of the received signals of the respective bottom echoes are similarly line-combined to generate bottom surface state information indicating the outer shape of the bottom surface, and display information is generated based on this end surface information.

Furthermore, in the B-scan information display process, for the first and last flaw detection points where the received echo signal S of the surface echo and the received echo signal Bs of the bottom echo were calculated, the received echo signal S of the surface echo and the received echo signal Bs of the bottom echo are calculated, respectively. Connect the received echo signals Bs with a line and perform arithmetic processing so that they intersect with the surface condition information and bottom shape width information, respectively,
Information about the external shape of the side surface of the subject is generated, and thereby the external shape of the subject 2 is formed. Then, based on the surface condition information, the bottom surface condition information, the position information of defects, flaws, etc., and the information indicating the shape of the side surface, the flaw detection information including the cross-sectional outline G of the object is displayed as shown in FIG. 13-L.

In addition, as shown in FIG. 10, the defects between the respective flaw detection pitches are also subjected to arithmetic processing so that defect 1, defect 2, . Display. By doing this, in the B scope image, it becomes possible to display one end surface due to the ultrasonic properties and to display the stepped portion when there is a step in the object 2. Note that 27 is the cross-sectional outline of the subject 2.

Next, the overall processing method of the ultrasonic flaw detection apparatus 20 will be explained with reference to FIG. 1, focusing on the operation of the arithmetic processing unit 10.

Now, as shown in FIG. 5, if the object 2 is a square-shaped material or electronic component when viewed from its plane, first, in step (2), enter a specific function key on the keyboard 11 to enter the C mode. Set the operation. Next, in Step 3, the processing unit 10 starts the C-scan control program 23b and performs a C-scan with the probe 3 on the subject 2 at a certain scanning pitch as shown in FIG. , gate, pulser receiver 5. Gate circuit 7
．． Via the A/D converter 8, a received defect echo signal F shown in FIG. 6 is obtained corresponding to the C scan at each flaw detection pitch. Then, a C scope image corresponding to the C mode is obtained, and an image as shown in FIG. 7 is displayed on the display 13.
The image is displayed as a C-scope image. In FIG. 7, 25 indicates an image of the defect, and 26 indicates the image of the object 2.
This is an external image seen from the plane.

In the next step (2), a specific function key for setting the B mode is input from the keyboard 11.

Then, as shown in FIG. 8, the cursor K displayed on the display 13 is set at the position where the B-scan is to be performed in step (2), and the B-scan process is started by inputting a predetermined B-scan start key from the keyboard 12. do.

As a result, the B-scan control program 23a is started by the arithmetic processing unit 10, and control is performed to move the probe 3 to the set cursor-corresponding position, and the B-scan control program 23a is executed to display the cross-sectional image corresponding to the cursor position. is started. At this time, the waveform storage device 9 is activated, and the arithmetic processing device 10 receives data corresponding to the digitized received echo signal shown in FIG. 4 via the pulser/receiver 5 and the waveform storage device 9.

In the next step (2), the processing unit 10 calculates the time Ls until the received echo signal S of the surface echo corresponding to each pitch 1 to n for each flaw detection pitch of the B scan, and the received echo signal for each defect. The time Lf1 until the signal F1 and the time Lb until the received echo signal Bs are sequentially stored in the memory 10b,
A time table 24 of received echo signals is created.

Then, in step (2), arithmetic processing is performed to connect the surface and bottom surface between each flaw detection pitch with a line to generate surface condition information and bottom surface condition information, and furthermore, the received echo signal S of the surface echo and the bottom surface The side profile is generated from the information on the first and last flaw detection points for which the received echo signal Bs of the echo was calculated, and calculation processing is performed so that the received echo signal S of the surface echo and the received echo signal Bs of the bottom echo intersect with a line. The display information is added to the B scope image data and transferred to the image input/output device 12. and display 13
Display this B scope image above.

In addition to the above-mentioned status information, as explained earlier, among the defects 1, 2, . You can do it like this.

As explained above, in the embodiment, information on the external shape of the object is obtained by linearly connecting each surface in B mode, and displayed along with defects and scratches.
Since time is measured and distance is measured based on the transmitted pulse signal, the reference position is usually determined by the Z-direction position of the probe. However, such a reference position may be based on the position of a certain surface echo in the B scan. In particular, the position of the first surface echo at the start of the B-scan may be fixed to a specific value and calculated using the positions of other surface echoes as a reference.

In addition, in the embodiment, the distance is calculated by creating a time table of received echo signals, but it is also possible to directly create a table regarding the distance of each received echo signal.
Further, without creating such a table, the outline information obtained by linearly connecting the front surface and the bottom surface may be directly calculated.

In the embodiment, surface condition information and bottom surface condition information are obtained based on the received signal of the surface echo and the received signal of the bottom surface echo. In some cases, echoes correspond to both sides of the subject, and such status information may be so-called status information of end faces.

[Effects of the Invention] As can be understood from the above description, in the present invention, the position of the received signal of the defect echo obtained by B-scan, the position of the received signal of the surface echo, or the position of the received signal of the bottom echo is Measure and line-combine the positions of the received signals of each surface echo or bottom echo to obtain end face condition information,
Since the B scope image including the end face condition is displayed based on the end face state information and the position information of the received signal of the defect echo, the B scope image including the end face state is displayed.
Can show scratches.

Therefore, it is possible to clearly understand the relationship between the end face such as the actual surface or bottom state of the object and defects, scratches, etc., especially when the property of ultrasonic wave 1 shows the end face and there is a step in the object. Furthermore, it is also possible to display this stepped portion.

As a result, even when the object to be inspected is tilted or has a step, defects and scratches can be identified, including these defects, and the relationship between defects and other defects seen from the overall shape of the part or material becomes clear. Efficient inspection becomes possible.

[Brief explanation of the drawing]

Fig. 1 is a flowchart of image processing for inspecting one material part etc. to which this invention is applied, and Fig. 2 is a flowchart of the C-scope image processing function for inspecting nine material parts etc. to which this invention is applied. A block diagram of an ultrasonic flaw detection device having an A scope image display function and a B scope image processing function,
Fig. 3 is an explanatory diagram of a general ultrasonic flaw detection method, Fig. 4 is an explanatory diagram of its A scope image, Fig. 5 is an explanatory diagram of C scan, and Fig. 6 is its received echo signal. 7 is an explanatory diagram of an example of the C scope image display screen, FIG. 8 is an explanatory diagram of setting the B scan position, and FIG. 9 is an explanatory diagram of the B scan state. Explanatory diagram, No. 10
The figure is an explanatory diagram of the display screen, and FIG. 11 is an explanatory diagram of a specific example of the time table. ■... XYZ scanning device, 1a... XYZ axis scanning mechanism, 2... Subject, 3...
・Probe, 4... Water tank, 4a... Medium, 5... Pulsar receiver, 6... Oscilloscope, 7... Gate circuit, 8... A/D converter, 9... ...Waveform storage device, 10... Arithmetic processing unit, 11... Keyboard,
12... Image input/output device, 13... Display,
14... CRT display, 15... Motor controller, 16... Image processing device, 20... Ultrasonic flaw detection device,
21... 2-axis scanning section, 22... X and Y-axis scanning section,
24...Time table of each received echo signal.

Claims (3)

[Claims] (1) In an ultrasonic flaw detection device that performs a B-scan and displays a B-scope image, the position of the received signal of the defect echo obtained by the B-scan, the position of the received signal of the surface echo, or the position of the received signal of the bottom echo is determined. and line-combine the positions of the received signals of the respective surface echoes or bottom echoes to obtain end face state information, and determine the end face state based on this end face state information and the position information of the received signal of the defective echo. An ultrasonic flaw detection device characterized by displaying a B-scope image including. (2) As end face position information, obtain surface state information by line-combining the positions of the received signals of each surface echo, and obtain bottom-face state information by line-combining the positions of the received signals of each bottom echo. An ultrasonic flaw detection device according to claim 1, characterized in that: (3) The ultrasonic flaw detection device performs a B scan and a C scan, and displays a C scope image and a B scope image, respectively, and after performing the C scan, performs the B scan at a specified position, The position of the received signal of the surface echo of each flaw detection pitch in the B scan, the position of the received signal of the defect echo, and the position of the received signal of the bottom echo are temporarily stored as time information or position information,
The ultrasonic flaw detection apparatus according to claim 2, wherein surface condition information and bottom surface condition information are obtained based on the stored information.