JP4364031B2 - Ultrasonic flaw detection image processing apparatus and processing method thereof - Google Patents

Description

  The present invention relates to a technique for nondestructive evaluation of an intrinsic defect of a steel material using ultrasonic waves, and in particular, an ultrasonic inspection image for evaluating an intrinsic defect (internal defect) generated in a heat-affected zone that occurs during welding of a steel material. The present invention relates to a processing apparatus and a processing method thereof.

  2. Description of the Related Art Conventionally, an ultrasonic flaw detection apparatus is known as an apparatus for nondestructively evaluating an intrinsic defect that can occur in a welded portion of steel. This ultrasonic flaw detector uses a probe to evaluate an inherent defect in a steel material. When the flaw detection operation is started, the probe generates an ultrasonic wave, and this ultrasonic wave enters the steel material. Further, the probe receives an ultrasonic wave (echo) reflected by a reflection source in the steel material.

  When ultrasonic waves propagate through the steel material, if there are non-uniform portions such as internal defects or back-wave portions (excess) of the welded portion, the ultrasonic waves are reflected using the non-uniform portions as a reflection source. For this reason, the echo received by the probe includes not only the defect echo reflected by the internal defect but also the back wave echo reflected by the back wave part and the like.

  Images of the A scope waveform, B scope, and C scope are created from signals of the echo from the reflection source, the position of the probe, and the incident angle of the ultrasonic wave, and displayed on the screen of the display device of the ultrasonic flaw detector. (For example, see Patent Document 1).

The inspector manually evaluates the internal defects of the steel material while viewing the images of the A scope waveform, the B scope, and the C scope displayed on the screen of the display device of the ultrasonic flaw detector.
Japanese Patent Laid-Open No. 2-311154 (page 2 to page 3, FIG. 1)

  However, a disturbing echo image due to a noise component appears in the images of the B scope and the C scope displayed on the screen of the display device of the conventional ultrasonic flaw detector. Therefore, it is difficult to maintain a constant evaluation of the presence / absence or quality of the penetration failure while looking at the image displayed on the screen of the display device of the conventional ultrasonic flaw detector due to the difference in the analysis level of the inspector. The standardization of the evaluation was not possible.

  Moreover, stress corrosion cracking may be formed in the pipe inner peripheral surface of the heat affected zone in steel materials after construction such as V groove welding and X groove welding. When stress corrosion cracking occurs due to use under stress corrosion conditions, inherent defects occur in the heat-affected zone of the steel material. In the conventional ultrasonic flaw detector, the actual size of the internal defect cannot be measured accurately, and the progress of the internal defect cannot be grasped, so the timing for replacing the steel material cannot be measured.

  The present invention has been made in view of the above-described circumstances, and an object thereof is to provide an ultrasonic flaw detection image processing apparatus and a processing method thereof that can evaluate an intrinsic defect of a steel material without depending on an analysis level of an inspector. To do.

  Another object of the present invention is to provide an ultrasonic flaw detection image processing apparatus and a processing method therefor that can accurately measure the size of the inherent defect and the degree of flaw detection.

In order to solve the above-described problem, an ultrasonic flaw detection image processing apparatus according to the present invention receives an ultrasonic wave from the outer peripheral surface of a steel material tube and generates an echo image corresponding to an echo reflected by a reflection source in the steel material. means for generating an image of a B-scope, including, to calculate the pixel resolution from the image, means for generating a limited area image in said image based on said image resolution, among the echo image appearing on the limited area image the a penetration echo image having a linearity an incident direction substantially perpendicular direction of the ultrasound, and means for identifying each the non-penetration bead echo image substantially parallel with the back wave echo image, the non-back reading means for detecting the echo image pair such that the luminance peak luminance distribution of the wave echo image, the luminance peak coordinates on each echo images forming the echo image pair respectively, the seat of the luminance peak coordinates Means for calculating the actual size of the endogenous defect from the difference between said pixel resolution is provided.

In order to solve the above-described problem, an ultrasonic flaw detection image processing method according to the present invention generates an echo image corresponding to an echo reflected by a reflection source in the steel material based on an ultrasonic wave incident from the outer peripheral surface of the steel material. A pixel resolution of an image of the B scope including the step of calculating a limited area image in the image based on the pixel resolution, and an incident direction of the ultrasonic wave among echo images appearing in the limited area image; and penetration echo image having a linearly resistance substantially perpendicular direction, and a non-penetration bead echo image of the back wave echo image and substantially parallel direction with enough engineering that will be identified, respectively, the luminance of the non-back wave echo image and as factories to echo image pair is discovered that there is a luminance peak in the distribution, each of the luminance peak coordinates on the echo image forming said echo image pair is read, the coordinate difference between the luminance peak coordinates and as calculated Ru Engineering, Having from serial coordinate difference and the pixel resolution, and as the engineering of the size of the inherent defect Ru is exact terms of the steel, and Cheng Hao the actual size still appears intrinsic defects of the steel material.

Furthermore, the ultrasonic flaw detection image processing method according to the present invention appears in a B-scope image including an echo image corresponding to an echo reflected by a reflection source in the steel based on an ultrasonic wave incident from the outer peripheral surface of the steel material. Engineering the of echo image, wherein the penetration echo image having a linearity an incident direction substantially perpendicular direction of the ultrasound, and the non-penetration bead echo image of the back wave echo image and substantially parallel direction Ru each identified I have a degree, and a degree of Engineering of the Ru only non Uranami echo images appear image is displayed.

Further, the ultrasonic flaw detection image processing method according to the present invention is a pixel of a B scope image including an echo image corresponding to an echo reflected by a reflection source in the steel material based on an ultrasonic wave incident from the outer peripheral surface of the steel material tube. A resolution is calculated , and a limited area image in the image is generated based on the pixel resolution; and an echo image that appears in the limited area image is substantially orthogonal to the incident direction of the ultrasonic wave and linearity and penetration echo image having the steps of a non-back-wave echo image of the back wave echo image and substantially parallel direction are respectively identified, the such that the luminance peak luminance distribution of the non-back-wave echo image and as factories to echo image pair is discovered, and the respective intensity peak coordinates on the echo image is read to form an echo image partner, as engineering the coordinate differences Ru is calculated of the intensity peak coordinates, the coordinates Difference and pixel resolution From has a higher engineering the size of the inherent defects of the steel material Ru is exact terms and Cheng Hao the actual size still appears intrinsic defects of the steel material.

  According to the ultrasonic flaw detection image processing apparatus and the processing method thereof according to the present invention, it is possible to evaluate the internal defect of the steel material without depending on the analysis level of the inspector.

  Further, according to the ultrasonic flaw detection image processing apparatus and the processing method thereof according to the present invention, the size of the inherent defect and the degree of flaw detection can be accurately measured.

  Embodiments of an ultrasonic inspection image processing apparatus and a processing method thereof according to the present invention will be described below with reference to the accompanying drawings.

  FIG. 1 is a schematic diagram showing an embodiment of an ultrasonic flaw detection image processing apparatus according to the present invention.

  FIG. 1 shows an ultrasonic flaw detection image processing apparatus 1 and a welded steel material, for example, a pipe 10 in which two pipe bodies are aligned in the pipe axis direction and the ends thereof are welded. In addition, although the piping shown in FIG. 1 shows the piping 10 by which V groove welding was performed by two pipe main bodies, it is not limited to V groove welding construction especially, for example, X groove welding construction was carried out Piping may be used.

  The ultrasonic flaw detection image processing apparatus 1 includes an ultrasonic flaw detector 12 that emits ultrasonic transmission pulses, and a probe 13 that injects ultrasonic waves into the pipe 10 in a required incident direction (incident angle). . In addition, the probe 13 can receive a pulsed reflected wave (echo) from a reflection source in the pipe 10 and convert it into an electric signal. The ultrasonic flaw detector 12 is supplied from the probe 13. The echo signal a can be obtained by digitally converting and amplifying the electric signal.

  Further, the ultrasonic flaw detection image processing apparatus 1 includes an image processing apparatus 14 that creates an image d by using an echo signal a from the ultrasonic flaw detector 12 and processes data of the image d, and an image d on the screen. And a display device 15 for displaying.

  The image processing device 14 provided in the ultrasonic flaw detection image processing device 1 includes an image creation unit 21 that creates an image d by an echo signal a from the ultrasonic flaw detector 12 and an image storage unit 22 that stores data of the image d. And an image region restriction processing unit 23 for creating a limited region image e by limiting the region of the image d, and an echo image by using a straight line direction (tilt, angle) of the echo image appearing in the limited region image e. A luminance distribution is acquired from the echo image direction identification processing unit 24 to be identified and the echo image, the presence / absence of an echo image having a luminance peak in the luminance distribution is determined, and the echo image is formed in the vicinity of the back echo image. The luminance distribution creation / echo image pair detection unit 25 for detecting the echo image pair to be detected, and the luminance peak coordinates on the echo image forming the echo image pair detected by the luminance distribution creation / echo image pair detection unit 25 ( Pixel Read, and the defect exact calculation unit 26 for calculating the actual size of each internalized defect from the coordinate difference luminance peak coordinates (internal defects) 11 on echo image forming the echo image pair is provided.

  The data of the limited area echo identification image f from the echo image direction identification processing unit 24 and the actual size data of the intrinsic defect 11 calculated by the defect actual size calculation unit 26 can be input to the display device 15, respectively. Yes.

  On the other hand, the pipe 10 includes a first pipe main body 10a, a second pipe main body 10b, and a welded portion 10c which is a portion where ends of the first pipe main body 10a and the second pipe main body 10b are welded with molten metal. And a heat-affected zone 10d generated during welding. On the inner peripheral surface of the welded portion 10c, a molten metal is melted to form a back wave portion (saddle) 10e. Furthermore, the internal defect 11 which has progressed from the stress corrosion cracking of the heat affected zone 10d is generated on the pipe inner peripheral surface of the heat affected zone 10d, and the innermost defect 11 is defined as the defect end 11a. The opening of the internal defect 11 is defined as a defect opening 11b.

  The probe 13 provided in the ultrasonic flaw detection image processing apparatus 1 is disposed on the outer peripheral surface of the pipe 10. From the probe 13, a position signal “b” indicating the position of the probe 13 on the outer peripheral surface of the pipe 10 and a flaw detection angle signal “c” indicating the incident direction (incident angle) of the ultrasonic waves are sent to the image processing device 14. Each can be output.

  Next, an ultrasonic flaw detection image processing method using the ultrasonic flaw detection image processing apparatus 1 will be described with reference to a flowchart shown in FIG.

  The probe 13 provided in the ultrasonic flaw detection image processing apparatus 1 moves the pipe outer circumferential surface of the pipe 10 by a predetermined scanning interval in the pipe outer circumferential direction and the pipe axis direction. The probe 13 performs a flaw detection operation every time it moves by a predetermined scanning interval.

  When the flaw detection operation is started, the probe 13 first generates ultrasonic waves. The ultrasonic waves are refracted at the boundary surface between the probe 13 and the pipe 10 in the required incident direction (incident angle) with respect to the flaw detection surface by the oblique flaw detection method, and enter the pipe 10. . The flaw detection refraction angle at the boundary surface is a constant value obtained from Snell's law based on the incident direction to the boundary surface and the sound velocity of the ultrasonic wave propagating in the pipe 10.

  The ultrasonic wave that enters the pipe 10 is reflected by a reflection source in the pipe 10. The reflected echo is received by the probe 13. The echo received by the probe 13 is converted into an electrical signal by the probe 13. This electrical signal is input to the ultrasonic flaw detector 12 and is digitally converted and amplified by the ultrasonic flaw detector 12. The electric signal amplified by the ultrasonic flaw detector 12 is input to the image processing apparatus 14 as an echo signal a (step S1).

  Here, the reflection source includes an intrinsic defect and a back wave portion 10e, and the echo is a defect echo reflected by the intrinsic defect 11, such as a defect end echo and a defect opening echo, or a back surface reflected by the back wave portion 10e. It includes wave echoes, and in addition, includes interference echoes due to noise components.

On the other hand, when the flaw detection operation is started, a position signal b indicating the position of the pipe 10 is input from the probe 13 to the image processing device 14. In addition, an incident direction signal c indicating the determined incident direction of the ultrasonic wave is input from the probe 13 to the image processing apparatus 14 (step S2).

  An echo signal a is input from the ultrasonic flaw detector 12, and a position signal b and an incident direction signal c are input from the probe 13 to the image creation unit 21 of the image processing device 14. The image creation unit 21 creates the A-scope waveform, the B-scope, and the C-scope image d from the echo signal a, the position signal b, and the incident direction signal c (step S3). This image d includes disturbing echoes due to noise components.

  Here, the A scope waveform is obtained almost in real time, and is a time-series waveform in which the received echo intensity (RF wave or detection) and the sound wave propagation time (depth) are taken as rectangular coordinates. The B scope is the A scope. Is a tomographic image of the pipe 10 in which the position of the probe 13 and the sound wave propagation time (depth) are taken on a rectangular coordinate. It is the plane image of the piping 10 which displayed the intensity | strength of the received echo intensity in the depth, and displayed it at the position of the probe 13.

  The data of the image d in the pipe 10 created by the image creation unit 21 is input from the image creation unit 21 to the image storage unit 22 and stored in the image storage unit 22.

  On the other hand, the data of the image d is input from the image creation unit 21 to the display device 15. On the screen of the display device 15, the A scope waveform, the B scope, and the C scope are displayed as images (step S4).

  FIG. 3 is an explanatory diagram showing an image d of the B scope in the pipe 10.

  In the image d of the B scope shown in FIG. 3, the ultrasonic wave incident from the probe 13 is reflected by the back wave part 10e, and the back wave echo image corresponding to the back wave echo reflected by the back wave part 10e. P appears.

  The back-wave echo image P appears in a straight line in a direction substantially orthogonal to the incident direction of the ultrasonic waves, and other echo images are present in the vicinity of the back-wave echo image P as in the image d of the B scope shown in FIG. When it does not appear, it can be determined that the internal defect 11 as shown in FIG. 1 does not exist in the inner peripheral surface of the heat affected zone 10d. Therefore, it can be judged from the image d of the B scope shown in FIG. 3 that the result of the V groove welding enforcement of the pipe 10 is good.

  FIG. 4 is a schematic diagram illustrating an example of an image d of the B scope in the pipe 10.

  In the image d of the B scope shown in FIG. 4, the ultrasonic wave incident from the probe 13 is reflected by the back wave part 10e, and the back wave echo corresponding to the back wave echo reflected by the back wave part 10e. Image P appears.

  Further, as shown in FIG. 1, when the inherent defect 11 that has progressed from the stress corrosion cracking of the heat affected zone 10d exists in the heat affected zone 10d, the image d of the B scope shown in FIG. In the vicinity of the back echo image P, a defect end echo image Q corresponding to the defect end echo reflected from the defect end 11a of the intrinsic defect 11 and a defect opening reflected from the defect opening 11b of the intrinsic defect 11 are provided. A defect opening echo image R corresponding to the echo and a disturbing echo image representing the disturbing echo due to the noise component appear. Note that the B-scope image d shown in FIG. 4 is simplified by omitting a part of the disturbing echo image in order to make the back echo image P, the defect end echo image Q, and the defect opening echo image R easy to see. it's shown.

  The inspector evaluates the internal defect 11 of the pipe 10 while viewing the B-scope image d as shown in FIG. 4 displayed on the screen of the display device 15 in step S4. The inherent defect 11 of the pipe 10 can be evaluated while viewing the A scope waveform and the C scope image d displayed on the display device 15.

  On the other hand, the data of the B-scope image d in the pipe 10 created in step S3 by the image creation unit 21 of the image processing apparatus 14 shown in FIG. Is input. In the image area limitation processing unit 23, the pixel resolution is calculated from the image d of the B scope (step S5). This pixel resolution can be calculated, for example, by reading the scale at the left end of the B-scope image d shown in FIG.

  Subsequently, from the pixel resolution calculated in step S5 and the thickness of the pipe 10, the area on the screen where the back echo image P appears is limited, and a limited area image e is created (step S6). The wall thickness of the pipe 10 is input by the inspector as a known value.

  The data of the limited area image e created by the image area limitation processing unit 23 is input from the image area limitation processing unit 23 to the echo image direction identification processing unit 24. In the echo image direction identification processing unit 24, a back wave echo image having a direction substantially orthogonal to the incident direction of the ultrasonic wave is identified among various echo images appearing in the region limited in step S6 (step S7). .

  Here, the echo image direction identification processing unit 24 determines whether the echo image appearing in the limited area image e is an echo image in a direction substantially parallel to the direction of the back wave echo image identified in step S7. (Step S8). If the determination in step S8 is Yes, that is, the echo image that appears in the limited area image e is an echo image in a direction substantially parallel to the direction of the back wave echo image, the echo image that appears in the limited area image e is The echo image in the direction substantially parallel to the direction of the wave echo image is identified, and the limited scope echo identification image f of the B scope in which only the echo image in the direction substantially parallel to the direction of the back wave echo image appears is created (step S9). . In addition, if steps S5 to S9 are performed on the C-scope image d, the C-scope limited area echo identification image f can be created as in the case of the B-scope limited area echo identification image f.

  The data of the limited area echo identification image f in which only the echo image extracted by the echo image direction identification processing unit 24 appears is input from the echo image direction identification processing unit 24 to the display device 15 and is displayed on the screen of the display device 15. B scope and C scope are displayed as images (step S10).

  On the other hand, if the determination in step S8 is No, that is, if the echo image that appears in the limited area image e is not an echo image in a direction substantially parallel to the direction of the back wave echo image, the echo image is an interference echo image due to noise components Is removed from the limited area echo identification image f (step S11).

  Then, the data of the limited area echo identification image f of the B scope that is created in step S9 and only the echo image appears is input to the luminance distribution creation / echo image pair detection unit 25. The luminance distribution creation / echo image pair detection unit 25 measures the luminance of the echo with respect to the echo image appearing in the limited region echo identification image f, and acquires the luminance distribution for the pixel row on the straight line on which the echo image appears. (Step S12).

  FIG. 5 is an explanatory diagram showing the luminance distribution of echoes.

  The luminance distribution of the echo shown in FIG. 5 is obtained by taking the magnitude of luminance with respect to the pixel line on the straight line where the echo image appears. FIG. 5A shows the luminance distribution of the defect echo, while FIG. 5B shows the luminance distribution of the disturbing echo.

  As shown in the luminance distribution of FIG. 5A, when there is a luminance peak (luminance centroid) in the luminance distribution of the echo, there is a high possibility that the inherent defect 11 exists in the pipe 10. In addition, when an echo image pair is formed in the vicinity of the back echo image from an echo image having a luminance peak in the luminance distribution, it can be determined that the inherent defect 11 exists in the pipe 10. The echo image forming the echo image pair includes a defect edge echo image Q corresponding to the defect edge echo reflected from the defect edge 11a and a defect opening echo corresponding to the defect opening echo reflected from the defect opening 11b. It can be determined that the image is R.

  Then, in the luminance distribution creation / echo image pair detection unit 25, there is an echo image having a luminance peak in the luminance distribution as shown in the luminance distribution of FIG. It is determined whether an echo image pair formed in the vicinity is detected (step S13). When the determination in step S13 is Yes, that is, when an echo image pair is detected, it is determined that the two echo images forming the echo image pair are the defect end portion echo image Q and the defect opening portion echo image R. . Then, luminance peak coordinates (pixels) on the defect end echo image Q and the defect opening echo image R corresponding to the luminance peak in the luminance distribution are read (step S14).

  On the other hand, if the determination in step S13 is No, that is, if there is no luminance peak in the luminance distribution as shown in the luminance distribution of FIG. 5B, or there is a luminance peak in the luminance distribution, an echo image pair is not detected. In this case, an echo image having no luminance peak in the luminance distribution or an echo image having a luminance peak but not forming an echo image pair is removed from the image as a disturbing echo image due to a noise component (step S11).

  FIG. 6 shows a back-wave echo image P, a defect end echo image Q, and a defect opening echo image R, and is a diagram for explaining respective luminance peak coordinates of the defect end echo image Q and the defect opening echo image R. is there.

FIG. 6 shows a back-wave echo image P, a defect end portion echo image Q, and a defect opening portion echo image R on an xy plane image. In addition, the luminance distribution is acquired from the defect end echo image Q and the defect opening echo image R in step S12, and the luminance peak coordinates q on the defect end echo image Q read from the luminance distribution in step S14. (X _q , y _q ) and luminance peak coordinates r (x _r , y _r ) on the defect opening echo image R are respectively shown.

Here, the coordinate difference (number of pixels) between the luminance peak coordinate q (x _q , y _q ) on the defect edge echo image Q and the luminance peak coordinate r (x _r , y _r ) on the defect opening echo image R is calculated. Calculated. Here, in order to obtain the height of the intrinsic defect 11 (hereinafter referred to as “indicated height”), y of the luminance peak coordinate q (x _q , y _q ) and the luminance peak coordinate r (x _r , y _r ). A coordinate difference (y _q −y _r ) is calculated (step S15).

  Then, using the y coordinate difference between the calculated luminance peak coordinate q and luminance peak coordinate r and the pixel resolution calculated in step S5, the y coordinate difference is converted into an actual height (step S16). The actual height data is input to the display device 15.

  The instruction height converted in actual size in step S16 is displayed on the screen of the display device 15 (step S17).

  It should be noted that the identification of the back-wave echo image in step S7 in the flowchart shown in FIG. 2 is preferably performed on the limited region image e in step S6, but step S6 is omitted and performed on the image d in step S3. May be. The luminance distribution acquisition in step S12 may be performed after the pixel resolution is calculated in step S5 or the limited area image e is generated in step S6. In that case, steps S7 to S11 are omitted, and the image d or the limited area is acquired. The luminance distribution of the echo that appears in the image e is acquired (step S12).

  According to the ultrasonic flaw detection image processing apparatus 1 and the processing method thereof according to the present invention, the S / N ratio of the echo is increased by removing the interference echo image from the echo image using the direction (angle) of the echo image. Thus, the internal defect 11 of the pipe 10 can be evaluated without depending on the analysis level of the inspector.

  Furthermore, according to the ultrasonic flaw detection image processing apparatus 1 and the processing method thereof according to the present invention, the luminance distribution is acquired from the echo image, and the interference echo image is removed using the presence or absence of the luminance peak detected from the luminance distribution. Thus, the S / N ratio of the echo can be increased, and the internal defect 11 of the pipe 10 can be evaluated without depending on the analysis level of the inspector.

Further, according to the ultrasonic flaw detection image processing apparatus 1 and the processing method thereof according to the present invention, the y coordinate difference (y _q ) between the luminance peak coordinate q (x _q , y _q ) and the luminance peak coordinate r (x _r , y _r ). -Y _r ) is calculated, and the indicated height can be accurately measured by converting the y coordinate difference to the actual size.

1 is a schematic diagram showing an embodiment of an ultrasonic flaw detection image processing apparatus according to the present invention. The flowchart which shows the ultrasonic flaw detection image processing method which concerns on this invention. Explanatory drawing which shows the image of B scope in piping. Schematic which shows an example of the image of B scope in piping. (A) Explanatory drawing which shows luminance distribution of defect echo, (b) Explanatory drawing which shows luminance distribution of disturbance echo. The figure which shows a back wave echo image, a defect edge part echo image, and a defect opening part echo image, and demonstrates each luminance peak coordinate of a defect edge part echo image and a defect opening part echo image.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Ultrasonic flaw detection image processing apparatus 14 Image processing apparatus 15 Display apparatus 21 Image preparation part 22 Image memory | storage part 23 Image area limitation process part 24 Echo image direction identification process part 25 Luminance distribution preparation / echo image pair detection part 26 Defect actual size calculation part

Claims (8)

Means for generating an image of a B scope including an echo image corresponding to an echo reflected from a reflection source in the steel material by entering ultrasonic waves from the outer peripheral surface of the steel material;
Means for calculating a pixel resolution from the image, and generating a limited area image in the image based on the pixel resolution ;
Among echo images appearing in the limited region image, a back-wave echo image that is substantially orthogonal to the incident direction of the ultrasonic waves and has linearity, and a non-back-wave echo image in a direction substantially parallel to the back-wave echo image, Means for identifying each of
Means for detecting the echo image pair such that the luminance peak in the intensity distribution of the non-back-wave echo image,
Reading each luminance peak coordinates on each echo images forming the echo image pair, wherein the means for calculating the actual size of the endogenous defects from said pixel resolution as the coordinate difference between the luminance peak coordinates is provided Ultrasonic flaw detection image processing device. 2. The ultrasonic flaw detection image processing apparatus according to claim 1, further comprising means for storing the image data. A pixel resolution of an image of a B scope including an echo image corresponding to an echo reflected by a reflection source in the steel material is calculated based on an ultrasonic wave incident from the outer peripheral surface of the steel tube, and the image resolution is calculated based on the pixel resolution. Generating a limited area image of
Of the echo image appearing on the limited area image, and the penetration echo image having a linearity above a incident direction substantially perpendicular direction of the ultrasound, and the non-penetration bead echo image of the back wave echo image direction substantially parallel but the higher the factory that will be identified, respectively,
Wherein the higher engineering that echo image pair is discovered that there is a luminance peak luminance distribution of the non-back-wave echo image,
And wherein each of the luminance peak coordinates on the echo image is read to form an echo image partner, as engineering the coordinate differences Ru is calculated of the intensity peak coordinates,
From said pixel resolution as the coordinate difference, the higher engineering the size of the inherent defect Ru is exact terms of the steel,
Ultrasonic flaw detection image processing method characterized by having a degree Engineering the actual size of the inherent defects of the steel product that is displayed. The ultrasonic flaw detection image processing method according to claim 3, wherein an image in which only the non-back wave echo image appears is displayed. Of echo images appearing in an image of a B scope including an echo image corresponding to an echo reflected from a reflection source in the steel based on an ultrasonic wave incident from the outer peripheral surface of the steel pipe, the incident direction of the ultrasonic wave is substantially orthogonal. and penetration echo image having a linearity in a direction, and a non-penetration bead echo image of the back wave echo image and substantially parallel direction with enough engineering that will be identified, respectively,
Ultrasonic flaw detection image processing method characterized by having a degree of Engineering for images only the non-back-wave echo image appears still appears. A pixel resolution of an image of a B scope including an echo image corresponding to an echo reflected by a reflection source in the steel material is calculated based on an ultrasonic wave incident from the outer peripheral surface of the steel tube, and the image resolution is calculated based on the pixel resolution. Generating a limited area image of
Among the echo images appearing in the limited region image, there are back wave echo images that are substantially orthogonal to the incident direction of the ultrasonic waves and have linearity, and the back wave echo images and non-back wave echo images in a substantially parallel direction. Each identified process; and
Wherein the higher engineering that echo image pair is discovered that there is a luminance peak luminance distribution of the non-back-wave echo image,
And wherein each of the luminance peak coordinates on the echo image is read to form an echo image partner, as engineering the coordinate differences Ru is calculated of the intensity peak coordinates,
From said pixel resolution as the coordinate difference, the higher engineering the size of the inherent defect Ru is exact terms of the steel,
Ultrasonic flaw detection image processing method characterized by having a degree Engineering the actual size of the inherent defects of the steel product that is displayed. The echo image to y-coordinate difference of the luminance peak coordinates on the echo image is calculated to form a from the y-coordinate difference and the pixel resolution, the height of the inherent defects of the steel product is exact terms, the The ultrasonic flaw detection image processing method according to claim 3 or 6, wherein the height is displayed. The limited region image in the image is generated based on the pixel resolution and the thickness of the steel material, and an echo image appearing in the limited region image is identified . Ultrasonic flaw detection image processing method.

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