JPS63119540A - ワイヤボンデイング用のボ−ル形成装置 - Google Patents

ワイヤボンデイング用のボ−ル形成装置

Info

Publication number
JPS63119540A
JPS63119540A JP61264081A JP26408186A JPS63119540A JP S63119540 A JPS63119540 A JP S63119540A JP 61264081 A JP61264081 A JP 61264081A JP 26408186 A JP26408186 A JP 26408186A JP S63119540 A JPS63119540 A JP S63119540A
Authority
JP
Japan
Prior art keywords
discharge
ball
charge
wire
ball diameter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61264081A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0317376B2 (enExample
Inventor
Hiroshi Miura
三浦　浩史
Yutaka Okuyama
奥山　豊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Mechatronics Co Ltd
Original Assignee
Toshiba Seiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Seiki Co Ltd filed Critical Toshiba Seiki Co Ltd
Priority to JP61264081A priority Critical patent/JPS63119540A/ja
Publication of JPS63119540A publication Critical patent/JPS63119540A/ja
Publication of JPH0317376B2 publication Critical patent/JPH0317376B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning

Landscapes

  • Wire Bonding (AREA)
JP61264081A 1986-11-07 1986-11-07 ワイヤボンデイング用のボ−ル形成装置 Granted JPS63119540A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61264081A JPS63119540A (ja) 1986-11-07 1986-11-07 ワイヤボンデイング用のボ−ル形成装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61264081A JPS63119540A (ja) 1986-11-07 1986-11-07 ワイヤボンデイング用のボ−ル形成装置

Publications (2)

Publication Number Publication Date
JPS63119540A true JPS63119540A (ja) 1988-05-24
JPH0317376B2 JPH0317376B2 (enExample) 1991-03-07

Family

ID=17398251

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61264081A Granted JPS63119540A (ja) 1986-11-07 1986-11-07 ワイヤボンデイング用のボ−ル形成装置

Country Status (1)

Country Link
JP (1) JPS63119540A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI562252B (en) * 2014-02-17 2016-12-11 Shinkawa Kk Detecting discharging device, wire bonding device and detecting discharging method

Also Published As

Publication number Publication date
JPH0317376B2 (enExample) 1991-03-07

Similar Documents

Publication Publication Date Title
US6031203A (en) Method and apparatus for determining stability of arc welding
JP2742545B2 (ja) 抵抗溶接制御方法
EP1048388A2 (en) Resistance welding power supply apparatus
US9421626B2 (en) Apparatus and method for electrical discharge machining modulation control
CA2266717A1 (en) Method and apparatus for initiating a welding arc
US5212361A (en) Method and apparatus for forming balls at the ends of wires
JPS63119540A (ja) ワイヤボンデイング用のボ−ル形成装置
KR20160122805A (ko) 방전 검사 장치, 와이어 본딩 장치 및 방전 검사 방법
JPS6215017A (ja) ワイヤ放電加工装置
US4687897A (en) Flame-off limited circuit for wire bonding ball forming apparatus
JPH0317377B2 (enExample)
JPH03281063A (ja) 溶接電源の出力制御方法
JPS61150786A (ja) スポツト溶接方法
US6660956B1 (en) Method of and apparatus for monitoring a ball forming process
JPH05312896A (ja) Ｓｃｒの導電測定方法及び測定装置
JP2005020843A (ja) 電力変換装置及びこの電力変換装置を用いた試験方法
SU1257585A1 (ru) Устройство дл контрол критической скорости нарастани напр жени тиристоров в закрытом состо нии
US4672167A (en) Method and apparatus for welding metallic parts
JP3462304B2 (ja) 電気溶接装置及び電気溶接方法
JPS6195777A (ja) 開先検出方法および装置
JP3277011B2 (ja) 溶接ロボットの始端位置検出装置
JPS5923938B2 (ja) 放電加工装置
JPH07323376A (ja) スタッドの抵抗溶接方法及び装置
JPH08317574A (ja) 急速充電回路
JP3908380B2 (ja) ワイヤボンディング装置及び該装置を用いた半導体装置の製造方法

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees