JPS6311906Y2 - - Google Patents
Info
- Publication number
- JPS6311906Y2 JPS6311906Y2 JP1981088483U JP8848381U JPS6311906Y2 JP S6311906 Y2 JPS6311906 Y2 JP S6311906Y2 JP 1981088483 U JP1981088483 U JP 1981088483U JP 8848381 U JP8848381 U JP 8848381U JP S6311906 Y2 JPS6311906 Y2 JP S6311906Y2
- Authority
- JP
- Japan
- Prior art keywords
- large current
- series
- parallel
- connected bodies
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001816 cooling Methods 0.000 claims description 12
- 239000004020 conductor Substances 0.000 claims description 9
- 230000000694 effects Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 2
- 230000005672 electromagnetic field Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/62—Protection against overvoltage, e.g. fuses, shunts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Rectifiers (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981088483U JPS6311906Y2 (US08063081-20111122-C00044.png) | 1981-06-15 | 1981-06-15 | |
| CA000404932A CA1190597A (en) | 1981-06-15 | 1982-06-11 | Rectifying device |
| US06/387,893 US4460956A (en) | 1981-06-15 | 1982-06-14 | Rectifying device |
| BR8203468A BR8203468A (pt) | 1981-06-15 | 1982-06-14 | Dispositivo de retificacao |
| AU84872/82A AU555934B2 (en) | 1981-06-15 | 1982-06-15 | Cooling means for rectifier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981088483U JPS6311906Y2 (US08063081-20111122-C00044.png) | 1981-06-15 | 1981-06-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57201086U JPS57201086U (US08063081-20111122-C00044.png) | 1982-12-21 |
| JPS6311906Y2 true JPS6311906Y2 (US08063081-20111122-C00044.png) | 1988-04-06 |
Family
ID=13944035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981088483U Expired JPS6311906Y2 (US08063081-20111122-C00044.png) | 1981-06-15 | 1981-06-15 |
Country Status (5)
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4606000A (en) * | 1985-03-27 | 1986-08-12 | General Motors Corporation | Bridge rectifier |
| US4684875A (en) * | 1986-04-28 | 1987-08-04 | Liebert Corporation | Power conditioning system and apparatus |
| JPS6381691U (US08063081-20111122-C00044.png) * | 1986-11-14 | 1988-05-30 | ||
| JPS63159894U (US08063081-20111122-C00044.png) * | 1987-04-08 | 1988-10-19 | ||
| US6160696A (en) * | 1998-05-04 | 2000-12-12 | General Electric Company | Modular bus bar and switch assembly for traction inverter |
| JPWO2014147961A1 (ja) * | 2013-03-19 | 2017-02-16 | 富士電機株式会社 | 電子機器冷却装置およびこれを備える電力変換装置 |
| WO2014147963A1 (ja) * | 2013-03-19 | 2014-09-25 | 富士電機株式会社 | 冷却装置及びこれを備えた電力変換装置 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3005945A (en) * | 1958-10-27 | 1961-10-24 | Chase Shawmut Co | Semiconductor diode protection |
| DE1182352B (de) * | 1960-09-21 | 1964-11-26 | Siemens Ag | Luftgekuehlte Halbleiter-Gleichrichtersaeule mit plattenfoermigen Gleichrichterelementen |
| DE2341097A1 (de) * | 1973-08-14 | 1975-02-27 | Siemens Ag | Kuehlanordnung fuer flache halbleiterbauelemente, insbesondere fuer scheibenzellen-thyristoren |
-
1981
- 1981-06-15 JP JP1981088483U patent/JPS6311906Y2/ja not_active Expired
-
1982
- 1982-06-11 CA CA000404932A patent/CA1190597A/en not_active Expired
- 1982-06-14 BR BR8203468A patent/BR8203468A/pt not_active IP Right Cessation
- 1982-06-14 US US06/387,893 patent/US4460956A/en not_active Expired - Fee Related
- 1982-06-15 AU AU84872/82A patent/AU555934B2/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| AU555934B2 (en) | 1986-10-16 |
| BR8203468A (pt) | 1983-06-07 |
| AU8487282A (en) | 1982-12-23 |
| US4460956A (en) | 1984-07-17 |
| JPS57201086U (US08063081-20111122-C00044.png) | 1982-12-21 |
| CA1190597A (en) | 1985-07-16 |
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