JPS63118672A - Electric characteristic measuring instrument for chip-shaped electronic parts - Google Patents

Abstract

PURPOSE:To continuously measure the electric characteristic of small-sized parts at a high speed by providing a rotating carrying body, plural rotating connectors, etc. CONSTITUTION:When chip capacitors 1 are successively carried to the position of a rotating connector 13 by a rotating carrying body 12, a rotating body 14 of the connector 13 rides on a terminal electrode 4 of each capacitor 1. Since the rotating body 14 of the connector 13 is energized toward the outside surface of a thick part 12a of the carrying body 12 at this time, the capacitor 1 is energized in a holding groove 22 toward a common terminal. Then, electrodes 4 and 5 of the capacitor 1 carried to the position of the connector 13 are connected to a C meter 15 by the connector 13 and a rotating connector 17, and a trigger signal is inputted to the meter 15 from a photo transistor 32 of a trigger device 19, and the electrostatic capacity of the capacitor 1 is measured. Thus, electrostatic capacities of many capacitors 1, 1... are continuously measured at a high speed by the carrying body 12 and connectors 13 and 17.

Description

Detailed Description of the Invention (Field of Industrial Application) The present invention is applied to chip-shaped electronic components that continuously measure the electrical characteristics of a large number of chip-shaped electronic components during the manufacturing process of chip-shaped electronic components such as chip capacitors. This invention relates to an electrical property measuring device.

(Prior Art) Generally, electronic components undergo various checks including electrical characteristics during the manufacturing process, and only those that meet predetermined standards are shipped as products.

For example, in the case of chip capacitors, after the steps such as firing the unit and baking the terminal electrodes are completed, the capacitance is measured and the capacitors are sorted according to the measurement results. Then, if necessary, the capacitance value is printed on each chip capacitor along with its error range, and then the chip capacitor is packaged in a predetermined form and shipped. In the manufacturing process of such a depth capacitor,
It is necessary to efficiently measure the capacitance of a large number of chip capacitors.

Conventionally, in the manufacturing process of chip capacitors, the capacitance of chip capacitors has been measured, for example, as shown in FIGS. 6 and 7. That is, for example, several chip capacitors l whose capacitances are to be measured are held in holding recesses 3.3. which are formed at a constant pitch on a carrier 2 made of an insulating material. ... and hold them respectively.

Each of the holding recesses 3 holds the carrier l having a certain width,
It is formed in a direction that crosses each of the holding recesses 3 from one side to the other side. And each chip capacitor 1
is held in each of the holding recesses 3 so that both end faces on which the terminal electrodes 4 and 5 are respectively formed substantially coincide with the above-mentioned negative side surface and the other side surface of the conveying body 2, respectively. The carrier 1 moves in the direction indicated by arrow A1 in FIG. 6, and the terminal electrodes 4 and 5 of the chip capacitor l held in each holding recess 3 are at the tips of needle-like contacts 6 and 7, respectively. Each chip capacitor l is transported to a position facing the. Then, as shown in FIG.
are moved in the directions shown by arrows A and A, respectively, and the contacts 6 and 7 are brought into pressure contact with the terminal electrodes 4 and 5 from both sides of each chip capacitor 1, respectively. In this state, the scanners 8 and 9 sequentially connect each chip capacitor l to the C meter 11 for measuring capacitance, and measure the capacitance of each chip capacitor l. A series of chip capacitors 1, 1 . When the measurement of the capacitance of the series of chip capacitors 1, 1, . . . is completed, the carrier 2 is moved again. ... followed by a series of other chip capacitors whose capacitances have not yet been measured! , l, ... to each contactor 6 and 7.
The capacitance is measured in the same manner as above.

By the way, in the capacitance measuring device for chip capacitors as described above, a series of chip capacitors l.

The carrier 2 is intermittently fed every time the measurement of the capacitance of the capacitances 1, . . . is completed. Vibrations caused by this intermittent feeding not only cause the chip capacitors l to fall off the carrier 2 and make it impossible to measure their capacitance, but also cause problems in that it takes time to measure the capacitance. . Further, the carrier 2 is stopped so that each chip capacitor I faces each contact 6 and 7, and after the carrier 2 has stopped, each contact 6 and 7 is stopped.
must be brought into contact with the terminal electrode 4.5 of each chip capacitor 1 with an appropriate contact pressure. Therefore, the position of the carrier 2 needs to be controlled, and the operation of the contacts 6 and 7 must be controlled in synchronization with the movement of the carrier 2, making the control mechanism complicated. In particular, when the chip capacitor I becomes small, the position control of the carrier 2 and the contactors 6 and 7
This requires high control accuracy, and there is a problem that the capacitance of the small chip capacitor 1 cannot be measured at high speed. Furthermore, since the tips of the contacts 6 and 7 are pierced by the terminal electrodes 4 and 5 of each chip capacitor I during capacitance measurement, the terminal electrodes 4 and 5
There was a problem in that not only the tips of the chip capacitors 1 were rapidly worn out, but also the terminal electrodes 4 and 5 of each chip capacitor 1 were damaged.

(Object of the Invention) An object of the present invention is to provide an apparatus for measuring electrical properties of chip-shaped electronic components that can continuously measure the electrical properties of small-sized chip-shaped electronic components at high speed.

(Structure of the Invention) Therefore, the present invention provides a device for measuring the characteristics of a chip-shaped electronic component by electrically connecting the end electrodes at both ends of the chip-shaped electronic component to a characteristic measuring device using connection means. The device has a plurality of holding grooves, and a chip-shaped electronic component is accommodated in each holding groove while movement in the conveying direction is restrained so that at least a part of the end electrode is exposed to the outside. and a rotating body made of a good electrical conductor that is arranged along the conveyance route of the chip-shaped electronic component transported by the transportation means and rotates in contact with one end electrode of the chip-shaped electronic component. and a first connecting device that maintains and supports the electrical connection, and a first connecting device that is electrically connected to the other end electrode when at least the rotating body of the first connecting device is in contact with the other end electrode. It is characterized by having two connection devices. The rotating body of the first connection device is electrically connected to the end electrode of each chip-shaped electronic component when rolling over the end electrode of each chip-shaped electronic component.

Thereby, the characteristics of each chip-shaped electronic component are measured.

(Effects of the Invention) According to the present invention, in the process of moving each chip-shaped electronic component with respect to the first contact device, the rotating body of the first contact device transfers over the end electrode of each chip-shaped electronic component. Then, both end electrodes of each chip-shaped electronic component are sequentially electrically connected to a characteristic measuring device through the first and second connecting devices, and the characteristics are measured. The electrical characteristics of chip-shaped electronic components can be measured at high speed and reliably. Further, according to the present invention, each chip-shaped electronic component is sequentially connected to the characteristic measuring device by moving the rotating body of the first connecting device over the end electrode of the chip-shaped electronic component, so that the small chip-shaped The rotating body of the rotary connection device is also in reliable electrical contact with the end electrode 7 of the electronic component, and its electrical characteristics can be stably measured.

(Example) Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 shows an embodiment in which the present invention is applied to a capacitance measuring device for a chip capacitor.

As shown in FIG. 1, each chip capacitor 1 whose capacitance is to be measured is held by a rotary conveyor 12 serving as a conveyance means and conveyed in the direction of arrow A4. During this transportation, the rotating body 14 of the rotary connection device 13 serving as the first connection device rolls over one terminal electrode 4 of each chip capacitor 1, and the one terminal electrode 4 of each chip capacitor 1 is sequentially moved. Connect to C meter 15. Further, the other terminal electrode 5 of each chip capacitor l on the rotary carrier 12 is always connected to the C meter through the common terminal 16 as a second connection device of the rotary carrier I2 and another rotary connecting device 17. 15 is connected to the desk and the rotary connection device 1
When the three rotating bodies 14 start rolling on the terminal electrodes 4 of the one chip capacitor 1, a trigger signal is input from the trigger device 19 (described later) to the C meter 15, and the capacitance of the three chip capacitors 1 is calculated. Measurements are taken. As a result of this measurement, chip capacitors l whose capacitances are not within the specified range are rejected by the sorting device 2I.

The rotary conveyance body 12 is formed by molding an insulating material such as resin or rubber into a disk shape. The rotary conveyance body 12 is formed so that its peripheral edge spans a width that is slightly narrower than the length of each depth capacitor 1 and is thicker than the other portions. This thick wall portion 12a holds chip capacitors 1422, 22. ... is formed. A metal common terminal 6, which is slightly deeper than each of the holding grooves 22, is fitted inside the thick portion 12a. The rotary conveyance body 12 is
It is supported at its center by a shaft 23, and is driven in the direction of arrow A4 by a drive motor (not shown) connected to this shaft 23.

The rotary body 14 of the rotary connection device 13 is pressed against the outer surface of the thick portion 12a of the rotary conveyance body 12 by the spring force of a spring (not shown) applied to the rotary connection device 13. In addition, at the center of the common terminal 16 fitted inside the thick wall portion 12a of the upper rotary conveyor 12, the rotary body 14 of another rotary connection device 17 connects to the common terminal (1).
It is fixed concentrically with 6. As shown in FIG. 2, each of the rotational connection devices 13 and 17 includes a disc-shaped rotating body 14 whose outer surface is an electrical contact surface, and a support portion 25 rotatably supported by a support shaft 24. Consisting of The support shaft 24 has its rotary support portion 24a rotatably supported within the support portion 25 by bearings 26,26.

Between the bearings 26 and 26, there is a supporting shaft 24.
A mercury reservoir 27 is provided opposite the rotation support portion 24a, and the mercury 28 stored in the mercury reservoir 27 causes
The support shaft 24 and the support portion 25 are electrically connected. As a result, the rotating body 14 fixed to the tip of the support shaft 24 is rotated between the support shaft 24 and the mercury 2.
It is electrically connected to the support portion 25 through the support portion 8 . The rotary connection devices 13 and 17 are connected to a capacitor connection terminal of a C meter 15, as shown in FIG.

On the other hand, the shaft 23 of the rotary conveyance body 12 also has a notch cut out from the periphery toward the center corresponding to the holding groove 22 of the chip capacitor l formed in the thick part 12a of the rotary conveyance body 12. A slit disk 29 having slits 29a, 29a, . . . is attached. A light emitting diode 31 and a phototransistor 32 are arranged on one side and the other side of the slit disk 29 where the slits 29a, 29a, . . . are formed, respectively. The light emitting diode 31 emits light when power is supplied from the C meter 15, and when the light passes through the slit 29a of the slit disk 29, it enters the phototransistor 32. The output of the phototransistor 32 is input to the trigger signal input terminal of the C meter 15 as a trigger signal for starting capacitance measurement.

The slit disk 29 is inserted at a relatively early stage when the rotary body 14 of the rotary connection device 13 begins to move over the terminal electrode 4 of the chip capacitor 1 whose capacitance is to be measured.
It is fixed to the shaft 23 so that a trigger signal is input from the phototransistor 32 to the C meter 15. This is because, as can be seen from FIG. 3, the C meter 15 has a capacitance measurement time, and the rotating body 1 of the rotary connecting device
4 is rolling on the terminal electrode 4 of the chip capacitor 1 whose capacitance is to be measured, that is, while it is in electrical contact with the terminal electrode 4, the capacitance measurement by the C meter 15 is performed. This is to ensure that

In such an apparatus, chip capacitors 1 are sequentially supplied to each holding groove 22 of the thick wall portion 12a of the rotary conveyor 12, which is rotationally driven in the direction of arrow A4 in FIG. 1, by an air shooter or the like (not shown). When each chip capacitor 1 held in each of the holding grooves 22 is sequentially conveyed to the position of the rotary connection device 13 by the rotary conveyance body 12, the rotary body 14 of this rotary connection device 13
rides on top of the terminal electrode 4. At this time, since the rotary body 14 of the rotary connection device 13 is always urged toward the outer surface of the thick portion 12a of the rotary conveyor 12, each chip capacitor! is the common terminal I6 inside the holding groove 22.
is energized towards.

As a result, one terminal electrode 4 and the other terminal electrode 5 of each chip capacitor 1 transported to the position of the rotary connecting device 13 are connected to the C meter 15 by the rotary connecting devices 13 and 17, and the C meter 15 is connected to the C meter 15 by the rotary connecting devices 13 and 17. A trigger signal is input from the phototransistor 32 of the trigger device I9, and the capacitance of each chip capacitor 1 is sequentially measured. In accordance with this measurement result, another air shooter (not shown) linked to the sorting device 21 holds the chip capacitor 1 whose capacitance has been measured at the holding 11i9.
22, sorted into those with a specified capacitance and those without a specified capacitance, and stored in separate containers.

As mentioned above, using a continuously rotating rotary carrier I2 and a rotary connection device 13.17, a large number of chip capacitors l,! , ... can be measured continuously and at high speed.

In the embodiment shown in FIG. 1, the common terminal 16 is omitted and, for example, as shown in FIG.
It is also possible to transfer people from above.

Alternatively, the two sets of rotary connecting devices 13 and 17 may be configured to roll over the terminal electrodes 4 and 5 from above the chip capacitor 1, as shown in FIG.

Furthermore, the rotary connection device 13.17 side is connected to the chip capacitor 1. It may be moved relative to X, . . . .

In the above embodiment, chip capacitors l, 1. It is also possible to use a belt that linearly transports ... as a transport means.

The present invention is not limited to measuring the capacitance of chip capacitors, but can also be applied to measuring the electrical characteristics of other chip-shaped electronic components such as chip resistors.

[Brief explanation of the drawing]

Fig. 1 is an explanatory diagram of an embodiment of the electrical characteristic measuring device for chip-shaped electronic components according to the present invention, Fig. 2 is an explanatory diagram of the structure of a rotary connecting device, and Fig. 3 is a chip capacitor of a rotating body of the rotary connecting device. A time chart showing the relationship between the timing of contact with the terminal electrode and the capacitance measurement time; FIGS. 4 and 5 are explanatory diagrams of modifications of the embodiment in FIG. FIG. 7 is an explanatory diagram of a conventional electrical characteristic measuring device for chip-shaped electronic components. l... Chip capacitor, 4.5... End electrode, 1
2...Rotating conveyance body, 13...Rotating connection device, 14.
... Rotating body, 15... C meter, 17... Rotation connection device, 19... Trigger device, 22... Holding groove. Patent Applicant: Murata Manufacturing Co., Ltd. Agent: Patent Attorney: Blue and White Baka 28 Part 1 Figure 2 Figure 37! Figure 4 Figure 6

Claims (1)

[Claims] (1) A device for measuring the characteristics of a chip-shaped electronic component by electrically connecting end electrodes at both ends of the chip-shaped electronic component to a characteristic measuring device using connection means, and having a plurality of holding grooves. a conveyance means for storing and conveying a chip-shaped electronic component in each holding groove with movement in the conveyance direction restrained so that at least a part of the end electrode is exposed to the outside; A rotating body made of a good electrical conductor is arranged along the conveyance path of the chip-shaped electronic component, and rotates in contact with one end electrode of the chip-shaped electronic component, while maintaining the electrical connection. and a second connecting device that is electrically connected to the other end electrode at least when the rotating body of the first connecting device is in contact with the other end electrode. Features: Electrical property measuring device for chip-shaped electronic components.