JPH07309421A - Electronic part reversing method and reversing device using the same - Google Patents

Abstract

PURPOSE:To provide a reversing method by which an electronic part can be reliably reversed by releasing a correction of a transferring attitude when the existence of the electronic part is not recognized in a recognizing process to recognize the existence of the electronic part loaded in a groove part on an outer peripheral surface of a reversing body, and reloading it in the groove part after it is pushed back in the anti-transferring direction. CONSTITUTION:Firstly, a tip resistor 30 is transferred by correcting the transferring direction by a rectilinearly advancing feeder 1. Next, it is loaded in a groove part 21 in a reversing body 2. Though the tip resistor 30 loaded in the groove part 21 is recognized by an optical sensor 3, when the tip resistor 30 is not loaded in the groove part 21 and is not recognized by the optical sensor 3, a correction in the transferring direction of the tip resistor 30 is released, and it is pushed back in the anti-transferring direction by air delivered to the tip resistor 30 from a delivery pipe 4. Afterward, the tip resistor 30 is reloaded in the groove part 21 by vibration of the rectilinearly advancing feeder 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of inverting electronic parts such as chip resistors and capacitors, and an inverting device using the same.

[0002]

2. Description of the Related Art Generally, a method of reversing an electronic component is as follows, taking a step of accommodating a chip resistor in an editing tape as an example. As shown in FIG. 5, in the chip resistor 30, an upper surface electrode 32 and a lower surface electrode 33 made of silver palladium or the like are printed and fired on both ends of the upper surface and the lower surface of a ceramic substrate 31 which is a plate-shaped body having a predetermined thickness. A resistor 34 made of glass or the like is formed on the upper surface of the ceramic substrate 31 so as to extend over the left and right upper surface electrodes 32, and then a protective film 35 made of glass or the like is formed so as to cover the resistor 34. And in addition,
After a predetermined mark is printed on the protective film 35 by irradiating the protective film 35 with a laser beam from above, end face electrodes 36 made of silver or the like are provided on both end faces of the ceramic substrate 31. It is formed by coating and baking so as to extend over the lower electrodes 32, 33.

Such a chip resistor 30 has a needle-shaped measuring terminal (not shown) and an upper surface electrode 32 in an inspection process.
Alternatively, the resistance value is measured by contacting the lower surface electrode 33. However, since the protective film 35 covering the resistor 34 is formed on most of the surface of the upper surface electrode 32, it is difficult to bring the measuring terminal into contact with the upper surface electrode 32. It is necessary to contact with and to measure the resistance value. Therefore, the chip resistor 30 has the lower surface electrode 33.
The resistance value is measured by bringing the measuring terminal into contact with the lower surface electrode 33 with the side facing upward.

In the editing process, each chip resistor that has undergone the above process is stored in an editing tape for storing a product, and all the chip resistors are stored in the editing tape with the marking surface facing up. So it is necessary to invert the chip resistor. Conventionally, this chip resistor is inverted by a method using the following device, and each chip resistor is stored in an editing tape.

In this device, as shown in FIGS. 6 and 7, respectively, a perspective view and a cross-sectional view of an essential part, each chip resistor 30 whose resistance value has been measured is moved in a certain direction by vibrating. The linear feeder 61 is provided with a substantially columnar reversal body 62 which is disposed near the transfer end of the linear feeder 61 and is capable of intermittent rotation. The chip resistor 3 is provided on the outer peripheral surface of the reversal body 62 at regular intervals.
The groove portion 621 for loading 0 is formed, and the cover 63 for preventing the loaded chip resistor 30 from falling is provided with the reversing body 6.
2 is arranged along the outer peripheral surface. In addition, the reversal body 62
An editing tape 64 is moved in the horizontal direction (arrow direction 91 'in the figure) in conjunction with the rotation of the reversing body 62 (arrow direction 90' in the figure).

When an apparatus having such a structure is used,
First, the chip resistor 30 is transferred while being aligned by the straight-moving feeder 61 after the resistance value is measured, and the groove portion 6 of the reversing body 62 is transferred.
21 is loaded. Then, the chip resistor 30 loaded in the groove portion 621 rotates along with the rotation of the reversing body 62 so as not to drop along the cover 63, and is accommodated in the accommodation hole 641 of the editing tape 64.

[0007]

However, in the conventional chip resistor reversing method described above, as shown in FIG. 8, the chip resistor 3 transferred on the linear feeder 61 is transferred.
0 tilts or rotates on the straight advance feeder 61, and at the boundary between the straight advance feeder 61 and the groove portion 621 of the reversing body 62, the corner of the chip resistor 30 has a groove portion 621.
It is easy to interfere with the end of the groove 621 and is not placed at a predetermined position of the groove 621, so that a loading failure such as clogging at the boundary portion occurs or it falls from the groove 621 of the reversing body 62 during rotation. There is a problem in that the yield decreases and the productivity of the device is greatly deteriorated due to the occurrence of inversion defects such as burning.

To solve this, Japanese Patent Application No. 5-18922
No. 6, and as shown in FIG. 9, the groove portion 621 of the reversing body 62 at the boundary portion with the straight feeder 61.
The end 6211 of the chip resistor 30
Although a method of preventing clogging due to interference with the corners of the chip is proposed, the chip resistor 30 is
When the transfer posture is greatly tilted or rotated due to the vibration of No. 1, the above-mentioned problem cannot be completely solved because the straight feeder 61 is still clogged.

The present invention has been devised under the circumstances as described above. When reversing an electronic component, the electronic component can be surely loaded into the reversing body and the reversing can be performed without causing the reversal failure. An object of the present invention is to provide a method of reversing parts and a reversing device using the method.

[0010]

In order to solve this problem, the present invention provides a transfer step of transferring an electronic component on a transfer table while correcting the transfer posture of the electronic component, and rotating the transferred electronic component. Inversion according to the steps of loading into the grooves provided at a predetermined interval on the outer peripheral surface of the possible substantially cylindrical reversal body, the recognition step of recognizing the presence of electronic components loaded in the groove, and the recognition of the presence of electronic components. A reversing method of reversing an electronic component loaded in the groove by rotating a body, the reversing method of the electronic component when the presence of the electronic component is not recognized in the recognizing step. The present invention provides a method for reversing an electronic component, which is characterized in that the correction is released and the electronic component is pushed back in the anti-transfer direction so that the electronic component is loaded in the groove.

The present invention further has a recess on the upper surface,
A transfer table is provided on the recess for transferring the electronic component while correcting its transfer attitude, and grooves are provided on the outer peripheral surface at predetermined intervals, and the groove is intermittently provided so that the electronic parts transferred from the transfer table can be loaded. A reversing device for an electronic component, comprising: a substantially cylindrical reversible body capable of dynamic rotation; and a recognition means for recognizing an electronic component loaded in a groove of the reversing body, the reversing device being provided at a predetermined position of the transfer table. While providing a releasing means for releasing the correction of the transfer attitude of the electronic component, a pressing means for pressing the electronic component in the anti-transfer direction is disposed at a position facing the concave portion of the transfer table with the reversing body interposed therebetween. The present invention provides an electronic component reversing device.

[0012]

In this structure, the electronic components are transferred on the transfer table while correcting their transfer postures, and loaded in the grooves provided at the predetermined intervals on the outer peripheral surface of the rotatable substantially cylindrical reversal body. To be done. Then, the electronic component loaded in the groove is recognized by the recognizing means, but if the electronic component is not loaded in the groove and its existence is not recognized by the recognizing means, the electronic component is transferred on the transfer table. The correction is released by the releasing means, and after it is pushed back in the anti-transfer direction, it is loaded in the groove again.

In this case, for example, when a recess for correcting the transfer posture of the electronic component is provided on the upper surface of the transfer table, the electronic component may tilt or rotate on the recess during the transfer. Even if the inside of the recess (particularly the boundary between the transfer table and the reversing body) is clogged and the transfer is stopped, the width of the recess is temporarily widened to cancel the correction in the transfer direction. The clogging in the inside is cleared, and thereafter, the electronic component is pushed back along the concave portion in the anti-transfer direction, so that the inclination and rotation of the electronic component are corrected, and in this state, the groove is surely loaded again.

Thus, the electronic components reliably loaded in the groove portion of the reversing body are reversed by the rotation of the reversing body, and are stored in a storage body such as an editing tape provided at a predetermined position with respect to the reversing body. It is. Therefore, according to the present invention, when the electronic component is loaded into the reversing body, it can be reliably loaded into the groove portion, so that the transfer failure can be reduced and the reversing body is prevented from falling when the reversing body is rotated. Since the defects can be surely reduced, the production yield is greatly improved, and the productivity of the device is significantly improved.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIGS. 1 to 5 by taking a chip resistor as an example of an electronic component, but the present invention is not limited to this.
The chip resistor has the following structure as described above and as shown in the cross-sectional view of the main part of FIG.

That is, in the chip resistor 30, the upper and lower electrodes 32 and 33 made of silver-palladium are printed and fired on both ends of the upper and lower surfaces of a ceramic substrate 31 which is a plate having a predetermined thickness. A resistor 34 made of glass is formed on the upper surface of the substrate 31 so as to extend over the left and right upper surface electrodes 32,
Next, a protective film 35 made of glass is formed so as to cover the resistor 34, and a laser beam is applied to the protective film 35 from above to print a predetermined mark on the protective film 35. After that, the end surface electrodes 36 made of silver or the like are formed on the both end surfaces of the ceramic substrate 31, respectively.
It is formed by coating and firing so as to extend over 2, 33. In this chip resistor 30, the measurement terminal (not shown) is brought into contact with both ends of the lower surface electrode 33 with the lower surface electrode 33 side facing upward, and the resistance value is measured. It is reversed by the device and stored on the editing tape.

FIG. 1 and FIG. 2 are a perspective view and a cross-sectional view of an essential part showing an inversion device of a chip resistor. This reversing device includes a straight feeder 1 (transport table) that transports each chip resistor 30 whose resistance value has been measured while vibrating to correct the transport direction, and each chip resistor 30 transported by the straight feeder 1. Reversing body 2 made of substantially columnar iron, which is provided with groove portions 21 for loading the outer peripheral surface at predetermined intervals and is capable of intermittent rotation in the direction of arrow 90 in the figure, and the groove portion of this reversing body 2. A reflection type optical sensor 3 (recognition means) for recognizing whether the chip resistor is loaded in 21 and a position facing the linear feeder 1 via the reversing body 2 with respect to the transfer direction of the chip resistor. And a discharge pipe 4 (pressing means) for discharging air in the opposite direction to press the chip resistor.

On the upper surface of the straight feeder 1, a linear recess 11 is provided over both ends, and the chip resistor 30 is transferred on the bottom surface 12 of the recess 11 while correcting its transfer attitude. . Also, the recess 11 of the straight feeder 1
Is the top portion 1 of the recess 11 near the transfer end.
In order to widen the gap dimension 80 of 11, 112 in the horizontal direction and cancel the correction in the transfer direction of the chip resistor 30, the top portion 111 on one side is movable and the top portion 112 on the other side is fixed. A pneumatic cylinder S is provided on the movable top 111.
The (release means) is connected and fixed, and the top portion 111 is horizontally moved by the expansion and contraction movement thereof.

The reversing body 2 is arranged near the transfer end of the straight feeder 1, and the bottom surface 2b of each groove 21 of the reversing body 2 is arranged.
Is intermittently rotated so as to stop at an adjacent position on the same plane as the bottom surface 12 of the concave portion 11 of the linear feeder 1. The optical sensor 3 is arranged above the groove portion 21 so as to face the groove portion 21 adjacent to the concave portion 11 when the rotation of the reversing body 2 is stopped, and the chip resistor loaded in the groove portion 21. The presence of the chip resistor 30 is recognized by the light reflected after irradiating the chip 30. When the presence of the chip resistor 30 is recognized by the optical sensor 3, the drive signal is transmitted to the motor, the reversing body 2 starts to rotate, and the groove portion 21 is located at a position adjacent to the concave portion 11 of the linear feeder 1. Stop.

One end of the discharge pipe 4 has a groove portion 21.
It is fitted into a through hole 51 of a stopper 5 provided at a position facing the concave portion 11 of the linear feeder 1 with the other end interposed therebetween, and the other end is connected to a compressor (not shown). Also,
A cover 6 made of arc-shaped iron is arranged along the outer peripheral surface of the reversing body 2, and the cover 6 of the reversing body 2 (arrow direction 90 in the figure
The chip resistor 30 in the groove 21 is prevented from falling due to the rotation. Further, below the reversing body 2, an editing tape 7 made of paper for accommodating the chip resistor 30 is interlocked with the rotation of the reversing body 2 and shown in an arrow direction 91 in the figure.
Have moved to.

Using the inverting device having the above structure, the chip resistor 30 is inverted as follows. That is, the chip resistor 30 is first transferred on the bottom surface 12 of the recess 11 while the transfer direction is corrected by the recess 11 of the straight feeder 1 (transfer process). Then, the groove 21 in the reversal body 2 is loaded (loading step). Then, the chip resistor 30 loaded in the groove 21 is recognized by the optical sensor 3 (recognition step).
As shown in (a), when the chip resistor 30 is not loaded in the groove portion 21 and is clogged in the concave portion 11 of the linear feeder 1 and is not recognized by the optical sensor 3, the chip resistor 3
0 is the top portion 111 of the concave portion 11 of the straight feeder 1.
However, when the pneumatic cylinder 100 contracts horizontally, the space dimension 80 between the tops 111 and 112 is widened.
The correction of the transfer direction of the chip resistor 30 in the straight feeder 1 is released (see FIG. 3B).

Further, the chip resistor 30 on the straight feeder 1 is pushed back in the anti-transfer direction by the air discharged from the discharge pipe 4 to the chip resistor 30 (FIG. 3).
(See (c)). Then, the top portion 111 is horizontally moved by the extension of the pneumatic cylinder 100 and returned to the original position (see FIG. 3D).

After that, the chip resistor 30 is loaded into the groove portion 21 again by the vibration of the linear feeder 1 (see FIG. 3 (e)). In this case, the chip resistor 30 tilts or rotates on the recess 11 during the transfer due to the vibration of the rectilinear feeder 1, so that the chip resistor 30 is located inside the recess (particularly, at the boundary between the rectilinear feeder 1 and the reversing body 2). Even if the transfer is stopped due to clogging, correction of the transfer direction is canceled by temporarily widening the gap dimension 80 between the tops 111 and 112 of the recess 11, so that the clogging in the recess 11 is cleared, and then the transfer is stopped. Since the chip resistor 30 is pushed back along the recess 11 in the anti-transfer direction, the inclination and rotation of the chip resistor 30 are corrected and the chip resistor 30 is surely loaded again in the groove 21.

The chip resistor 30 securely loaded in the groove portion 21 of the reversing body 2 in this way is reversed along the cover 6 by the rotation of the reversing body 2 (reversing step), and is sequentially recorded on the editing tape 7. It is stored. In this embodiment, the linear feeder is used as the transfer table, and the chip resistor is transferred by the vibration of the linear feeder.However, the present invention is not limited to this, and the chip resistor is mechanically pressed or air is blown. You may push and move by.

Further, in the present embodiment, the reflection type optical sensor is used as the recognizing means, but the present invention is not limited to this, and it is also possible to use a transmission type optical sensor, a pressure sensor or the like. . Furthermore, in this embodiment,
Although a discharge pipe for discharging air is used as the pressing means, the present invention is not limited to this, and as shown in FIG. 4, an epoxy resin or the like that can press the chip resistor 30 by the expansion and contraction of the pneumatic cylinder 8 or the like. Alternatively, the pusher 9 may be mechanically pressed.

In addition, in this embodiment, one side of the top of the concave portion on the upper surface of the straight feeder is movable, but the other side may be moved simultaneously. Further, although the chip resistor 30 is used as the electronic component in this embodiment, it can be applied to a capacitor, a transistor, and the like, and this inversion method can be applied to products other than the above steps in the chip resistor 30. It can be applied to other manufacturing processes including the inverting process.

[Brief description of drawings]

FIG. 1 is a perspective view of a main part of an electronic component reversing device according to the present invention.

FIG. 2 is a cross-sectional view of essential parts showing a reversing device for an electronic component of the present invention.

FIG. 3 is a main part perspective view showing a modified example of the pressing means used in the electronic component reversing device of the present invention.

FIG. 4 is an explanatory diagram for explaining a method of reversing an electronic component according to the present invention.

FIG. 5 is a cross-sectional view of essential parts showing a chip resistor.

FIG. 6 is a perspective view of a main part showing a conventional device for reversing an electronic component.

FIG. 7 is a cross-sectional view of essential parts showing a conventional device for reversing an electronic component.

FIG. 8 is an explanatory diagram illustrating a state in which an electronic component is clogged on a straight-line feeder when the electronic component is inverted using a conventional electronic component inversion method.

FIG. 9 is an explanatory diagram illustrating a conventionally proposed method of reversing an electronic component.

[Explanation of symbols]

 1 Linear feeder 2 Inverter 3 Optical sensor 4 Discharge pipe 5 Stopper 6 Cover 7 Editing tape 8 Pneumatic cylinder 9 Pusher 30 Chip resistor 100 Pneumatic cylinder

Claims (2)

[Claims] 1. A transfer step of transferring an electronic component on a transfer table while correcting the transfer posture of the electronic component, and the transferred electronic component at a predetermined interval on the outer peripheral surface of a rotatable cylindrical reversal member. The loading step of loading the groove portion provided, the recognition step of recognizing the presence of the electronic component loaded in the groove portion, and the electron loaded in the groove portion by rotating the reversal body according to the recognition of the presence of the electronic component. A reversing method of reversing an electronic component, comprising: reversing the electronic component by canceling the correction of the transfer posture of the electronic component when the presence of the electronic component is not recognized in the recognition step. A method for reversing an electronic component, wherein the electronic component is loaded in the groove by pushing back in the direction. 2. A transfer table having a concave portion on the upper surface, on which the electronic component is transferred while correcting its transfer posture, and groove portions are provided on the outer peripheral surface at predetermined intervals, and the groove portion is provided on the transfer table. Of an electronic component provided with a substantially cylindrical reversible body capable of intermittent rotation so that the electronic component transferred from the can be loaded, and a recognition means for recognizing the electronic component loaded in the groove of the reversal body. In the reversing device, a releasing means for releasing the correction of the transfer posture of the electronic component is provided at a predetermined position of the transfer table, and the electronic component is provided at a position facing the recess of the transfer table with the reversing body interposed therebetween. A reversing device for electronic parts, characterized in that a pressing means for pressing the device in the opposite transfer direction is provided.