JPS63118261U - - Google Patents
Info
- Publication number
- JPS63118261U JPS63118261U JP1059187U JP1059187U JPS63118261U JP S63118261 U JPS63118261 U JP S63118261U JP 1059187 U JP1059187 U JP 1059187U JP 1059187 U JP1059187 U JP 1059187U JP S63118261 U JPS63118261 U JP S63118261U
- Authority
- JP
- Japan
- Prior art keywords
- conductor layer
- conductive material
- solder wettability
- layer made
- wiring conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1059187U JPS63118261U (enExample) | 1987-01-26 | 1987-01-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1059187U JPS63118261U (enExample) | 1987-01-26 | 1987-01-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63118261U true JPS63118261U (enExample) | 1988-07-30 |
Family
ID=30797028
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1059187U Pending JPS63118261U (enExample) | 1987-01-26 | 1987-01-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63118261U (enExample) |
-
1987
- 1987-01-26 JP JP1059187U patent/JPS63118261U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS63118261U (enExample) | ||
| JPS5920671U (ja) | プリント配線板 | |
| JPS6112201U (ja) | 配線回路基板 | |
| JPS5937737U (ja) | 集積回路塔載ボ−ド | |
| JPH0215702U (enExample) | ||
| JPS6090867U (ja) | 電気的接続手段を有する配線基板 | |
| JPS6343495U (enExample) | ||
| JPS5844871U (ja) | 配線基板 | |
| JPS59109194U (ja) | 混成集積回路装置 | |
| JPS6276571U (enExample) | ||
| JPS6284970U (enExample) | ||
| JPS6138943U (ja) | 混成集積回路 | |
| JPS6122381U (ja) | 厚膜混成集積回路 | |
| JPS58124978U (ja) | フレキシブルプリント基板 | |
| JPH0350346U (enExample) | ||
| JPS62142874U (enExample) | ||
| JPS6371532U (enExample) | ||
| JPH0392047U (enExample) | ||
| JPH0186269U (enExample) | ||
| JPH048463U (enExample) | ||
| JPS58103102U (ja) | 厚膜集積回路 | |
| JPH0244379U (enExample) | ||
| JPS62101223U (enExample) | ||
| JPH02106867U (enExample) | ||
| JPS62177075U (enExample) |