JPS63118259U - - Google Patents
Info
- Publication number
- JPS63118259U JPS63118259U JP898187U JP898187U JPS63118259U JP S63118259 U JPS63118259 U JP S63118259U JP 898187 U JP898187 U JP 898187U JP 898187 U JP898187 U JP 898187U JP S63118259 U JPS63118259 U JP S63118259U
- Authority
- JP
- Japan
- Prior art keywords
- cut
- lead frame
- laser diode
- light passing
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000012544 monitoring process Methods 0.000 claims 1
- 238000005452 bending Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Optical Head (AREA)
Description
図面は本考案半導体レーザ装置の一つの実施例
を説明するためのもので、第１図は断面図、第２
図はリードフレームを示す斜視図、第３図はボン
デイングが為された状態のリードフレームを示す
斜視図、第４図は封止前の状態を示す斜視図であ
る。
符号の説明、１……リードフレーム、２，３…
…切り起し片、４……折り曲げ部、５……打ち抜
き部、６……光通過窓を通つたレーザ光が当る部
分、７……光通過窓、８……レーザダイオード、
９……ハーフミラー、１２……モニター用フオト
デテクタ。
The drawings are for explaining one embodiment of the semiconductor laser device of the present invention, and FIG. 1 is a cross-sectional view, and FIG.
FIG. 3 is a perspective view showing the lead frame in a bonded state, and FIG. 4 is a perspective view showing the lead frame before sealing. Explanation of symbols, 1... Lead frame, 2, 3...
... Cut-and-raised piece, 4 ... Bending section, 5 ... Punching section, 6 ... Portion hit by laser light passing through the light passing window, 7 ... Light passing window, 8 ... Laser diode,
9... Half mirror, 12... Photo detector for monitor.
Claims (1)
で囲繞されて上記折曲げ部にて互いに異なる方向
に切り起された複数の切り起し片が形成され、 上記切り起し片のうちの一方の切り起し片の表
面にレーザダイオードが配置され、 他方の切り起し片には光通過窓が形成され、 上記他方の切り起し片の表面には上記レーザダ
イオードからのレーザ光を反射するハーフミラー
が配置され、 上記リードフレームの上記光通過窓を通つた上
記レーザダイオードからのレーザ光が当る部分上
にモニター用フオトデテクタが配置されてなる ことを特徴とする半導体レーザ装置。[Claims for Utility Model Registration] A lead frame is formed with a plurality of cut-out pieces surrounded by a punched-out part leaving a bent part and cut out in different directions at the bent part, A laser diode is arranged on the surface of one of the cut and raised pieces, a light passing window is formed on the other cut and raised piece, and a light passing window is formed on the surface of the other cut and raised piece from the laser diode. A semiconductor laser characterized in that a half mirror is disposed to reflect the laser beam of the lead frame, and a monitoring photodetector is disposed on a portion of the lead frame that is hit by the laser beam from the laser diode that passes through the light passage window. Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP898187U JPS63118259U (en) | 1987-01-24 | 1987-01-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP898187U JPS63118259U (en) | 1987-01-24 | 1987-01-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63118259U true JPS63118259U (en) | 1988-07-30 |
Family
ID=30793868
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP898187U Pending JPS63118259U (en) | 1987-01-24 | 1987-01-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63118259U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1031838A (en) * | 1996-04-18 | 1998-02-03 | Samsung Electron Co Ltd | Laser diode package having light output monitoring function |
| JPH1055560A (en) * | 1996-04-25 | 1998-02-24 | Samsung Electron Co Ltd | Surface laser light diode package provided with light output monitoring function |
| JP2004178755A (en) * | 2002-11-29 | 2004-06-24 | Hitachi Ltd | Optical device, optical pickup, and optical disk unit |
| WO2005112016A1 (en) * | 2004-05-13 | 2005-11-24 | Sharp Kabushiki Kaisha | Composite optical element, optical integrated unit and optical pickup |
-
1987
- 1987-01-24 JP JP898187U patent/JPS63118259U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1031838A (en) * | 1996-04-18 | 1998-02-03 | Samsung Electron Co Ltd | Laser diode package having light output monitoring function |
| JPH1055560A (en) * | 1996-04-25 | 1998-02-24 | Samsung Electron Co Ltd | Surface laser light diode package provided with light output monitoring function |
| JP2004178755A (en) * | 2002-11-29 | 2004-06-24 | Hitachi Ltd | Optical device, optical pickup, and optical disk unit |
| WO2005112016A1 (en) * | 2004-05-13 | 2005-11-24 | Sharp Kabushiki Kaisha | Composite optical element, optical integrated unit and optical pickup |