JPS6379660U - - Google Patents
Info
- Publication number
- JPS6379660U JPS6379660U JP17268886U JP17268886U JPS6379660U JP S6379660 U JPS6379660 U JP S6379660U JP 17268886 U JP17268886 U JP 17268886U JP 17268886 U JP17268886 U JP 17268886U JP S6379660 U JPS6379660 U JP S6379660U
- Authority
- JP
- Japan
- Prior art keywords
- bending part
- lead terminals
- lead
- metal frame
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Description
第１図は本考案に係るリードフレーム斜視図第
２図はその要部断面図第３図は本考案を適用する
光半導体素子の光路を示す図第４図は第３図に示
す装置の特性を示す図第５図は従来のリードフレ
ーム斜視図第６図はその要部断面図第７図は光半
導体装置の断面図である。
FIG. 1 is a perspective view of a lead frame according to the present invention. FIG. 2 is a cross-sectional view of a main part thereof. FIG. 3 is a diagram showing the optical path of an optical semiconductor element to which the present invention is applied. FIG. 4 is a characteristic of the device shown in FIG. FIG. 5 is a perspective view of a conventional lead frame, FIG. 6 is a sectional view of a main part thereof, and FIG. 7 is a sectional view of an optical semiconductor device.
Claims (1)
を設け、このリード端子を補強する金属細条を形
成し、１対のリード端子で構成する単位体の一方
の端に前記金属製枠体に沿う折曲部を設け、この
折曲部頂面に断面皿状の収容部を配置し、その相
対向する面をｙ＝０．１ｘ２〜４ｘ２からなる回
転放物線で構成することを特徴とするリードフレ
ーム。 A plurality of lead terminals are provided in a row at one end of the metal frame, metal strips are formed to reinforce the lead terminals, and one end of a unit constituted by a pair of lead terminals is attached to the metal frame. It is characterized by providing a bending part along the bending part, arranging a housing part having a dish-shaped cross section on the top surface of the bending part, and configuring the opposing surfaces with a parabola of rotation consisting of y=0.1x 2 to 4x 2 . lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17268886U JPS6379660U (en) | 1986-11-12 | 1986-11-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17268886U JPS6379660U (en) | 1986-11-12 | 1986-11-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6379660U true JPS6379660U (en) | 1988-05-26 |
Family
ID=31109456
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17268886U Pending JPS6379660U (en) | 1986-11-12 | 1986-11-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6379660U (en) |
-
1986
- 1986-11-12 JP JP17268886U patent/JPS6379660U/ja active Pending