JPH0338646U - - Google Patents
Info
- Publication number
- JPH0338646U JPH0338646U JP9949789U JP9949789U JPH0338646U JP H0338646 U JPH0338646 U JP H0338646U JP 9949789 U JP9949789 U JP 9949789U JP 9949789 U JP9949789 U JP 9949789U JP H0338646 U JPH0338646 U JP H0338646U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- external
- semiconductor package
- frames
- lead frames
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案に係る半導体パツケージ用連結
型リードフレームの一実施例を示す斜視図、第２
図は第１図に示すリードフレームを使用した半導
体素子収納用パツケージの要部拡大側面図、第３
図は従来の半導体素子収納用パツケージの断面図
、第４図ａは第３図に示すパツケージに使用する
半導体パツケージ用連結型リードフレームの斜視
図、第４図ｂは第４図ａの要部拡大側面図である
。
２…外部リード端子、３…リードフレーム、４
…連結部材、７…切り欠き部。
FIG. 1 is a perspective view showing one embodiment of a connected lead frame for a semiconductor package according to the present invention, and FIG.
The figure is an enlarged side view of the main parts of a package for storing semiconductor elements using the lead frame shown in Figure 1,
The figure is a sectional view of a conventional package for storing semiconductor elements, FIG. 4a is a perspective view of a connected lead frame for a semiconductor package used in the package shown in FIG. 3, and FIG. 4b is a main part of FIG. 4a. It is an enlarged side view. 2...External lead terminal, 3...Lead frame, 4
...Connecting member, 7... Notch portion.
Claims (1)
部リード端子が複数個、櫛歯状に取着されて成る
リードフレームの一対を、その両端で連結部材を
介し連結して成る半導体パツケージ用連結型リー
ドフレームにおいて、前記リードフレームの夫々
に、一辺が最外部に位置する外部リード端子の外
側辺に沿つた切り欠き部を設けたことを特徴とす
る半導体パツケージ用連結型リードフレーム。 A connected lead for a semiconductor package, which is made by connecting a pair of lead frames, each of which has a plurality of external lead terminals attached in a comb-like shape, for connecting the electrodes of a semiconductor element to an external electric circuit, through a connecting member at both ends. 1. A connected lead frame for a semiconductor package, wherein each of the lead frames is provided with a notch portion along an outer side of an external lead terminal with one side located at the outermost side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9949789U JPH083020Y2 (en) | 1989-08-25 | 1989-08-25 | Connected lead frame for semiconductor package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9949789U JPH083020Y2 (en) | 1989-08-25 | 1989-08-25 | Connected lead frame for semiconductor package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0338646U true JPH0338646U (en) | 1991-04-15 |
| JPH083020Y2 JPH083020Y2 (en) | 1996-01-29 |
Family
ID=31648543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9949789U Expired - Lifetime JPH083020Y2 (en) | 1989-08-25 | 1989-08-25 | Connected lead frame for semiconductor package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH083020Y2 (en) |
-
1989
- 1989-08-25 JP JP9949789U patent/JPH083020Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH083020Y2 (en) | 1996-01-29 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |