JPS6172871U - - Google Patents

Info

Publication number
JPS6172871U
JPS6172871U JP15684184U JP15684184U JPS6172871U JP S6172871 U JPS6172871 U JP S6172871U JP 15684184 U JP15684184 U JP 15684184U JP 15684184 U JP15684184 U JP 15684184U JP S6172871 U JPS6172871 U JP S6172871U
Authority
JP
Japan
Prior art keywords
semiconductor laser
laser chip
package
monitoring
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15684184U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15684184U priority Critical patent/JPS6172871U/ja
Publication of JPS6172871U publication Critical patent/JPS6172871U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図及び第2図A,Bは本考案半導体レーザ
装置の実施の一例を説明するためのもので、第1
図は装置全体を示す分解斜視図、第2図Aは要部
平面図、同図Bは同図AのB−B線に沿う断面図
、第3図A,Bは本考案半導体レーザ装置の各別
の変形例を示す要部平面図、第4図は本考案半導
体レーザ装置の別の実施例の要部を示す斜視図、
第5図は本考案半導体レーザ装置の更に別の実施
例の要部を示す平面図、第6図は従来例を示す断
面図である。 符号の説明、1,19……パツケージ、6……
半導体レーザチツプ、13,13a……レーザダ
イオード形成領域、14……モニター用フオトダ
イオード、16,1……反射手段。
FIG. 1 and FIGS. 2A and 2B are for explaining an example of implementation of the semiconductor laser device of the present invention.
The figure is an exploded perspective view showing the entire device, FIG. 2A is a plan view of the main part, FIG. 2B is a cross-sectional view taken along line B-B in FIG. FIG. 4 is a perspective view showing the main parts of another embodiment of the semiconductor laser device of the present invention;
FIG. 5 is a plan view showing a main part of still another embodiment of the semiconductor laser device of the present invention, and FIG. 6 is a sectional view showing a conventional example. Explanation of symbols, 1, 19...Package, 6...
Semiconductor laser chip, 13, 13a... Laser diode formation region, 14... Monitoring photodiode, 16, 1... Reflection means.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体レーザチツプをパツケージ内に収納した
半導体レーザ装置において、上記半導体レーザチ
ツプのレーザダイオードが形成されていない領域
内にモニター用フオトダイオードを形成し、上記
パツケージ内の半導体レーザチツプ収納部近傍に
上記半導体レーザチツプのレーザダイオード形成
領域から投射されたモニター用レーザ光を上記モ
ニター用フオトダイオードへ反射する反射手段を
存在せしめてなることを特徴とする半導体レーザ
装置。
In a semiconductor laser device in which a semiconductor laser chip is housed in a package, a monitoring photodiode is formed in a region of the semiconductor laser chip where no laser diode is formed, and the laser of the semiconductor laser chip is placed near the semiconductor laser chip storage area in the package. 1. A semiconductor laser device comprising a reflecting means for reflecting a monitoring laser beam projected from a diode forming region onto the monitoring photodiode.
JP15684184U 1984-10-17 1984-10-17 Pending JPS6172871U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15684184U JPS6172871U (en) 1984-10-17 1984-10-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15684184U JPS6172871U (en) 1984-10-17 1984-10-17

Publications (1)

Publication Number Publication Date
JPS6172871U true JPS6172871U (en) 1986-05-17

Family

ID=30714847

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15684184U Pending JPS6172871U (en) 1984-10-17 1984-10-17

Country Status (1)

Country Link
JP (1) JPS6172871U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017139416A (en) * 2016-02-05 2017-08-10 三菱電機株式会社 Optical module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017139416A (en) * 2016-02-05 2017-08-10 三菱電機株式会社 Optical module

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