JPS6311742Y2 - - Google Patents
Info
- Publication number
- JPS6311742Y2 JPS6311742Y2 JP1981092723U JP9272381U JPS6311742Y2 JP S6311742 Y2 JPS6311742 Y2 JP S6311742Y2 JP 1981092723 U JP1981092723 U JP 1981092723U JP 9272381 U JP9272381 U JP 9272381U JP S6311742 Y2 JPS6311742 Y2 JP S6311742Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- pellets
- inner peripheral
- peripheral edge
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000008188 pellet Substances 0.000 claims description 15
- 230000002093 peripheral effect Effects 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 description 8
- 210000000078 claw Anatomy 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 238000007789 sealing Methods 0.000 description 4
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Description
【考案の詳細な説明】
この考案は、半導体装置の基板となるリードフ
レームの構造改善に関するものである。[Detailed Description of the Invention] This invention relates to an improvement in the structure of a lead frame that serves as a substrate for a semiconductor device.
半導体装置は、組立構造によると、樹脂封止型
と罐ケース型とに区別され、現在では、前者が安
価で量産性に富むので多数を占めている。そし
て、樹脂封止型半導体装置のペレツトマウント基
板となるリードフレームは、パワートランジスタ
を例に採れば、第１図に示すように、放熱板兼用
のペレツトマウント部であり厚肉のベースリボン
部１と、外部導出リードを格子状に設定した薄肉
のリード部２とを備えたものが一般的である。さ
らにこのリードフレームについて説明すると、ベ
ースリボン部１は、ペレツト３，３……を半田
４，４……を介して夫々固着する被固着部５，５
……と、ネジ止め等により半導体装置を取付けす
るための取付孔６，６……を設け破線で囲んだ外
皮樹脂封止領域７，７……より露出している取付
部８，８……よりなつている。またリード部２
は、その被固着部５，５……側の端部は、ベース
リード９，９……及びエミツタリード１０，１０
……については、内部金属細線１１，１１……及
び１２，１２……とワイヤボンデングさせるため
に拡開し、コレクタリード１３，１３……につい
ては、被固着部５，５……と、第２図で明らかな
ようにクランク状に屈曲させた形状である。 Semiconductor devices are classified into resin-sealed type and can-case type based on their assembly structure, and the former is currently in the majority because it is inexpensive and easy to mass-produce. Taking a power transistor as an example, the lead frame that becomes the pellet mount substrate of a resin-sealed semiconductor device is a pellet mount part that also serves as a heat sink, and is made of a thick base ribbon, as shown in Figure 1. Generally, the device is provided with a thin lead portion 2 in which external leads are arranged in a grid pattern. To further explain this lead frame, the base ribbon part 1 has fixed parts 5, 5 to which pellets 3, 3, . . . are fixed via solders 4, 4, .
. . . and mounting holes 6, 6, . It's getting more familiar. Also, the lead part 2
The end of the fixed portion 5, 5... side is connected to the base leads 9, 9... and the emitter leads 10, 10.
... are expanded for wire bonding with the internal thin metal wires 11, 11... and 12, 12..., and the collector leads 13, 13... are expanded with the fixed parts 5, 5..., As is clear from FIG. 2, it has a crank-like bent shape.
ところで、上述したリードフレームを半田４，
４……によりペレツトマウントする際には、リー
ドフレームを摺動レール上に置き、定ピツチ間隔
になつている取付孔６，６……へ送り爪（図示省
略）を係合させて定ピツチ間隔の間欠移送を行つ
て、半田仮固着ヘツド、さらに半田加熱溶融ヘツ
ドへ送つて、個々のペレツトを溶融半田上へ載置
して自然冷却半田固着を行わせるやり方が一般的
である。しかるに、このリードフレームは、前述
のペレツトマウント時に、半田加熱溶融を行つた
りすると、厚肉のベースリボン部１は、薄肉のリ
ード部２に比べて熱膨張が著しく、第３図に示す
通り、弓形にわん曲することが多々ある。そのた
めに、ペレツトマウント工程における送り爪が取
付孔６，６……へ係合不良のまま不完全な移送を
行う欠点があつた。 By the way, solder 4,
4. When pellet mounting with..., place the lead frame on the sliding rail, and engage the feed claws (not shown) to the mounting holes 6, 6..., which are spaced at a fixed pitch, to set the lead frame at a fixed pitch. It is common practice to transfer pellets intermittently at intervals to send them to a temporary solder fixing head and then to a solder heating and melting head, placing individual pellets on the molten solder and allowing natural cooling to effect solder fixation. However, when this lead frame is heated and melted with solder during pellet mounting as described above, the thick base ribbon portion 1 undergoes significant thermal expansion compared to the thin lead portion 2, as shown in FIG. It often curves into an arched shape. For this reason, there was a drawback that the feeding claws in the pellet mounting process were not fully engaged with the mounting holes 6, 6, and transferred the pellets incompletely.
この考案は、上記の欠点是生のために提案する
もので、取付孔等の送り爪係合孔内面に、リード
フレーム板厚よりも著しく薄肉の内周縁部を設け
ることを特徴としている。以下に、この考案の実
施例を説明する。 This invention is proposed to overcome the above-mentioned drawbacks, and is characterized by providing an inner peripheral edge portion that is significantly thinner than the thickness of the lead frame plate on the inner surface of the feed pawl engaging hole such as the mounting hole. Examples of this invention will be described below.
第４図は、この考案の実施例を示す樹脂封止型
パワートランジスタ用のリードフレームの平面図
で、第１図に示した従来のものと同一図番は同一
名称で、異るところは、取付部８，８……に設け
られている取付孔１４，１４……で、その内周縁
部１５，１５……を放射状等間隔に施した切り込
み１６，１６，１６，……を有し、取付部８，８
……の肉厚、すなわちベースリボン部１の板厚に
対して著しく薄肉に説定した点である。内周縁部
１５，１５……の具体的寸法は、ベースリボン部
１の板厚が、Ｉ−Ｉ線にて切断した断面を拡大し
て示す第５図における寸法Ｔ＝1.8mmの場合、内
周縁部１５，１５……の肉厚ｔ＝0.2mm程度が好
適で、取付孔径φ＝3.6mmの場合、内周縁部径φ
＝3.0mm程度に設定すればよい。 FIG. 4 is a plan view of a lead frame for a resin-sealed power transistor showing an embodiment of this invention. The same figure numbers as the conventional one shown in FIG. 1 have the same names, and the differences are as follows. The mounting holes 14, 14... provided in the mounting parts 8, 8... have notches 16, 16, 16,... made at equal radial intervals on the inner peripheral edges 15, 15..., Mounting part 8, 8
. . . , which is assumed to be significantly thinner than the plate thickness of the base ribbon portion 1. The specific dimensions of the inner peripheral edge portions 15, 15, . It is preferable that the wall thickness t of the peripheral edges 15, 15... is approximately 0.2 mm, and when the mounting hole diameter φ = 3.6 mm, the inner peripheral edge diameter φ
It is sufficient to set it to approximately 3.0 mm.
上記したリードフレームは、ペレツトマウント
位置まで送り爪にて従来通り係合して移送し、停
止させる場合に、次に述べる理由により正確な移
送が行える。まず、リードフレームが第３図のよ
うにわん曲し、第６図に示すとおり、取付孔１４
の中心線１７と移送停止位置決めピン１８の中心
軸線１９とがずれた時でも、第７図のとおりに位
置決めピン１８が降下すると、内周縁部１５へ当
接して一部を下方へ押し曲げて、フツク２０を形
成する。したがつて、中心線１７と中心軸線１９
とがずれていても位置決めピン１８の径寸法ｒと
取付孔径φ及び内周縁部径φとを適切な組合せで
設定することにより、位置決めピン１８を必ず取
付孔１４内へ挿入してリードフレームの移送停止
が図れる。しかも、フツク２０を形成した内周縁
部１５は、リードフレームの曲り方向を知る目印
となり好都合である。 When the above-mentioned lead frame is conventionally engaged and transported by the feed claw to the pellet mount position and then stopped, accurate transport can be achieved for the following reasons. First, the lead frame is bent as shown in Fig. 3, and the mounting hole 14 is
Even when the center line 17 of the transfer stop positioning pin 18 deviates from the center axis 19 of the transfer stop positioning pin 18, when the positioning pin 18 descends as shown in FIG. , forming a hook 20. Therefore, the center line 17 and the center axis 19
Even if the positioning pin 18 is misaligned, by setting the diameter r of the positioning pin 18, the mounting hole diameter φ, and the inner peripheral edge diameter φ in an appropriate combination, the positioning pin 18 can be inserted into the mounting hole 14 and the lead frame can be fixed. Transfer can be stopped. Furthermore, the inner peripheral edge 15 on which the hook 20 is formed is convenient as a mark for determining the bending direction of the lead frame.
尚以上の実施例では送り爪係合孔である取付孔
１４が外皮樹脂封止領域７外に在る場合であつた
が、この考案では、勿論リードフレーム移送用で
送り爪係合孔が外皮樹脂封止領域内に在つてもよ
く、この場合内周縁部に生じるフツクがリードフ
レームと樹脂とをかしめ付けることにもなる。 In the above embodiment, the mounting hole 14, which is the feed claw engagement hole, is located outside the outer skin resin sealing area 7, but in this invention, of course, the feed claw engagement hole is for transferring the lead frame. The lead frame may be located within the resin sealing area, and in this case, the hook generated at the inner peripheral edge also caulks the lead frame and the resin.
結局この考案によれば、リードフレームがペレ
ツトマウント時の半田溶融熱等によりわん曲した
りしても位置決めピンによる正確な移送停止が行
え、しかも何ら移送駆動機構側の変更を為さずに
実施できる優れた利点を生じる。さらにこの考案
によれば、樹脂封止を行う際のリードフレームと
樹脂との付着強化のフツクともなり、樹脂の気密
封止性向上にも役立つ点でも優れており、半導体
装置の信頼性向上に貢献することができる。 In the end, according to this invention, even if the lead frame is bent due to solder melting heat during pellet mounting, the transfer can be stopped accurately using the positioning pin, and without making any changes to the transfer drive mechanism. It yields great benefits that can be implemented. Furthermore, this invention is excellent in that it serves as a hook to strengthen the adhesion between the lead frame and the resin when performing resin sealing, and also helps improve the hermetic sealing properties of the resin, thereby improving the reliability of semiconductor devices. can contribute.
第１図及び第２図は、従来の半導体装置用リー
ドフレームの平面図及び側面図、第３図は、その
一部の拡大平面図、第４図はこの考案の実施例を
示す半導体装置用リードフレームの平面図、第５
図は、そのＩ−Ｉ線にて切断した拡大断面図、第
６図及び第７図は、リードフレーム移送停止する
場合のリードフレームと位置決めピンの要部断面
図である。
１……ベースリボン部、２……リード部、３…
…ペレツト、１４……送り爪係合孔（取付孔）、
１５……内周縁部。
1 and 2 are a plan view and a side view of a conventional lead frame for a semiconductor device, FIG. 3 is an enlarged plan view of a part thereof, and FIG. 4 is a lead frame for a semiconductor device showing an embodiment of this invention. Top view of lead frame, fifth
The figure is an enlarged sectional view taken along the line I--I, and FIGS. 6 and 7 are sectional views of main parts of the lead frame and positioning pin when the lead frame transfer is stopped. 1...Base ribbon part, 2...Lead part, 3...
...Pellet, 14...Feed claw engagement hole (mounting hole),
15...Inner peripheral edge.
Claims (1)
ドフレームであつて、夫々の素子区画の間隔に対
応して送り爪係合孔を設けて、定ピツチ間隔移送
を行い、ペレツトマウントを行うものにおいて、
前記送り爪係合孔内面にリードフレーム板厚より
も著しく薄肉の内周縁部を設けたことを特徴とす
る半導体装置用リードフレーム。 A lead frame having a multiple structure to which a large number of pellets are fixed respectively, in which feed pawl engagement holes are provided corresponding to the spacing of each element section, and the pellets are transferred at fixed pitch intervals to mount the pellets. ,
A lead frame for a semiconductor device, characterized in that an inner peripheral edge portion that is significantly thinner than the lead frame board thickness is provided on the inner surface of the feed pawl engaging hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981092723U JPS6311742Y2 (en) | 1981-06-22 | 1981-06-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981092723U JPS6311742Y2 (en) | 1981-06-22 | 1981-06-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57203562U JPS57203562U (en) | 1982-12-24 |
| JPS6311742Y2 true JPS6311742Y2 (en) | 1988-04-05 |
Family
ID=29887738
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981092723U Expired JPS6311742Y2 (en) | 1981-06-22 | 1981-06-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6311742Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5324780A (en) * | 1976-08-20 | 1978-03-07 | Hitachi Ltd | Lead frame |
| JPS5426359B2 (en) * | 1973-10-19 | 1979-09-03 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5399962U (en) * | 1977-01-14 | 1978-08-12 | ||
| JPS5426359U (en) * | 1977-07-25 | 1979-02-21 |
-
1981
- 1981-06-22 JP JP1981092723U patent/JPS6311742Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5426359B2 (en) * | 1973-10-19 | 1979-09-03 | ||
| JPS5324780A (en) * | 1976-08-20 | 1978-03-07 | Hitachi Ltd | Lead frame |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57203562U (en) | 1982-12-24 |
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