JPS63116449A - Airtight sealing adhesive for solid-state image pickup device - Google Patents
Airtight sealing adhesive for solid-state image pickup deviceInfo
- Publication number
- JPS63116449A JPS63116449A JP61261822A JP26182286A JPS63116449A JP S63116449 A JPS63116449 A JP S63116449A JP 61261822 A JP61261822 A JP 61261822A JP 26182286 A JP26182286 A JP 26182286A JP S63116449 A JPS63116449 A JP S63116449A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- filler
- solid
- adhesive
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012945 sealing adhesive Substances 0.000 title abstract description 3
- 239000000853 adhesive Substances 0.000 claims abstract description 26
- 230000001070 adhesive effect Effects 0.000 claims abstract description 26
- 239000003822 epoxy resin Substances 0.000 claims abstract description 24
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 24
- 239000000945 filler Substances 0.000 claims abstract description 19
- 238000003384 imaging method Methods 0.000 claims description 17
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 10
- 238000002156 mixing Methods 0.000 abstract description 7
- 239000000843 powder Substances 0.000 abstract description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 4
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 abstract description 3
- 239000000395 magnesium oxide Substances 0.000 abstract description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 abstract description 3
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 abstract description 3
- 239000010453 quartz Substances 0.000 abstract description 3
- 239000000377 silicon dioxide Substances 0.000 abstract description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 abstract description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 abstract description 2
- 239000004848 polyfunctional curative Substances 0.000 abstract 3
- 239000011521 glass Substances 0.000 description 18
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
- 239000000919 ceramic Substances 0.000 description 7
- 239000004593 Epoxy Substances 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- -1 amine compounds Chemical class 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005562 fading Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000005297 pyrex Substances 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明はＣＣＤ （Ｃｈａｒｇｅ Ｃｏｕｐｌｅｄ Ｄ
ｅｖｉｃｅ）等の固体撮像素子をパッケージに収納し透
光性ガラス板からなるガラスキャップで気密封止する際
使用する接着剤に関するものである。[Detailed Description of the Invention] <Industrial Application Field> The present invention is directed to CCD (Charge Coupled D
The present invention relates to an adhesive used when a solid-state imaging device such as an electronic device is housed in a package and hermetically sealed with a glass cap made of a translucent glass plate.
〈従来の技術〉
近年、カラービデオカメラ等の用途に固体カラー撮像素
子を用いたカラー固体撮像装置の研究開発が盛んに行わ
れている。固体カラー撮像素子はＣＣＤＸＭＯ８などの
固体撮像素子の感光面に色フイルタ−アレイを形成した
もので通常集積回路素子と同様にパッケージ内に気密封
止されてカラー固体撮像装置として使用に供せられる。<Prior Art> In recent years, research and development of color solid-state imaging devices using solid-state color imaging elements for applications such as color video cameras has been actively conducted. A solid-state color imaging device is a solid-state imaging device such as CCDXMO8 with a color filter array formed on the photosensitive surface thereof, and is normally hermetically sealed in a package like an integrated circuit device and used as a color solid-state imaging device.
ところで、従来のカラー固体撮像装置の気密封止方法は
、セラミックパッケージにカラー固体撮像素子を収納固
定し、フリットと呼ばれる低融点ガラスからなる接着剤
を使用して石英板もしくはバイレックスなどの硬質ガラ
ス板をパッケージ開口部をふさぐようにパッケージ上に
載置し、そのまま２００℃以上の焼成炉に適用すること
により、低融点ガラスの接着剤を溶かし、パッケージと
ガラス板とを接着するというものであった。By the way, the conventional method for hermetically sealing a color solid-state image sensor is to house and fix the color solid-state image sensor in a ceramic package, and then attach it to a hard glass such as a quartz plate or Vilex using an adhesive made of low-melting glass called a frit. The plate is placed on the package so as to cover the package opening, and the plate is placed in a firing furnace at temperatures of 200°C or higher to melt the low-melting point glass adhesive and bond the package and glass plate. Ta.
ところが、このような従来の方法によると、セラミック
パッケージとガラス板全体の温度を上昇しなければなら
ず、したがって固体撮像素子に形成された色フイルタ−
アレイもパッケージと同時に２００℃近（まで温度が上
がってしまい、色フィルターアレイの色特性が劣化した
り、色フィルターが変化して十分な特性が得られなくな
るという欠点があった。このため、特別に変色や退色が
起こらないように耐熱処理をしたり、特別な色素を用い
るなどの対策もとられるが、工程が複雑になるため歩留
まりが悪（高価になったり、分光特性が悪（なり、撮像
して得られたカラー画像の色調が悪（なるなどの欠点が
あった。However, according to such conventional methods, it is necessary to raise the temperature of the entire ceramic package and glass plate, and therefore the color filter formed on the solid-state image sensor
The temperature of the array also rises to nearly 200℃ at the same time as the package, which has the disadvantage of deteriorating the color characteristics of the color filter array or changing the color filter, making it impossible to obtain sufficient characteristics. Measures such as heat-resistant treatment or the use of special dyes are taken to prevent discoloration or fading, but this complicates the process, resulting in poor yields (more expensive, poor spectral characteristics, etc.). There were drawbacks such as poor color tone in the color images obtained.
尚、低温で接着する有機の接着剤も提案されているが、
十分な気密性を得ることは困難であり、信頼性の高いカ
ラー固体撮像装置を実現することは困難であった。Additionally, organic adhesives that bond at low temperatures have also been proposed;
It has been difficult to obtain sufficient airtightness, and it has been difficult to realize a highly reliable color solid-state imaging device.
〈発明が解決しようとする問題点〉
本発明は斯かる点に鑑みてなされたもので固体カラー撮
像素子の色フイルタ−アレイを変質させることな（、シ
かも固体撮像装置として十分なる気密性と信頼性を確保
できる気密封止用接着剤を提供するものである。<Problems to be Solved by the Invention> The present invention has been made in view of the above-mentioned problems, and it is possible to achieve sufficient airtightness as a solid-state image sensor without deteriorating the color filter array of the solid-state color image sensor. The present invention provides an airtight sealing adhesive that can ensure reliability.
く問題点を解決するための手段〉
本発明は、エポキシ樹脂、硬化剤および充填剤を含有す
ることを特徴とし、とくに前記エポキシ樹脂１００重量
部に対して前記充填剤が２０〜４００重量部配合する合
口が好適であるところの固体撮像装置の気密封止用接着
剤である。Means for Solving Problems> The present invention is characterized by containing an epoxy resin, a curing agent, and a filler, and in particular, the filler is blended in an amount of 20 to 400 parts by weight per 100 parts by weight of the epoxy resin. This is an adhesive for airtight sealing of a solid-state imaging device, which has a suitable abutment.
本発明を構成するエポキシ樹脂はビスフェノールＡ型エ
ポキシ樹脂、ビスフェノールＳ型エポキシ樹脂、脂環式
エポキシ樹脂、フェノールノボラック型エポキシ樹脂、
タレゾールノボラック型エポキシ樹脂等が挙げられ、こ
れらの樹脂の単独又は混合系で用いられる。The epoxy resins constituting the present invention include bisphenol A type epoxy resin, bisphenol S type epoxy resin, alicyclic epoxy resin, phenol novolac type epoxy resin,
Examples include Talesol novolac type epoxy resin, and these resins can be used alone or in a mixed system.
前記エポキシ樹脂を硬化せしめるための硬化剤としては
イミダゾール、ジシアンジアミド等のアミン系化合物、
芳香族系酸無水物、脂肪族系酸無水物等が用いられる。The curing agent for curing the epoxy resin includes amine compounds such as imidazole and dicyandiamide;
Aromatic acid anhydrides, aliphatic acid anhydrides, etc. are used.
一方、本発明に用いられる充填剤としては、シリカ、石
英粉、アルミナ、炭酸カルシウム、酸化マグネシウムの
如き無機質粉末が好適に用いられが、充填機能を具備し
ていれば有機質粉末でも本発明に適用できる。この場合
、前記エポキシ樹脂と充填剤との配合比は、ペースト状
接着剤にした場合のエポキシ樹脂の粘性とか充填剤の粒
子径、比表面積等の物性値により任意に設定することが
できるが、本発明ではエポキシ樹脂１００！量部に対し
て充填剤２０〜４００重量部の配合比で実施することが
好ましい。On the other hand, as the filler used in the present invention, inorganic powders such as silica, quartz powder, alumina, calcium carbonate, and magnesium oxide are preferably used, but organic powders are also applicable to the present invention as long as they have a filling function. can. In this case, the blending ratio of the epoxy resin and filler can be arbitrarily set depending on the viscosity of the epoxy resin when used as a paste adhesive, the particle size of the filler, specific surface area, and other physical properties. In the present invention, epoxy resin 100! It is preferable to use a blending ratio of 20 to 400 parts by weight of the filler.
すなわち、本発明の接着剤を構成する充填剤は、セラミ
ックパッケージとガラスキャップを接着し、装置を気密
封止するのに必要な５０〜２００ｐｍという所望の塗布
厚さを均一にガラス板上に形成する機能を有する。この
場合の塗布厚さはガラス板上に塗布した接着剤層の脱溶
剤後の厚さをいうものとする。That is, the filler constituting the adhesive of the present invention can be uniformly formed on a glass plate to a desired coating thickness of 50 to 200 pm, which is necessary for bonding the ceramic package and the glass cap and hermetically sealing the device. It has the function of The coating thickness in this case refers to the thickness of the adhesive layer coated on the glass plate after the solvent is removed.
従って充填剤の配合比が２０重量部以下であると前述の
如き接着層もしくは接着面が得に（いことになり、又、
４００ｆｆｆｔ部以上であるとセラミックパッケージと
ガラス板との接着性が低下することになる。Therefore, if the blending ratio of the filler is 20 parts by weight or less, the adhesive layer or the adhesive surface as described above will not be as good.
If it is more than 400 ffft, the adhesiveness between the ceramic package and the glass plate will deteriorate.
なお、本発明の接着剤には、必要に応じて硬化促進剤、
流動調整剤、着色剤等の添加剤を配合してもよい。Note that the adhesive of the present invention may contain a curing accelerator and
Additives such as flow regulators and colorants may also be blended.
本発明の接着剤を作製するには、前記エポキシ樹脂、硬
化剤および充填剤を芳香族もしくはケトン糸環適当な溶
剤に溶解分散すればよい。To prepare the adhesive of the present invention, the epoxy resin, curing agent, and filler may be dissolved and dispersed in a suitable aromatic or ketone solvent.
得られた本発明の接着剤はスクリーン印刷等の手段を用
いてガラス板の周縁部に印刷して塗布層を形成し、真空
乾燥により接着剤ペースト中の溶剤を除去しエポキシ樹
脂を一旦半硬化して保管を容易にし固体撮像装置の気密
封止に備える。The obtained adhesive of the present invention is printed on the peripheral edge of a glass plate using a method such as screen printing to form a coating layer, and the solvent in the adhesive paste is removed by vacuum drying, and the epoxy resin is once semi-hardened. It facilitates storage and prepares for hermetically sealing the solid-state imaging device.
以下実施例により本発明の詳細な説明する。なお、配合
部数は全て重量部で示す。The present invention will be explained in detail below with reference to Examples. All blended parts are shown in parts by weight.
〈実施例〉
実施例１
エポキシ当量４５０ｇ／ｅｑのビスフェノールＡ型エポ
キシ樹脂（油化シェルエポキシ社製、エピコート１００
１）１００部と、硬化剤としての２−７エニルイミダゾ
ール（四国ファインケミカル社製、キュアゾール２ＰＺ
）５部をメチルエチルケトン３０部に溶解し、さらに充
填剤として酸化マグネシウムを１５０部配合口三本ロー
ルにて混線分散して本発明の接着剤を作製した。<Example> Example 1 Bisphenol A epoxy resin with an epoxy equivalent of 450 g/eq (manufactured by Yuka Shell Epoxy Co., Ltd., Epicoat 100)
1) 100 parts and 2-7 enylimidazole as a curing agent (manufactured by Shikoku Fine Chemical Co., Ltd., Curesol 2PZ
) was dissolved in 30 parts of methyl ethyl ketone, and 150 parts of magnesium oxide as a filler was cross-dispersed using a three-roll blending port to prepare the adhesive of the present invention.
得られた接着剤をスクリーン印刷法にて、厚さ０．９部
ｗｎ、寸法１０ｍ＋ｎ四方のガラス板（ダウコーニング
社製、パイレックス）に乾燥後の塗布厚が１２０部ｍと
なるよう塗布印刷し、真空中にて５０〜８０℃で６０分
の加熱をおこない溶剤を除去して半硬化状の接着層を有
するガラスキャップを作製した。The obtained adhesive was coated and printed using a screen printing method on a glass plate (manufactured by Dow Corning, Pyrex) with a thickness of 0.9 parts wn and dimensions of 10 m + n so that the coating thickness after drying was 120 parts m. The solvent was removed by heating in vacuum at 50 to 80° C. for 60 minutes to produce a glass cap having a semi-cured adhesive layer.
然るのち固体カラー撮像素子を収納したセラミックパッ
ケージの開口部に該ガラスキャップの接着剤面を載置し
、接着面を押圧しながら真空中にて１５０℃位の温度で
加熱しＮ２ガスを封入しながら接着剤層を本硬化し装置
の気密封止をおこなった。この際感光面の色フイルタ−
アレイは何ら変質が認められなかった。Thereafter, the adhesive side of the glass cap was placed on the opening of the ceramic package housing the solid-state color image sensor, and while the adhesive side was pressed, it was heated in a vacuum at a temperature of about 150°C and N2 gas was sealed. While doing so, the adhesive layer was fully cured and the device was hermetically sealed. At this time, the color filter on the photosensitive surface
No deterioration was observed in the array.
このようにして形成されたカラー固体撮像装置を温度約
８５℃、温度約８５％ＲＨで５００時間放置したところ
、Ｎ２ガスのリークは全（発生せず、気密性、耐湿性が
極めて良好であり、十分な信頼性があることが確認され
た。When the color solid-state imaging device thus formed was left for 500 hours at a temperature of approximately 85°C and a temperature of approximately 85% RH, there was no leakage of N2 gas, and the airtightness and moisture resistance were extremely good. , it was confirmed that there was sufficient reliability.
実施例２
エポキシ樹脂としてエポキシ当量２２０ｇ／ｅｑのクレ
ゾールノボラック型エポキシ樹脂（日本化栗社製、ＥＯ
ＣＮ−１０３）を使用した以外は全て実施例１と同様に
して本発明の接着剤を作製し、カラー固体撮像装置の気
密封止に適用したところ、実施例１と同様カラー固体撮
像装置として必要な十分な信頼性が確認された。Example 2 As an epoxy resin, a cresol novolak type epoxy resin with an epoxy equivalent of 220 g/eq (manufactured by Nippon Kakuri Co., Ltd., EO
The adhesive of the present invention was prepared in the same manner as in Example 1, except that CN-103) was used, and when applied to hermetically sealing a color solid-state imaging device, it was found that, as in Example 1, it was necessary for a color solid-state imaging device. Sufficient reliability was confirmed.
実施例３
充填剤として高級度石英ガラスを粉砕した平均粒度８μ
ｍのシリカを１００部使用した以外は全て実施例１と同
様にして本発明の接着剤を作製し、カラー固体撮像装置
の気密封止に適用したところ実施例１と同様カラー固体
撮像装置として必要な十分な信頼性が確認された。Example 3 High-grade quartz glass was crushed as a filler with an average particle size of 8μ
The adhesive of the present invention was prepared in the same manner as in Example 1, except that 100 parts of silica of m. Sufficient reliability was confirmed.
実施例４
エポキシ当量４７０ｇ／ｅｑのビスフェノールＡ型エポ
キシ樹脂（油化シェルエポキシ社製、エピコート１００
１）５０部およびエポキシ当量２２０ｇ ／ ｅ ｑの
タレゾールノボラック型エポキシ樹脂（日本化薬社製、
ＥＯＣＮ−１０３）５０部と硬化剤としてのフェノール
樹脂（荒用化学工業社製、タマノル７５２）３０部、ま
た硬化促進剤としてジシアンジアミド０．５部をメチル
エチルケトン３０部に溶解し、さらに充填剤として酸化
マグネシウムを１５０部配合口三本ロールにて混線分散
して本発明の接着剤を作製した。Example 4 Bisphenol A epoxy resin with an epoxy equivalent of 470 g/eq (manufactured by Yuka Shell Epoxy Co., Ltd., Epicoat 100)
1) Talesol novolak type epoxy resin with 50 parts and epoxy equivalent weight 220 g/eq (manufactured by Nippon Kayaku Co., Ltd.,
50 parts of EOCN-103), 30 parts of a phenol resin (manufactured by Arayo Kagaku Kogyo Co., Ltd., Tamanol 752) as a curing agent, and 0.5 part of dicyandiamide as a curing accelerator were dissolved in 30 parts of methyl ethyl ketone, and further oxidized as a filler. The adhesive of the present invention was prepared by cross-dispersing 150 parts of magnesium using a three-roll blending port.
得られた接着剤を実施例１と同様にしてカラー固体撮像
装置に適用し評価をおこなったところ、十分な信頼性が
確認された。When the obtained adhesive was applied to a color solid-state imaging device and evaluated in the same manner as in Example 1, sufficient reliability was confirmed.
比較例
エポキシ当量４５０ｇ／ｅｑのビスフェノールＡ型エポ
キシ樹脂（油化シェルエポキシ社製、エピコート１００
１）１００部と、硬化剤としての２−フェニルイミダゾ
ール（四国ファインケミカル社製、キュアゾール２ＰＺ
）５部をメチルエチルケトン１５部に溶解し三本ロール
にて混線分散して比較用の接着剤を作製した。Comparative Example Bisphenol A epoxy resin with an epoxy equivalent of 450 g/eq (manufactured by Yuka Shell Epoxy Co., Ltd., Epicoat 100)
1) 100 parts and 2-phenylimidazole as a curing agent (manufactured by Shikoku Fine Chemical Co., Ltd., Curesol 2PZ
) was dissolved in 15 parts of methyl ethyl ketone and cross-dispersed using three rolls to prepare a comparative adhesive.
得られた接着剤を実施例１と同様にしてガラス板に塗布
したところ２０μｍの塗布厚しか得られず、これを使用
してカラー固体撮像装置を作製したところＮ２ガスのリ
ークがみられ信頼性がないことがわかった。When the obtained adhesive was applied to a glass plate in the same manner as in Example 1, a coating thickness of only 20 μm was obtained, and when a color solid-state imaging device was manufactured using this adhesive, leakage of N2 gas was observed, indicating reliability. It turns out that there is no.
〈発明の効果〉
本発明は上記の構成からなるので、カラー固体素子上の
色フイルタ−アレイを何ら変質損傷することな（、セラ
ミックパッケージとガラス板とを接着することが可能で
、しかも気密封止後の気密性、耐湿性、耐久性が極めて
良好な十分な信頼性を有する固体撮像装置を得ることが
可能となった。<Effects of the Invention> Since the present invention has the above-mentioned configuration, it is possible to bond the ceramic package and the glass plate without causing any deterioration or damage to the color filter array on the color solid-state element, and in addition, the ceramic package and the glass plate can be bonded together in an airtight manner. It has become possible to obtain a solid-state imaging device that has extremely good airtightness, moisture resistance, and durability after stopping and has sufficient reliability.
Claims (1)
を特徴とする固体撮像装置の気密封止用接着剤。 ２）前記エポキシ樹脂１００重量部に対して前記充填剤
が２０〜４００重量部配合されていることを特徴とする
特許請求の範囲第１項記載の固体撮像装置の気密封止用
接着剤。[Scope of Claims] 1) An adhesive for hermetically sealing a solid-state imaging device, characterized by containing an epoxy resin, a curing agent, and a filler. 2) The adhesive for hermetically sealing a solid-state imaging device according to claim 1, wherein 20 to 400 parts by weight of the filler is blended with 100 parts by weight of the epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61261822A JPS63116449A (en) | 1986-11-05 | 1986-11-05 | Airtight sealing adhesive for solid-state image pickup device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61261822A JPS63116449A (en) | 1986-11-05 | 1986-11-05 | Airtight sealing adhesive for solid-state image pickup device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63116449A true JPS63116449A (en) | 1988-05-20 |
Family
ID=17367209
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61261822A Pending JPS63116449A (en) | 1986-11-05 | 1986-11-05 | Airtight sealing adhesive for solid-state image pickup device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63116449A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03143980A (en) * | 1989-10-31 | 1991-06-19 | Sumitomo Bakelite Co Ltd | Adhesive composition |
| JP2009158713A (en) * | 2007-12-26 | 2009-07-16 | Sekisui Chem Co Ltd | Method of manufacturing sensor element package |
| JP2014072472A (en) * | 2012-10-01 | 2014-04-21 | Seiko Instruments Inc | Optical device, manufacturing method for optical device, manufacturing method for electronic device, program and recording medium |
| JP2018022931A (en) * | 2017-11-14 | 2018-02-08 | セイコーインスツル株式会社 | Method for manufacturing optical device |
-
1986
- 1986-11-05 JP JP61261822A patent/JPS63116449A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03143980A (en) * | 1989-10-31 | 1991-06-19 | Sumitomo Bakelite Co Ltd | Adhesive composition |
| JP2009158713A (en) * | 2007-12-26 | 2009-07-16 | Sekisui Chem Co Ltd | Method of manufacturing sensor element package |
| JP2014072472A (en) * | 2012-10-01 | 2014-04-21 | Seiko Instruments Inc | Optical device, manufacturing method for optical device, manufacturing method for electronic device, program and recording medium |
| JP2018022931A (en) * | 2017-11-14 | 2018-02-08 | セイコーインスツル株式会社 | Method for manufacturing optical device |
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