JPS6311415B2 - - Google Patents

Info

Publication number
JPS6311415B2
JPS6311415B2 JP60203117A JP20311785A JPS6311415B2 JP S6311415 B2 JPS6311415 B2 JP S6311415B2 JP 60203117 A JP60203117 A JP 60203117A JP 20311785 A JP20311785 A JP 20311785A JP S6311415 B2 JPS6311415 B2 JP S6311415B2
Authority
JP
Japan
Prior art keywords
content
semiconductor devices
elongation
alloy lead
conductivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP60203117A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6263631A (ja
Inventor
Hidetoshi Akutsu
Takuro Iwamura
Masao Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Metal Corp
Original Assignee
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp
Priority to JP60203117A priority Critical patent/JPS6263631A/ja
Priority to US06/903,514 priority patent/US4749548A/en
Priority to GB8621958A priority patent/GB2181742B/en
Priority to DE19863631119 priority patent/DE3631119A1/de
Publication of JPS6263631A publication Critical patent/JPS6263631A/ja
Priority to US07/166,217 priority patent/US4872048A/en
Publication of JPS6311415B2 publication Critical patent/JPS6311415B2/ja
Priority to GB8907058A priority patent/GB2219473B/en
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Conductive Materials (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP60203117A 1985-09-13 1985-09-13 半導体装置用Ｃｕ合金リ−ド素材 Granted JPS6263631A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP60203117A JPS6263631A (ja) 1985-09-13 1985-09-13 半導体装置用Ｃｕ合金リ−ド素材
US06/903,514 US4749548A (en) 1985-09-13 1986-09-03 Copper alloy lead material for use in semiconductor device
GB8621958A GB2181742B (en) 1985-09-13 1986-09-11 Copper alloy lead material for use in semiconductor device
DE19863631119 DE3631119A1 (de) 1985-09-13 1986-09-12 Leitermaterial auf basis von kupferlegierungen zur anwendung fuer halbleitervorrichtungen
US07/166,217 US4872048A (en) 1985-09-13 1988-03-10 Semiconductor device having copper alloy leads
GB8907058A GB2219473B (en) 1985-09-13 1989-03-29 Copper alloy lead material for use in semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60203117A JPS6263631A (ja) 1985-09-13 1985-09-13 半導体装置用Ｃｕ合金リ−ド素材

Publications (2)

Publication Number Publication Date
JPS6263631A JPS6263631A (ja) 1987-03-20
JPS6311415B2 true JPS6311415B2 (cs) 1988-03-14

Family

ID=16468680

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60203117A Granted JPS6263631A (ja) 1985-09-13 1985-09-13 半導体装置用Ｃｕ合金リ−ド素材

Country Status (1)

Country Link
JP (1) JPS6263631A (cs)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104878242A (zh) * 2015-06-25 2015-09-02 潘应生 一种铜铝合金及其制备方法
CN104878243A (zh) * 2015-06-25 2015-09-02 潘应生 一种铜铝合金及其制备方法

Also Published As

Publication number Publication date
JPS6263631A (ja) 1987-03-20

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees