JPS63114154A - Lead frame - Google Patents
Lead frameInfo
- Publication number
- JPS63114154A JPS63114154A JP25987186A JP25987186A JPS63114154A JP S63114154 A JPS63114154 A JP S63114154A JP 25987186 A JP25987186 A JP 25987186A JP 25987186 A JP25987186 A JP 25987186A JP S63114154 A JPS63114154 A JP S63114154A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- island
- large number
- thermal expansion
- difference
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 5
- 239000011347 resin Substances 0.000 abstract description 4
- 229920005989 resin Polymers 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 abstract description 2
- 238000000465 moulding Methods 0.000 abstract 2
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 102100028717 Cytosolic 5'-nucleotidase 3A Human genes 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 241000219745 Lupinus Species 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は主に樹脂封止型の半導体装置の外部リード付は
組立に使用でれるリードフレームに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention mainly relates to a lead frame used for assembling resin-sealed semiconductor devices with external leads.
このようなリードフレームは一般に、半導体チップまた
は混成集積回路基板などが載置固着されるアイランド部
と、アイランド部の周囲を囲むように内端部が配置式ｎ
た多数のリードから構成され、適当な金属板からエツチ
ング法またはプレスなどにより作シ出され、グイボンデ
ィング、金属細線接続用に貴金属メッキが施されている
。Such a lead frame generally has an island part on which a semiconductor chip or a hybrid integrated circuit board is placed and fixed, and an inner end part arranged around the island part.
It is made from a suitable metal plate by etching or pressing, and is plated with a precious metal for bonding and fine metal wire connection.
第２図はこの種の従来のリードフレームのアイランド部
の平面図であシ、図において、アイランド部１１はフラ
ットな板体であって、吊りピン３により ＩＪ−ドフレ
ームの外枠（図示せず）に支持嘔ｎている。FIG. 2 is a plan view of the island portion of this type of conventional lead frame. (2) is supported.
上述した従来のリードフレームはアイランドのサイズに
関係なく、１個の四角形の板体であり、アイランドサイ
ズが大きいと、モールド樹月旨、リードフレーム、基板
、半導体素子および接続用の金属線線間相互の熱膨張係
数の差によシ、回路接続の断線お、よびモールド樹脂ク
ラック等の問題が発生する。The conventional lead frame described above is a single rectangular plate regardless of the size of the island, and if the island size is large, the space between the mold base, the lead frame, the substrate, the semiconductor element, and the metal wire for connection is large. Due to the difference in their thermal expansion coefficients, problems such as breakage of circuit connections and mold resin cracks occur.
本発明のリードフレームは、サイズの大きいアイランド
が必要である場合、アイランド部に格子状に多数の抜き
穴をあけることにより、このり−ドフレームとリードフ
レームに密着する部品との熱膨張係数の差による不都合
をなく丁のである。In the lead frame of the present invention, when a large-sized island is required, by drilling a large number of holes in a grid pattern in the island portion, the coefficient of thermal expansion between the lead frame and the parts that are in close contact with the lead frame can be adjusted. This eliminates the inconvenience caused by differences.
次に本発明について図面音用いて説明金する。 Next, the present invention will be explained using drawings and sounds.
第１図は本発明の一実施例のアイランド部の平面図であ
る。リードフレームのアイランド１に格子状に多数の抜
き穴２があけられている。このアイランド１は吊シビン
３により、図示嘔ｎてぃないリードフレームの外枠に支
持嘔ｎている。FIG. 1 is a plan view of an island portion according to an embodiment of the present invention. A large number of holes 2 are formed in a grid pattern in an island 1 of a lead frame. This island 1 is supported by a hanging sheath 3 on the outer frame of a lead frame (not shown).
以上説明したように本発明は、リードフレームのアイラ
ンド部に格子器状に多数の抜き穴があけらｊ、ている仁
とにより、モールド樹月旨、リードフレーム、基板、牛
導体累子お工び接続用の金属Ｉｖ、ＩＩｌ融間相互の熱
間相互数の差を吸収することができ、よって回路接続の
断線およびモールド樹脂クラック等の品質問題の発生を
防止できる効果がある。As explained above, the present invention has a large number of punched holes in a lattice pattern in the island portion of the lead frame. It is possible to absorb the difference in the number of hot connections between metals Iv and IIl for connection and to prevent quality problems such as disconnections in circuit connections and mold resin cracks.
第１図は本発明の一実施例に係るリードフレームのアイ
ランド部の平面図、第２図は従来のリードフレームのア
イランド部の平面図である。
ｌ・・・・・・アイランド、２・・・・・・抜き大、３
・山・・吊ルピン。FIG. 1 is a plan view of an island portion of a lead frame according to an embodiment of the present invention, and FIG. 2 is a plan view of an island portion of a conventional lead frame. l...Island, 2...Large without, 3
・Mountain...Hanging Lupin.
Claims (1)
に、格子状に多数の抜き穴があけられていることを特徴
とするリードフレーム。A lead frame is characterized by having a large number of punched holes in a grid pattern in the island portion on which a semiconductor chip or circuit board is mounted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25987186A JPS63114154A (en) | 1986-10-30 | 1986-10-30 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25987186A JPS63114154A (en) | 1986-10-30 | 1986-10-30 | Lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63114154A true JPS63114154A (en) | 1988-05-19 |
Family
ID=17340111
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25987186A Pending JPS63114154A (en) | 1986-10-30 | 1986-10-30 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63114154A (en) |
-
1986
- 1986-10-30 JP JP25987186A patent/JPS63114154A/en active Pending
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