JPS6311317A - Molding device - Google Patents

Molding device

Info

Publication number
JPS6311317A
JPS6311317A JP15704286A JP15704286A JPS6311317A JP S6311317 A JPS6311317 A JP S6311317A JP 15704286 A JP15704286 A JP 15704286A JP 15704286 A JP15704286 A JP 15704286A JP S6311317 A JPS6311317 A JP S6311317A
Authority
JP
Japan
Prior art keywords
mold
cooling
injection
molded product
molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15704286A
Other languages
Japanese (ja)
Inventor
Sadao Fukuoka
福岡 貞夫
Michio Sawada
沢田 道雄
Hiroya Fujinawa
藤縄 比呂也
Toshihiro Kondo
近藤 俊裕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to JP15704286A priority Critical patent/JPS6311317A/en
Publication of JPS6311317A publication Critical patent/JPS6311317A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/72Heating or cooling
    • B29C45/7207Heating or cooling of the moulded articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/40Removing or ejecting moulded articles
    • B29C45/42Removing or ejecting moulded articles using means movable from outside the mould between mould parts, e.g. robots

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

PURPOSE:To improve a productivity of a device, while providing a highly precise smoothness and a high dimension accuracy by a method in which at mold opening, a first supporting part sets a molded product in a cooling mold from the injection mold and a second supporting part removes the molded product from the cooling mold, and then at the time of mold clamping, the first and second supporting parts are on standby. CONSTITUTION:In a state of mold clamping, a removing mechanism 40 is on standby spaced from each mold 10, 20, and molten resin is injected into the cavity 13 of the injection mold 10 from the nozzle of an injection machine. Since the temperature of the molding surface of the injection mold 10 is relatively high, the fluidity of the molten resin is not decreased, and highly precise smoothness is obtained. Simultaneously with injection molding, other dish portion 91' is contracted under cooling in the cavity 23 of the cooling mold 20. At the time of mold-opening, the first supporting part 45 removes a molded product 91 from the injection mold 10 with the movement of a transferring member 41, and sets it in the cooling mold 20. Almost simultaneously therewith, the second supporting part 46 removes the molded product 91 from the cooling mold 20. Injection molding and cooling and further the removal of a molded product from the injection mold and the mold for cooling may be simultaneously carried out. Therefore, its productivity is improved.

Description

【発明の詳細な説明】 (産業上の利用分野) この発明は、磁気ディスクの基板等の精密成形品を成形
するための成形装置に関する。
DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a molding apparatus for molding precision molded products such as magnetic disk substrates.

(従来の技術) 最近、プラスチックにより磁気ディスク基板を射出成形
する技術が開発されている。この磁気ディスク基板は、
軽量で、射出成形により高精度の平滑性が得られ、研削
研摩を必要としないため高い生産性を実現できる。
(Prior Art) Recently, a technology for injection molding magnetic disk substrates from plastic has been developed. This magnetic disk board is
It is lightweight, has high-precision smoothness achieved through injection molding, and does not require grinding and polishing, making it possible to achieve high productivity.

上記プラスチックには耐熱性が要求されるため、溶融温
度が400℃前後と高い材料が選ばれているが、その成
形に際して種々の解決すべき問題をかかえている。
Since the above-mentioned plastics are required to have heat resistance, materials with a high melting temperature of around 400° C. are selected, but there are various problems that need to be solved when molding them.

一般の射出成形法では、金型を常温で冷却しているか、
この方法を上記磁気ディスク基板に適用することはでき
ない。なぜなら、高温の溶融樹脂か金型の成形面に接し
て急冷されて流動性が悪くなり、溶融樹脂に射出圧力か
充分に作用しなくなるため、転写性が悪く高精度の平滑
性を達成できないからである。
In general injection molding methods, the mold is cooled at room temperature or
This method cannot be applied to the above magnetic disk substrate. This is because the high-temperature molten resin comes into contact with the molding surface of the mold and is rapidly cooled, resulting in poor fluidity and the injection pressure not acting sufficiently on the molten resin, resulting in poor transferability and the inability to achieve high-precision smoothness. It is.

精密品の射出成形の場合、射出成形前に金型の成形面近
傍だけを高周波加熱等により加熱して樹脂のガラス転移
点近傍まで+1温させ、射出後冷却する技術か知られて
いる。しかし、この方法では成形面を均一に加熱するこ
とかできない。
In the case of injection molding of precision products, a known technique is to heat only the vicinity of the molding surface of the mold by high-frequency heating or the like before injection molding to raise the temperature by +1 to near the glass transition point of the resin, and then cool it after injection. However, with this method, it is only possible to uniformly heat the molding surface.

このため、金型全体の温度を射出開始前に高くして転写
性を向上させ、射出後金型をより低い温度(冷却収縮に
伴なう変形か生じない温度)まで冷却する技術も開発さ
れでいる。
For this reason, a technology has been developed to improve transferability by increasing the temperature of the entire mold before injection starts, and then cooling the mold to a lower temperature after injection (a temperature at which no deformation occurs due to cooling shrinkage). I'm here.

(発明が解決しようとする問題点) しかし、上記のような金型温度の制御サイクルを実行す
ると、特に溶融温度の高い樹脂を用いる場合には、上限
と下限の温度差か大きく、この温度制御のために成形サ
イクルか長くなってしまい生産性が極度に低下するとと
もに、エネルギーの消費が大きく不経済であった。しか
も、金型は精度を」−げるために剛性を必要とし、肉厚
が厚く熱容量か大といため、上記欠点か顕著である。
(Problem to be Solved by the Invention) However, when executing the mold temperature control cycle as described above, especially when using resin with a high melting temperature, the temperature difference between the upper and lower limits is large, and this temperature control As a result, the molding cycle becomes longer, resulting in extremely low productivity and high energy consumption, which is uneconomical. Furthermore, the mold requires rigidity in order to achieve precision, and has a thick wall and large heat capacity, so the above-mentioned drawbacks are noticeable.

(問題点を解決するための手段) この発明は」−記問題点を解消するためになされたもの
で、その要旨は、溶融樹脂を射出して比較的高温領域で
賦形を行なう射出成形金型と、射出成形された成形品を
冷却する冷却金型と、各金型の型半体をそれぞれ支持す
る一対の支持台と、成形品の取り出しを行なう取出機構
とを備え、この取出機構は、移動部材にバキューム吸着
機能を有する第一、第二の支持部を設けることにより構
成され、射出成形金型および冷却金型の型開ぎ時には、
第一支持部か移動部材の移動に伴ない射出成形金型から
成形品を取り出して冷却金型ヘセントするとともに、第
二支持部か上記第一支持部の成形品取り出しとほぼ同時
期に冷却金型から成形品を取り出し、射出成形金型およ
び冷却金型の型締め時には、第一、第二の支持部がこれ
ら両金型から離れた位置で待機することを特徴とする成
形装置にある。
(Means for Solving the Problems) This invention has been made to solve the problems mentioned above. It comprises a mold, a cooling mold that cools the injection molded product, a pair of support stands that support the mold halves of each mold, and a take-out mechanism that takes out the molded product. , is constructed by providing the moving member with first and second support parts having a vacuum suction function, and when opening the injection mold and the cooling mold,
The molded product is taken out from the injection mold as the first support part or the movable member moves and is placed in the cooling mold, and at the same time as the molded part is taken out from the second support part or the first support part, the molded product is removed from the cooling mold. The molding apparatus is characterized in that, when a molded product is removed from the mold and the injection mold and the cooling mold are clamped, the first and second support parts stand by at positions separated from both the molds.

(作用) 射出成形金型の温度を比較的高温にした状態で射出を行
なうので、良好な転写を実現でき高精度の平滑性を得る
ことができる。
(Function) Since injection is performed while the temperature of the injection mold is kept relatively high, good transfer can be achieved and highly accurate smoothness can be obtained.

射出成形金型で射出成形を行ない、冷力1金型で冷却を
行なうため、これら各金型では大きな温度差での温度制
御サイクルを実行しなくて済み、成形サイクルを短縮で
外るとともに、エネルギーの消費を少なくすることがで
きる。
Injection molding is performed using an injection mold, and cooling is performed using a single cooling mold, so there is no need to perform temperature control cycles with large temperature differences between these molds, which shortens the molding cycle and Energy consumption can be reduced.

射出成形金型および冷却金型が共通の支持台に支持され
るため、射出成形と冷却とを同時に行なうことができ、
生産性を向上できる。
Since the injection mold and cooling mold are supported on a common support base, injection molding and cooling can be performed at the same time.
Productivity can be improved.

取出機構では、移動部材に設けられた第一、第二の支持
部により、射出成形金型および冷却金型から成形品の取
り出しをほぼ同時期に行なえるので、生産性を向上でき
る。
In the take-out mechanism, the molded product can be taken out from the injection mold and the cooling mold at approximately the same time by the first and second support parts provided on the moving member, so productivity can be improved.

(実施例) 以下、この発明を、磁気ディスクの基板(精密成形品)
を成形する装置を例にとって、図面に基づいて説明する
(Example) Hereinafter, this invention will be described as a magnetic disk substrate (precision molded product).
An example of an apparatus for molding will be explained based on the drawings.

第1図中10は射出成形金型であり、20は冷却金型で
ある。各金型1.0.20は、それぞれ固定型11.2
1(型半体)および移動型1.2.22(型半体)を有
している。固定型111.21は共通の固4一 定価ダイブレート31(支持台)に支持されており、移
動型12.22は共通の移動側グイプレート32(支持
台)に支持されている。固定側グイプレート31お上び
移動側グイプレート32には、それぞれバランサー33
.34が固定されている。各金型1.0.20およびバ
ランサー33.34は水平に延びるY−Y’軸に沿って
横一列に間隔をおいて配置されている。移動側グイプレ
ート32をX−X′に沿って固定側グイプレート31に
対して水平移動させる機構は、通常の射出成形装置と同
様である。
In FIG. 1, 10 is an injection mold, and 20 is a cooling mold. Each mold 1.0.20 is fixed mold 11.2 respectively
1 (mold half) and movable mold 1.2.22 (mold half). The fixed mold 111.21 is supported by a common fixed fixed die plate 31 (support stand), and the movable mold 12.22 is supported by a common movable gouly plate 32 (support stand). A balancer 33 is installed on the stationary side goo plate 31 and the movable side goo plate 32, respectively.
.. 34 is fixed. Each mold 1.0.20 and balancer 33.34 are arranged in a horizontal line at intervals along a horizontally extending Y-Y' axis. The mechanism for horizontally moving the movable gouly plate 32 with respect to the stationary gouly plate 31 along X-X' is the same as that of a normal injection molding apparatus.

射出成形金型10の固定型11と移動型12には、成形
用凹部11a、21aが形成されており、その成形面は
高精度に鏡面仕上げされている。型締め時において、こ
れら成形用凹部11a、12aによりキャビティ13が
形成される。
Molding recesses 11a and 21a are formed in the fixed mold 11 and the movable mold 12 of the injection mold 10, and the molding surfaces thereof are mirror-finished with high precision. At the time of mold clamping, a cavity 13 is formed by these molding recesses 11a and 12a.

固定型11と移動型12の中央部には孔11b。A hole 11b is provided in the center of the fixed mold 11 and the movable mold 12.

12bが形成されており、この孔11b、12bにコア
14.15とスリーブ16,1 ?が収納されている。
12b is formed, and a core 14.15 and a sleeve 16,1? are formed in these holes 11b, 12b. is stored.

固定型11のコア14は、スプループッシュを兼ねてお
りスプルー]4aを有している。また、移動型12のフ
ァ15には突き出しピン]8が貫通している。
The core 14 of the fixed mold 11 also serves as a sprue pusher and has a sprue 4a. Further, an ejecting pin] 8 passes through the fan 15 of the movable die 12.

固定型11と移動型12には、渦巻き形状の媒体通路1
9か形成されており、この媒体通路1つに冷却媒体が流
通される。この冷却媒体の温度は、比較的高く樹脂材料
のガラス転移点より20〜30°C程度低い温度に設定
する。例えば0(脂のガラス転移点か200℃前後であ
る場合、170〜180°Cに設定する。
The fixed mold 11 and the movable mold 12 have a spiral medium passage 1.
9 are formed, and a cooling medium flows through one of these medium passages. The temperature of this cooling medium is set to be relatively high and about 20 to 30°C lower than the glass transition point of the resin material. For example, if the glass transition point of the fat is around 200°C, set it at 170 to 180°C.

冷却金型20の固定型21と移動型221こは、成形用
凹部21a、22aか形成されており、その成形面は高
精度に鏡面仕−1−げされている。型締め時において、
これら成形用凹部21a、22aによりキャビティ23
が形成される。このキャビティ23の幅は射出成形金型
10のキャビティ13の幅よj)僅かに狭い。
The fixed mold 21 and the movable mold 221 of the cooling mold 20 are formed with molding recesses 21a and 22a, and their molding surfaces are mirror-finished with high precision. At the time of mold clamping,
The cavity 23 is formed by these molding recesses 21a and 22a.
is formed. The width of this cavity 23 is slightly narrower than the width of the cavity 13 of the injection mold 10.

固定型21と移動型22の中央部には孔211)。A hole 211) is provided in the center of the fixed mold 21 and the movable mold 22.

221)か形成されており、固定型21の孔21bには
固定ファ24が収納されており、移動型22の孔221
〕にはファ25およびスリーブ27が収納されでいる。
221) is formed, a fixed fan 24 is housed in the hole 21b of the fixed mold 21, and the hole 221 of the movable mold 22 is
) is housed with a fan 25 and a sleeve 27.

固定型21と移動型22には、それぞれ渦巻き形状の媒
体通路29が形成されており、この媒体通路29に比較
的低温例えば常温の冷却媒体が流通される。
A spiral medium passage 29 is formed in each of the fixed mold 21 and the movable mold 22, and a cooling medium at a relatively low temperature, for example, room temperature, flows through the medium passage 29.

冷却金型20の横には取出機構40が配置されている。A take-out mechanism 40 is arranged next to the cooling mold 20.

二の取出機構40は、ヒンジ42によって折り曲げ可能
な長尺の移動部材41を有している。移動部材41は互
いに直交する水平2軸すなわちx−x’軸とY−Y′紬
1こ沿って移動できるようになっている。
The second take-out mechanism 40 has a long moving member 41 that can be bent by a hinge 42 . The moving member 41 is movable along two horizontal axes that are perpendicular to each other, that is, the x-x' axis and the Y-Y' axis.

移動部材・1」の先端部には第一支持部45が設けられ
、第一支持部45とヒンジ42との間には第二支持部4
6か設けられている。第5図〜第7図に示すように、第
一支持部45は、移動部材41の先端部に固定された支
持プレート・17を有している。この支持プレート47
には、後述するスプルーを挿入できる四部47aが形成
されている。
A first support portion 45 is provided at the tip of the moving member 1, and a second support portion 4 is provided between the first support portion 45 and the hinge 42.
There are 6. As shown in FIGS. 5 to 7, the first support section 45 has a support plate 17 fixed to the distal end of the moving member 41. As shown in FIGS. This support plate 47
A four part 47a is formed in which a sprue, which will be described later, can be inserted.

支持プレート47の移動側グイプレート32側には」1
記凹部47aの周囲において吸着盤48が設けられてい
る。これら吸着盤48は図示しないバキューム吸引器に
接続されている。
1 on the movable side guide plate 32 side of the support plate 47.
A suction cup 48 is provided around the recessed portion 47a. These suction cups 48 are connected to a vacuum suction device (not shown).

上記支持プレート47の固定側グイプレート31側の面
【こは、チャック機構50が設けられている。このチャ
ック機構50は、電磁力で後述のスプル一部92を挾む
ことができる一対の爪51゜51を有しており、これら
爪51の中途部には、半円形状の四部51aが形成され
ている。
A chuck mechanism 50 is provided on the surface of the support plate 47 on the fixed side plate 31 side. This chuck mechanism 50 has a pair of claws 51, 51 that can clamp a sprue portion 92 (described later) using electromagnetic force, and four semicircular parts 51a are formed in the middle of these claws 51. has been done.

第二支持部・16は、」二記第−支持部45と同様の吸
着盤48を有するが、チャック機構50は有しない。
The second support part 16 has a suction cup 48 similar to the second support part 45, but does not have a chuck mechanism 50.

上述構成において、第1図の型締め状態では、取出機構
40は各金型10,20から離れて待機している。この
状態で、射出(幾のノズル(図示しない)から、射出成
形金型10のスプルー14aを経てキャビティ13へ溶
融樹脂を射出する。この射出の際、射出成形金型10の
成形用四部11a。
In the above-described configuration, in the mold-clamped state shown in FIG. 1, the ejecting mechanism 40 is separated from each of the molds 10 and 20 and is on standby. In this state, the molten resin is injected from an injection nozzle (not shown) into the cavity 13 through the sprue 14a of the injection mold 10. During this injection, the four molding parts 11a of the injection mold 10 are injected.

12aの成形面の温度が上述したようにガラス転移点よ
り若干低い程度であり比較的高温であるため、溶融樹脂
の流動性が損なわれず、溶融樹脂が射出圧力を受けて鏡
面をなす成形面に密着するので極めて良好な転写が行な
え、高精度の平滑性を得ることかでとる。
As mentioned above, the temperature of the molding surface of 12a is slightly lower than the glass transition point and relatively high temperature, so the fluidity of the molten resin is not impaired and the molten resin is subjected to injection pressure to form a mirror-like molding surface. Because of the close contact, it is possible to perform extremely good transfer and obtain highly accurate smoothness.

溶融樹脂は、射出成形金型10で表面温度がガラス転移
点以下に冷却されて賦形される。賦形された成形品90
は、円盤部91とスプル一部92とを有している。
The molten resin is cooled to a surface temperature below the glass transition point in an injection mold 10 and shaped. Shaped molded product 90
has a disk portion 91 and a sprue portion 92.

上記射出成形と同時期に、中央を繰り抜かれた他の円盤
部91′が冷却金型20のキャビティ23で冷却される
とともに圧縮される。なお、この円盤部91′は後述の
作用により射出成形金を10から移されてきたものであ
る。冷却金型20では、型締め力で円盤部91′の樹内
の中心部を塑性変形させ圧縮するとともに、約100°
C以下(冷却収縮に伴なう変形か生じない温度である)
まで冷却し、磁気ディスク基板としての最f8成形品を
得る。上記圧縮冷却により、最終成形品は冷却に伴なう
収縮で生じる反り等の変形を確実にl□j+t−できる
。また、肉厚の微小の不均一が残っていても、これを矯
正して均一化することもでトる。
At the same time as the above-mentioned injection molding, another disk portion 91' whose center is hollowed out is cooled and compressed in the cavity 23 of the cooling mold 20. It should be noted that this disk portion 91' has injection molded metal transferred thereto from 10 by a function described later. In the cooling mold 20, the clamping force plastically deforms and compresses the center of the tree of the disc part 91', and
C or lower (temperature at which no deformation occurs due to cooling shrinkage)
Cool to obtain a molded product of maximum f8 as a magnetic disk substrate. By the compression cooling described above, the final molded product can be reliably prevented from deformation such as warping caused by shrinkage due to cooling. Furthermore, even if there are minute non-uniformities in the wall thickness, it is possible to correct them and make them uniform.

上記の射出成形と冷却圧縮か終了した後に、移動側グイ
プレート32が図中X′力方向移動し、移動型12.2
2およびバランサー3/Iが同方向に移動する(第2図
)。この移動の初期には、射出成形金型10の固定型1
1もX′力方向僅かに移動するため、射出成形金型1(
)は型締め状態をM[持している。この時、コア14.
15だけか移動せずスリーブ16.17に対して若干量
相対的に移動することにより、成形品!JOが切断され
、中央部を繰り抜かれた円盤部!J1とスプル一部92
とに分離される。なお、冷却金型20は移動側グイプレ
ー1・32か移動し始めた時から開き始め、バランサー
33.:lも同時期に開き始める。
After the above-mentioned injection molding and cooling compression are completed, the movable gouly plate 32 moves in the X' force direction in the figure, and the movable mold 12.2
2 and balancer 3/I move in the same direction (Figure 2). At the beginning of this movement, the fixed mold 1 of the injection mold 10
Since injection mold 1 also moves slightly in the X' force direction, injection mold 1 (
) has a mold clamping state M[. At this time, core 14.
The molded product does not move by only 15, but moves slightly relative to sleeve 16 and 17! A disk with the JO cut and the center hollowed out! J1 and sprue part 92
It is separated into Note that the cooling mold 20 begins to open when the movable side Guiplay 1, 32 begins to move, and the balancer 33. :l will also start opening at the same time.

上記固定型]1は上記のように若干量移動した後停止し
、以後は移動側グイプレート32および移動型12.2
2およびバランサ34が移動し続ける。この結果、第3
図に示すように射出成形金型20も型開きする。
The fixed mold] 1 stops after moving a certain amount as described above, and after that, the movable gou plate 32 and the movable mold 12.2
2 and balancer 34 continue to move. As a result, the third
As shown in the figure, the injection mold 20 is also opened.

上記型開との過程で移動型12のスリーブ17か若干量
突き出ることより、成形用四部12aの成形面に密着し
ている円盤部91を離型させる。
In the process of opening the mold, the sleeve 17 of the movable mold 12 protrudes a little, thereby releasing the disk part 91 that is in close contact with the molding surface of the four molding parts 12a.

この円盤部91は若干量移動されるだけであるから、成
形用凹部12aの周壁で支持される。
Since this disk portion 91 is only moved by a small amount, it is supported by the peripheral wall of the molding recess 12a.

上記型開トの途中または終了後に、取出機構40の移動
部材41がY方向に移動し、この結果、第一支持部45
が射出成形金型10の固定型11と移動型12との開に
配置され、第二支持部・16が冷却金型20の固定型2
1と移動型22との間に配置される。移動部材41はさ
らにX′力方向移動し、各支持部4.5 、46を移動
型12.22に近付ける。
During or after the mold opening, the moving member 41 of the ejecting mechanism 40 moves in the Y direction, and as a result, the first support part 45
is disposed between the fixed mold 11 and the movable mold 12 of the injection mold 10, and the second support part 16 is located between the fixed mold 11 and the movable mold 12 of the injection mold 10.
1 and the movable mold 22. The moving member 41 moves further in the direction of the X' force, bringing each support 4.5, 46 closer to the moving mold 12.22.

次に、射出成形金型10の移動型12のコア15および
スリーブ17が突出して円盤部91を待機状態の第一支
持部45へ移動させる。そして、この第一支持部45の
吸着盤48で円盤部91をバキューム吸着する。また、
突き出しピン18か突出してスプル一部92を円盤部9
1よりもさらに固定型11方向に移動させる。そして、
チャック機構50の一対の爪51で挟む。この際、爪5
−11= 1の四部51aにスプル一部92が収納されるため、確
実に把持される。
Next, the core 15 and sleeve 17 of the movable mold 12 of the injection mold 10 protrude to move the disk portion 91 to the first support portion 45 in a standby state. Then, the disk portion 91 is vacuum-suctioned by the suction cup 48 of the first support portion 45 . Also,
The ejector pin 18 protrudes and the sprue part 92 is inserted into the disc part 9.
The fixed mold 11 is moved further in the direction of the fixed mold 11. and,
It is held between a pair of claws 51 of a chuck mechanism 50. At this time, nail 5
Since the sprue part 92 is housed in the four parts 51a of -11=1, it can be held securely.

上記円盤部91およびスプル一部92の受は渡しと同時
期に、冷却金型20の移動型22のコア25およびスリ
ーブ27を突出させ、円盤部91′を待機状態の第二支
持部46へ移動させる。そして、この第二支持部46の
吸着盤48でスプル一部92をバキューム吸着する。
At the same time as the transfer, the disk portion 91 and the sprue portion 92 are received by protruding the core 25 and sleeve 27 of the movable mold 22 of the cooling mold 20, and moving the disk portion 91' to the second support portion 46 in a standby state. move it. Then, the sprue portion 92 is vacuum-sucked by the suction cup 48 of the second support portion 46 .

次に、移動部材41がX方向に移動し、各支持部45 
、46か移動型12.22から後退する。この後、移動
部材41がY′方向に移動し、第4図に示すように、第
一支持部45か冷却金型20の位置に至り、第二支持部
46が冷却金型20から離れる。
Next, the moving member 41 moves in the X direction, and each support part 45
, 46 or move back from the mobile type 12.22. Thereafter, the moving member 41 moves in the Y' direction, and as shown in FIG. 4, the first support part 45 reaches the position of the cooling mold 20, and the second support part 46 leaves the cooling mold 20.

さらに移動部材4.1がX′力方向移動し、これに伴な
い第一支持部・15が移動型22に近付き、この第一支
持部45に支持された円盤部91をコア25にはめ込む
。そして、吸着盤48によるバキューム吸着が解除され
た後、移動部材41がX方向に移動し、第一支持部45
が移動型22から離れる。このようにして円盤部91の
受は渡しかなされる。なお、コア25およびスリーブ2
7が突出しているので、円盤部91はこのスリーブ27
の先端に位置決めされて、成形用四部22aの成形面か
ら離れているため、円盤部91の一面だけが先に冷却さ
れることはない。
Further, the moving member 4.1 moves in the direction of the X' force, and as a result, the first support part 15 approaches the movable mold 22, and the disk part 91 supported by the first support part 45 is fitted into the core 25. Then, after the vacuum suction by the suction cup 48 is released, the moving member 41 moves in the X direction, and the first support part 45
leaves the mobile mold 22. In this way, the disk portion 91 is transferred or transferred. In addition, the core 25 and the sleeve 2
7 protrudes, the disk portion 91 is attached to this sleeve 27.
Since it is positioned at the tip of the disc part 91 and is away from the molding surface of the four molding parts 22a, only one surface of the disc part 91 is not cooled first.

また、上記第一支持部45でのバキューム吸着の解除と
同時期に、第二支持部46でのバキューム吸着が解除さ
れ、円盤部91′は下方の製品受部に落下する。
Further, at the same time as the vacuum suction on the first support part 45 is released, the vacuum suction on the second support part 46 is released, and the disc part 91' falls to the product receiving part below.

次に、移動部材41がY′方向に移動し、第1図に示す
待機状態に戻る。第一支持部45では、この待機位置に
達した時にチャック機構50が間外作動して、スプル一
部92が製品受部に落下する。
Next, the moving member 41 moves in the Y' direction and returns to the standby state shown in FIG. In the first support section 45, when the standby position is reached, the chuck mechanism 50 is activated suddenly, and the sprue portion 92 falls into the product receiving section.

次に、移動側グイプレート32を再び固定側グイプレー
ト31に近付けて、型締めを行なう。
Next, the movable gouly plate 32 is brought close to the stationary gouly plate 31 again and the molds are clamped.

上記成形の過程で、射出成形金型10および冷却金型2
0の温度は一定に維持しておけばよく、高温から低温へ
の移行、低温から高温への移行を含む温度制御サイクル
を実行しないから、成形サイクルを短縮でき、エネルギ
ーの節約を図ることもでべろ。
In the above molding process, the injection mold 10 and the cooling mold 2
The temperature at zero only needs to be maintained constant, and a temperature control cycle that includes transitions from high to low temperatures and from low to high temperatures is not executed, so the molding cycle can be shortened and energy can be saved. Vero.

上述したように、型締め時には、射出成形金型10で射
出成形を行なうとともに冷却金型2()で圧縮冷却を行
ない、同時に2工程を実行するので生産性が高い。型開
ぎ時には、第一支持部45により射出成形金型10から
成形品90の円盤部91およびスプル一部92の取り出
しを行なうとともに、第二支持部46により冷却金型2
0から円盤部91′の取り出しを行なうものであり、迅
速に取り出し作業を行なえるため、生産性が高い。
As described above, during mold clamping, injection molding is carried out in the injection molding die 10 and compression cooling is carried out in the cooling die 2 ( ), and two processes are executed at the same time, resulting in high productivity. When opening the mold, the first support part 45 takes out the disk part 91 and the sprue part 92 of the molded product 90 from the injection mold 10, and the second support part 46 takes out the cooling mold 2.
The disk portion 91' is taken out from zero, and the work of taking out can be done quickly, resulting in high productivity.

なお、成形停止時には、ヒンジ42により移動部材41
を直角に折り曲げておく。
Note that when molding is stopped, the movable member 41 is moved by the hinge 42.
Fold it at a right angle.

この発明方法は」1記実施例に制約されず種々の態様が
可能である。例えば、スプル一部は第一支持部で支持せ
ずに突き出しピンで突き出して落下させてもよい。
The method of this invention is not limited to the first embodiment and can be modified in various ways. For example, a portion of the sprue may not be supported by the first support portion, but may be pushed out by an ejector pin and dropped.

(発明の効果) 以上説明したように、この発明では、転写を良好に行な
えるため高精度の平滑性を達成できるとともに高い寸法
精度を得ることができる。しかも、大きな温度差での金
型の温度制御サイクルを実行しなくて済み、成形サイク
ルを短縮できるとともに、エネルギーの消費を少なくで
きる。
(Effects of the Invention) As explained above, in the present invention, since the transfer can be performed well, highly accurate smoothness can be achieved and high dimensional accuracy can be obtained. Moreover, it is not necessary to perform a mold temperature control cycle with a large temperature difference, so the molding cycle can be shortened and energy consumption can be reduced.

また、射出成形と冷却を同時に行なうとともに、射出成
形金型および冷却金型からの成形品の取り出しも同時に
行なえるので、生産性を向上できる。
In addition, since injection molding and cooling can be performed simultaneously, and molded products can be taken out from the injection mold and the cooling mold at the same time, productivity can be improved.

【図面の簡単な説明】[Brief explanation of the drawing]

図面はこの発明の一実施例を示すものであり、第1図〜
第4図は成形装置の作動を順に説明する横断面図、第5
図は第一支持部の部分断面平面図、第6図は第一支持部
の正面図、第7図はチャック機構の正面図である。 10・・・射出成形金型、20・・・冷却金型、11゜
21・・・型半体(固体型)、12.22・・・移動型
(型半体)、31.32・・・支持台(グイプレート)
、90・・・成形品、91′・・・成形品(円盤部)。
The drawings show one embodiment of the present invention, and FIGS.
Fig. 4 is a cross-sectional view explaining the operation of the molding device in order;
The figure is a partially sectional plan view of the first support part, FIG. 6 is a front view of the first support part, and FIG. 7 is a front view of the chuck mechanism. 10... Injection mold, 20... Cooling mold, 11°21... Mold half (solid mold), 12.22... Movable mold (mold half), 31.32...・Support stand (Gui plate)
, 90... Molded product, 91'... Molded product (disc part).

Claims (1)

【特許請求の範囲】[Claims] (1)溶融樹脂を射出して比較的高温領域で賦形を行な
う射出成形金型と、射出成形された成形品を冷却する冷
却金型と、各金型の型半体をそれぞれ支持する一対の支
持台と、成形品の取り出しを行なう取出機構とを備え、
この取出機構は、移動部材にバキューム吸着機能を有す
る第一、第二の支持部を設けることにより構成され、射
出成形金型および冷却金型の型開き時には、第一支持部
が移動部材の移動に伴ない射出成形金型から成形品を取
り出して冷却金型へセットするとともに、第二支持部が
上記第一支持部の成形品取り出しとほぼ同時期に冷却金
型から成形品を取り出し、射出成形金型および冷却金型
の型締め時には、第一、第二の支持部がこれら両金型か
ら離れた位置で待機することを特徴とする成形装置。
(1) An injection mold that injects molten resin and performs shaping at a relatively high temperature region, a cooling mold that cools the injection molded product, and a pair that supports each mold half of each mold. Equipped with a support stand and a take-out mechanism for taking out the molded product,
This ejecting mechanism is constructed by providing the moving member with first and second supporting parts that have a vacuum suction function, and when opening the injection mold and the cooling mold, the first supporting part moves the moving member. At the same time, the molded product is taken out from the injection mold and set in the cooling mold, and the second support part takes out the molded product from the cooling mold at about the same time as the first support part takes out the molded product, and the molded product is removed from the injection mold. A molding device characterized in that, when the molding mold and the cooling mold are clamped, the first and second support parts stand by at positions separated from these molds.
JP15704286A 1986-07-03 1986-07-03 Molding device Pending JPS6311317A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15704286A JPS6311317A (en) 1986-07-03 1986-07-03 Molding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15704286A JPS6311317A (en) 1986-07-03 1986-07-03 Molding device

Publications (1)

Publication Number Publication Date
JPS6311317A true JPS6311317A (en) 1988-01-18

Family

ID=15640921

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15704286A Pending JPS6311317A (en) 1986-07-03 1986-07-03 Molding device

Country Status (1)

Country Link
JP (1) JPS6311317A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1016012A (en) * 1996-06-28 1998-01-20 Pentel Kk Apparatus for taking out runner of injection molding machine
US5857257A (en) * 1996-09-27 1999-01-12 Nippon Mektron, Ltd. Method of manufacturing magnetic head suspension having circuit wiring pattern
WO1999010154A1 (en) * 1997-08-25 1999-03-04 Seiko Epson Corporation Method and apparatus for manufacturing optical recording media
EP0903213A2 (en) * 1997-08-19 1999-03-24 Universal Ventures Repositioning of articles between different positions within an intermittently accessible space
EP1491321A2 (en) * 2003-06-24 2004-12-29 Giovanni Bosi Process for manufacturing bottles having at least two components, and plant for its implementation
GB2469276A (en) * 2009-04-06 2010-10-13 Constantinos Sideris Injection moulding and cooling of plastics articles

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1016012A (en) * 1996-06-28 1998-01-20 Pentel Kk Apparatus for taking out runner of injection molding machine
US5857257A (en) * 1996-09-27 1999-01-12 Nippon Mektron, Ltd. Method of manufacturing magnetic head suspension having circuit wiring pattern
US6280660B1 (en) 1997-05-25 2001-08-28 Seiko Epson Corporation Method and apparatus for manufacturing optical recording medium
EP0903213A2 (en) * 1997-08-19 1999-03-24 Universal Ventures Repositioning of articles between different positions within an intermittently accessible space
EP0903213A3 (en) * 1997-08-19 1999-12-22 Universal Ventures Repositioning of articles between different positions within an intermittently accessible space
US6086808A (en) * 1997-08-19 2000-07-11 Universal Ventures Repositioning of articles between different positions within an intermittently accessible space
US6372171B1 (en) 1997-08-19 2002-04-16 Universal Ventures Repositioning of articles between different positions within an intermittently accessible space
WO1999010154A1 (en) * 1997-08-25 1999-03-04 Seiko Epson Corporation Method and apparatus for manufacturing optical recording media
EP1491321A2 (en) * 2003-06-24 2004-12-29 Giovanni Bosi Process for manufacturing bottles having at least two components, and plant for its implementation
EP1491321A3 (en) * 2003-06-24 2005-01-12 Giovanni Bosi Process for manufacturing bottles having at least two components, and plant for its implementation
GB2469276A (en) * 2009-04-06 2010-10-13 Constantinos Sideris Injection moulding and cooling of plastics articles
GB2469276B (en) * 2009-04-06 2011-03-09 Constantinos Sideris Improved injection moulding of plastics articles
US8728381B2 (en) 2009-04-06 2014-05-20 Constantinos Sideris Injection moulding of plastics articles

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