JPS63110585A - Method of reinforcing connection of lead wire - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to the connection strength of lead wires in electronic components, etc., which are assembled by connecting lead wires to an element substrate and coating the substrate with a resin such as a coating agent. The present invention relates to a connection reinforcement method for reinforcing.

2. Description of the Related Art Conventionally, this type of lead wire connection method has been described, for example, in Figs.
This was done as shown in Figure 6. That is, in FIG. 4, a lead wire 2 passing through a coating tube 1 is attached in advance to an element substrate 4 having a ceramic layer 3 by electrical connection, and a coating agent 6 is applied using a metering dispensing coating device 6. By applying an appropriate amount, the coated tube 1. Lead wire 2. Cover the connection point 7. Thereafter, as shown in FIG. 5, the reinforcing effect is obtained by heating and curing with a heater 8 while maintaining the horizontal state.

Problems to be Solved by the Invention In such a conventional method, as the coating agent 5 hardens in the heater 8, the coating agent 6 gradually spreads due to its own weight and viscosity, and the coating tube 1. Lead wire 2. Go around to connection point 7. However, coating agent 5
Due to the inherent surface tension of the element substrate 4, the area near the connection point 7 near the end face of the element substrate 4 tends to be thinner than the central area, and curing proceeds in this state, as shown in FIG. The reinforcing effect in the X-axis and Z-axis directions was not fully satisfactory. In addition, in recent years, element substrate 4
Due to the non-uniform dimensions of the coating agent 5 protruding around the periphery, there is a problem with the product properties, and therefore some kind of size regulation is required.

The present invention solves these problems, and aims to provide a lead wire connection reinforcement method that can improve the connection reinforcement effect of the connection point 7 and meet the above requirements. .

Means for Solving the Problems The present invention includes a step of applying an appropriate amount of coating resin onto an element substrate such as an electronic component to which lead wires are connected in advance, and curing the coating resin into a uniform shape. The method includes the step of tilting the device substrate so that the connection portion of the lead wire is positioned vertically downward, providing a fillable enclosure to surround the device substrate, and setting it in a drying oven. be.

Effect: With this method, the connection point is fixed while being fully wrapped in the coating agent, and a reinforcing effect can be obtained, and the same effect can also be obtained between the coating tube and the element substrate. becomes. In addition, surrounding regulation jig,
The coating agent is molded into a certain shape by the upper surface regulating jig.

Embodiment FIG. 1a is a perspective view showing a lead wire connection reinforcement method according to an embodiment of the present invention, and FIG. 1 is a perspective view showing the structure of an electronic component used in the embodiment. If the parts are the same as those in the conventional example, they are given the same numbers.

Now, as shown in FIG. 1a, the circumference of the fixing plate 91 is
1. The upper regulating jig 13 is for regulating the dimensions of the coating agent 6 into a certain shape, and is used for controlling the dimensions of the element substrate 4 having the structure shown in FIG.
An adhesive tape 10 having adhesiveness on both sides is placed on the fixing plate 9.
is pasted and set at a certain position with predetermined dimensions. In this state, connect the lead wire to the electrode extraction part 12.
Connect using methods such as welding or thermocompression bonding. After that, an appropriate amount of the thermosetting resin coating agent 5 is applied using the metered discharge applicator 6, but the surrounding regulating jig 11 is made of a material with low adhesiveness, and a combination that can be easily removed after curing is selected. I'll keep it. By applying an appropriate amount of the coating agent 6, the clearance between the element substrate 4 and the circumferential regulating jig 11 is filled, and if the entire jig is preheated at this time, the filling will be better. Next, the upper surface regulating jig 13 is superimposed on the surrounding regulating jig 11, and as shown in FIG. When the coating agent 5 is charged into the heater 8 while being kept under pressure, the coating agent 5 starts to flow further into the clearance area due to its own weight and viscosity. After a certain period of time has elapsed in this state, curing is completed, the shape becomes as shown in FIG. 3a, b, and o, and the product is removed from the jig. As a result of the above, the connection point 7 can be fixed in a state where it is sufficiently wrapped by the coating material 6, and the desired reinforcing effect can be obtained, and the same effect can be obtained between the coating tube 1 and the element substrate 4. can be obtained. Furthermore, since the coating agent is molded into a certain shape, it is possible to comply with the size regulations that have been required in recent years.

Effects of the Invention As described above, according to the present invention, the connection portion between the element substrate and the lead wire can be uniformly coated with a resin such as a coating agent, the connection strength can be reliably reinforced, and the size of the cord agent can be improved. Since there is no non-uniformity, there are no problems with product characteristics, it meets the requirements of size regulations, and reliability is improved, so its industrial value is great.

[Brief explanation of the drawing]

The first recess is a perspective view showing a lead wire connection reinforcement method according to an embodiment of the present invention, FIG. 1 is a perspective view showing the structure of an electronic component used in the embodiment, and FIG. 2 is a heating according to the embodiment. A front view showing the curing method, FIG. 3A is a sectional view from the front showing a state in which the lead wires are connected and reinforced according to the example, FIG. A bottom view of the same state, FIG. 4 is a perspective view showing the conventional coating agent application method,
FIG. 6 is a front view showing a conventional heat curing method. 1...Coated tube, 2...Lead wire,
4...Element substrate, 6...Coating agent, 9
...Fixing plate, 10...Adhesive tape, 1
1... - Surrounding regulation jig, 13... Top surface regulation jig, 14... Presser jig, 15... Presser shaft. Name of agent: Patent attorney Toshio Nakao and 1 other person/-
---Paddle heel 4 knees 7゛2--Ku 1f Rock 6---O→Remove Figure 3 (long) (b)! Figure 4 Figure 5

Claims (1)

[Claims] A step of applying an appropriate amount of coating resin onto an element substrate such as an electronic component to which lead wires have been connected in advance, and a step of applying an appropriate amount of coating resin onto an element substrate such as an electronic component to which lead wires are connected in advance; A method for reinforcing connection of lead wires, comprising the steps of: tilting the element substrate so that the element substrate is positioned vertically downward, providing a fillable enclosure to surround the element substrate, and setting the element substrate in a drying oven.