JPS63110071U - - Google Patents
Info
- Publication number
- JPS63110071U JPS63110071U JP185287U JP185287U JPS63110071U JP S63110071 U JPS63110071 U JP S63110071U JP 185287 U JP185287 U JP 185287U JP 185287 U JP185287 U JP 185287U JP S63110071 U JPS63110071 U JP S63110071U
- Authority
- JP
- Japan
- Prior art keywords
- land
- guard electrode
- view
- exposes
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第1図乃至第18図はこの考案の一実施例を示
すもので、第1図は基本例を示す平面図、第2図
はその一部の底面図、第3図は第1図のA―A線
断面図、第4図は第1図のB―B線断面図、第5
図は第1図のC―C線断面図、第6図は標準例を
示す平面図、第7図はその一部の底面図、第8図
は第6図のD―D線断面図、第9図は第6図のE
―E線断面図、第10図は第6図のF―F線断面
図、第11図は変形例を示す平面図、第12図は
その一部の底面図、第13図は第11図のG―G
線断面図、第14図は第11図のH―H線断面図
、第15図は第11図のI―I線断面図、第16
図はOPアンプの回路図、第17図は実装パター
ン例を示す平面図、第18図はその底面図、第1
9図は従来例を示す平面図、第20図はその一部
の底面図、第21図は第19図のJ―J線断面図
、第22図は第19図のK―K線断面図、第23
図は第19図のL―L線断面図である。
1……基板、2……配線パターン、3……ラン
ド、4……スルーホール、5……ガード電極、7
……絶縁体被膜。
Figures 1 to 18 show one embodiment of this invention. Figure 1 is a plan view showing a basic example, Figure 2 is a bottom view of a part of it, and Figure 3 is A of Figure 1. -A sectional view, Fig. 4 is a BB sectional view of Fig. 1, Fig. 5
The figure is a sectional view taken along the line CC in Fig. 1, Fig. 6 is a plan view showing a standard example, Fig. 7 is a bottom view of a part thereof, and Fig. 8 is a sectional view taken along the line D-D in Fig. 6. Figure 9 is E of Figure 6.
-E line sectional view, Figure 10 is a FF line sectional view of Figure 6, Figure 11 is a plan view showing a modification, Figure 12 is a partial bottom view, Figure 13 is Figure 11. G-G
14 is a sectional view taken along line H--H in FIG. 11, FIG. 15 is a sectional view taken along line I--I in FIG. 11, and FIG.
The figure is a circuit diagram of an OP amplifier, Figure 17 is a plan view showing an example of a mounting pattern, Figure 18 is a bottom view, and Figure 1
Fig. 9 is a plan view showing a conventional example, Fig. 20 is a bottom view of a part thereof, Fig. 21 is a cross-sectional view taken along line J-J in Fig. 19, and Fig. 22 is a cross-sectional view taken along line K-K in Fig. 19. , 23rd
The figure is a sectional view taken along line LL in FIG. 19. 1... Board, 2... Wiring pattern, 3... Land, 4... Through hole, 5... Guard electrode, 7
...Insulator coating.
Claims (1)
るランドの周り乃至はこれらのランド間を結ぶ配
線パターンとランドとの周りを取り囲む形状のガ
ード電極を備えたプリント配線基板において、前
記ランド表面を全面的に露出させ、かつ、前記ガ
ード電極表面を一部的又は全面的に露出させる形
状で基板表面上に絶縁体被膜を形成したことを特
徴とするプリント配線基板。 In a printed wiring board equipped with a guard electrode shaped to surround a land having a through hole for passing a lead wire of an electrical component or a wiring pattern connecting these lands and a land, the surface of the land is completely covered. 1. A printed wiring board, characterized in that an insulating film is formed on a surface of the substrate in a shape that exposes the guard electrode surface and partially or completely exposes the surface of the guard electrode.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP185287U JPS63110071U (en) | 1987-01-09 | 1987-01-09 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP185287U JPS63110071U (en) | 1987-01-09 | 1987-01-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63110071U true JPS63110071U (en) | 1988-07-15 |
Family
ID=30780146
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP185287U Pending JPS63110071U (en) | 1987-01-09 | 1987-01-09 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63110071U (en) |
-
1987
- 1987-01-09 JP JP185287U patent/JPS63110071U/ja active Pending