JPS63105875U - - Google Patents
Info
- Publication number
- JPS63105875U JPS63105875U JP1986198867U JP19886786U JPS63105875U JP S63105875 U JPS63105875 U JP S63105875U JP 1986198867 U JP1986198867 U JP 1986198867U JP 19886786 U JP19886786 U JP 19886786U JP S63105875 U JPS63105875 U JP S63105875U
- Authority
- JP
- Japan
- Prior art keywords
- cryogenic
- flat plate
- chip
- substrate
- processing device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 8
- 238000005259 measurement Methods 0.000 claims description 6
- 239000010453 quartz Substances 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000010409 thin film Substances 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910052734 helium Inorganic materials 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Landscapes
- Testing Or Calibration Of Command Recording Devices (AREA)
- Measuring Magnetic Variables (AREA)
- Measurement Of Current Or Voltage (AREA)
- Superconductor Devices And Manufacturing Methods Thereof (AREA)
- Containers, Films, And Cooling For Superconductive Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986198867U JPH0536227Y2 (enrdf_load_stackoverflow) | 1986-12-26 | 1986-12-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986198867U JPH0536227Y2 (enrdf_load_stackoverflow) | 1986-12-26 | 1986-12-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63105875U true JPS63105875U (enrdf_load_stackoverflow) | 1988-07-08 |
JPH0536227Y2 JPH0536227Y2 (enrdf_load_stackoverflow) | 1993-09-13 |
Family
ID=31159957
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986198867U Expired - Lifetime JPH0536227Y2 (enrdf_load_stackoverflow) | 1986-12-26 | 1986-12-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0536227Y2 (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009099988A (ja) * | 2007-10-16 | 2009-05-07 | Siemens Magnet Technology Ltd | 超伝導接続部の冷却および電気絶縁方法ならびに装置 |
-
1986
- 1986-12-26 JP JP1986198867U patent/JPH0536227Y2/ja not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009099988A (ja) * | 2007-10-16 | 2009-05-07 | Siemens Magnet Technology Ltd | 超伝導接続部の冷却および電気絶縁方法ならびに装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH0536227Y2 (enrdf_load_stackoverflow) | 1993-09-13 |
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