JPS63177764U - - Google Patents

Info

Publication number

JPS63177764U

JPS63177764U JP6744287U JP6744287U JPS63177764U JP S63177764 U JPS63177764 U JP S63177764U JP 6744287 U JP6744287 U JP 6744287U JP 6744287 U JP6744287 U JP 6744287U JP S63177764 U JPS63177764 U JP S63177764U

Authority

JP

Japan

Prior art keywords

cryogenic

flat plate

chip

recess

room temperature

Prior art date

1987-05-07

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 238000005259 measurement Methods 0.000 claims description 4
• 230000009977 dual effect Effects 0.000 claims description 3
• 229910052734 helium Inorganic materials 0.000 claims description 3
• 239000001307 helium Substances 0.000 claims description 3
• SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 3
• 239000007788 liquid Substances 0.000 claims description 3
• 239000010409 thin film Substances 0.000 claims description 3
• 239000010453 quartz Substances 0.000 claims description 2
• VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
• 239000000758 substrate Substances 0.000 claims description 2
• 238000000034 method Methods 0.000 claims 1
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
• 229910052802 copper Inorganic materials 0.000 description 3
• 239000010949 copper Substances 0.000 description 3
• 239000000853 adhesive Substances 0.000 description 1
• 230000001070 adhesive effect Effects 0.000 description 1
• 238000010586 diagram Methods 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 125000006850 spacer group Chemical group 0.000 description 1