JPS6310582U - - Google Patents
Info
- Publication number
- JPS6310582U JPS6310582U JP10590086U JP10590086U JPS6310582U JP S6310582 U JPS6310582 U JP S6310582U JP 10590086 U JP10590086 U JP 10590086U JP 10590086 U JP10590086 U JP 10590086U JP S6310582 U JPS6310582 U JP S6310582U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- electronic components
- wiring board
- printed
- soldered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000011810 insulating material Substances 0.000 claims 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Waveguide Connection Structure (AREA)
- Waveguides (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10590086U JPS6310582U (US08063081-20111122-C00242.png) | 1986-07-09 | 1986-07-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10590086U JPS6310582U (US08063081-20111122-C00242.png) | 1986-07-09 | 1986-07-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6310582U true JPS6310582U (US08063081-20111122-C00242.png) | 1988-01-23 |
Family
ID=30980763
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10590086U Pending JPS6310582U (US08063081-20111122-C00242.png) | 1986-07-09 | 1986-07-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6310582U (US08063081-20111122-C00242.png) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009267149A (ja) * | 2008-04-25 | 2009-11-12 | Dainippon Printing Co Ltd | 部品内蔵配線板、部品内蔵配線板の製造方法 |
| JP2010040891A (ja) * | 2008-08-07 | 2010-02-18 | Dainippon Printing Co Ltd | 部品内蔵配線板 |
| WO2011040480A1 (ja) * | 2009-09-30 | 2011-04-07 | 株式会社村田製作所 | 回路基板 |
| JP2013225711A (ja) * | 2013-08-07 | 2013-10-31 | Dainippon Printing Co Ltd | 部品内蔵配線板 |
| JP5360221B2 (ja) * | 2009-09-16 | 2013-12-04 | 株式会社村田製作所 | 電子部品内蔵モジュール |
| EP2211598A3 (de) * | 2009-01-27 | 2014-02-12 | Robert Bosch GmbH | Verfahren zur Herstellung eines Sensormoduls |
-
1986
- 1986-07-09 JP JP10590086U patent/JPS6310582U/ja active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009267149A (ja) * | 2008-04-25 | 2009-11-12 | Dainippon Printing Co Ltd | 部品内蔵配線板、部品内蔵配線板の製造方法 |
| JP2010040891A (ja) * | 2008-08-07 | 2010-02-18 | Dainippon Printing Co Ltd | 部品内蔵配線板 |
| EP2211598A3 (de) * | 2009-01-27 | 2014-02-12 | Robert Bosch GmbH | Verfahren zur Herstellung eines Sensormoduls |
| JP5360221B2 (ja) * | 2009-09-16 | 2013-12-04 | 株式会社村田製作所 | 電子部品内蔵モジュール |
| US8675367B2 (en) | 2009-09-16 | 2014-03-18 | Murata Manufacturing Co., Ltd. | Module incorporating electronic component |
| WO2011040480A1 (ja) * | 2009-09-30 | 2011-04-07 | 株式会社村田製作所 | 回路基板 |
| JPWO2011040480A1 (ja) * | 2009-09-30 | 2013-02-28 | 株式会社村田製作所 | 回路基板 |
| JP2013225711A (ja) * | 2013-08-07 | 2013-10-31 | Dainippon Printing Co Ltd | 部品内蔵配線板 |
