JPS6310575U - - Google Patents
Info
- Publication number
- JPS6310575U JPS6310575U JP1986104431U JP10443186U JPS6310575U JP S6310575 U JPS6310575 U JP S6310575U JP 1986104431 U JP1986104431 U JP 1986104431U JP 10443186 U JP10443186 U JP 10443186U JP S6310575 U JPS6310575 U JP S6310575U
- Authority
- JP
- Japan
- Prior art keywords
- junction
- compound semiconductor
- approximately parallel
- light
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
- H01L2224/48139—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate with an intermediate bond, e.g. continuous wire daisy chain
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Description
第１図は本考案実施例の発光ダイオード表示器
の要部斜視図、第２図は従来の表示器の側面図で
ある。 １……基板、２……発光ダイオード、２０，２
０……素子、２１……ｐｎ接合、２２，２２，…
２３，２３……溝、２５，２５……（遮光性の）
被膜。
の要部斜視図、第２図は従来の表示器の側面図で
ある。 １……基板、２……発光ダイオード、２０，２
０……素子、２１……ｐｎ接合、２２，２２，…
２３，２３……溝、２５，２５……（遮光性の）
被膜。
Claims (1)
- 化合物半導体の表面に略平行なｐｎ接合と、ｐ
ｎ接合より深く設けられた複数条の溝と、溝の一
側面に設けられた遮光性の被膜とを具備した事を
特徴とする発光ダイオード表示器。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986104431U JPS6310575U (ja) | 1986-07-08 | 1986-07-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986104431U JPS6310575U (ja) | 1986-07-08 | 1986-07-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6310575U true JPS6310575U (ja) | 1988-01-23 |
Family
ID=30977921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986104431U Pending JPS6310575U (ja) | 1986-07-08 | 1986-07-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6310575U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9093356B2 (en) | 2010-12-28 | 2015-07-28 | Nichia Corporation | Semiconductor light emitting element |
-
1986
- 1986-07-08 JP JP1986104431U patent/JPS6310575U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9093356B2 (en) | 2010-12-28 | 2015-07-28 | Nichia Corporation | Semiconductor light emitting element |