JPS6310567U - - Google Patents
Info
- Publication number
- JPS6310567U JPS6310567U JP1986105051U JP10505186U JPS6310567U JP S6310567 U JPS6310567 U JP S6310567U JP 1986105051 U JP1986105051 U JP 1986105051U JP 10505186 U JP10505186 U JP 10505186U JP S6310567 U JPS6310567 U JP S6310567U
- Authority
- JP
- Japan
- Prior art keywords
- frame
- leads
- plan
- view
- tie bar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986105051U JPH0521887Y2 (https=) | 1986-07-08 | 1986-07-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986105051U JPH0521887Y2 (https=) | 1986-07-08 | 1986-07-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6310567U true JPS6310567U (https=) | 1988-01-23 |
| JPH0521887Y2 JPH0521887Y2 (https=) | 1993-06-04 |
Family
ID=30979113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986105051U Expired - Lifetime JPH0521887Y2 (https=) | 1986-07-08 | 1986-07-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0521887Y2 (https=) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5669852A (en) * | 1979-11-09 | 1981-06-11 | Mitsubishi Electric Corp | Lead frame for semiconductor device |
-
1986
- 1986-07-08 JP JP1986105051U patent/JPH0521887Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5669852A (en) * | 1979-11-09 | 1981-06-11 | Mitsubishi Electric Corp | Lead frame for semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0521887Y2 (https=) | 1993-06-04 |