JPS62188149U - - Google Patents
Info
- Publication number
- JPS62188149U JPS62188149U JP1986076334U JP7633486U JPS62188149U JP S62188149 U JPS62188149 U JP S62188149U JP 1986076334 U JP1986076334 U JP 1986076334U JP 7633486 U JP7633486 U JP 7633486U JP S62188149 U JPS62188149 U JP S62188149U
- Authority
- JP
- Japan
- Prior art keywords
- thickened
- exposed
- semiconductor device
- resin
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/932—Plan-view shape, i.e. in top view
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986076334U JPH0419799Y2 (https=) | 1986-05-22 | 1986-05-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986076334U JPH0419799Y2 (https=) | 1986-05-22 | 1986-05-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62188149U true JPS62188149U (https=) | 1987-11-30 |
| JPH0419799Y2 JPH0419799Y2 (https=) | 1992-05-06 |
Family
ID=30923315
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986076334U Expired JPH0419799Y2 (https=) | 1986-05-22 | 1986-05-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0419799Y2 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009302387A (ja) * | 2008-06-16 | 2009-12-24 | Sanken Electric Co Ltd | 半導体装置及びその製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59115653U (ja) * | 1983-01-25 | 1984-08-04 | サンケン電気株式会社 | 絶縁物封止半導体装置 |
-
1986
- 1986-05-22 JP JP1986076334U patent/JPH0419799Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59115653U (ja) * | 1983-01-25 | 1984-08-04 | サンケン電気株式会社 | 絶縁物封止半導体装置 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009302387A (ja) * | 2008-06-16 | 2009-12-24 | Sanken Electric Co Ltd | 半導体装置及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0419799Y2 (https=) | 1992-05-06 |