JPS63104510A - Piezoelectric oscillation parts and substrate loading said parts - Google Patents
Piezoelectric oscillation parts and substrate loading said partsInfo
- Publication number
- JPS63104510A JPS63104510A JP25135086A JP25135086A JPS63104510A JP S63104510 A JPS63104510 A JP S63104510A JP 25135086 A JP25135086 A JP 25135086A JP 25135086 A JP25135086 A JP 25135086A JP S63104510 A JPS63104510 A JP S63104510A
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric
- main surface
- piezoelectric vibrating
- vibrating
- vibrating component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 33
- 230000010355 oscillation Effects 0.000 title abstract 6
- 239000000919 ceramic Substances 0.000 claims abstract description 21
- 230000001681 protective effect Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（ａ）産業上の利用分野
この発明は、フィルタなどに用いられる圧電振動部品お
よび圧電振動部品が実装された基板に関する。DETAILED DESCRIPTION OF THE INVENTION (a) Industrial Application Field The present invention relates to a piezoelectric vibrating component used in a filter or the like, and a substrate on which the piezoelectric vibrating component is mounted.
（ｂｌ従来の技術
角板や矩形板状の圧電セラミクス基板の両主表面に振動
電極が形成された圧電振動部品は、たとえば拡がり、長
さ振動モードの圧電振動部品の場合、従来は圧電セラミ
クス基板の両主表面に振動電極を形成し、この基板を接
続端子間に挟持することによって信号の供給を行ってい
た。従ってこの種の圧電振動部品は、ケース内に圧電セ
ラミグ１コ
大基板と接続端子を組み込んで部品を構成し、活路基板
上に実装している。(bl Conventional Technology) A piezoelectric vibrating component in which vibrating electrodes are formed on both main surfaces of a piezoelectric ceramic substrate in the form of a square plate or a rectangular plate, for example, in the case of a piezoelectric vibrating component in a spreading or length vibration mode, conventionally a piezoelectric ceramic substrate is used. Vibrating electrodes are formed on both main surfaces of the board, and signals are supplied by sandwiching this board between connection terminals.Therefore, this type of piezoelectric vibrating component connects one piezoelectric ceramic board to a large board within the case. Components are constructed by incorporating terminals and mounted on a circuit board.
第７図はこのような従来の圧電振動部品の構造を表す断
面図である。図において１１〜１４はそれぞれ圧電セラ
ミクス基板の両主表面に振動電極が形成された圧電素子
を表し、これらの圧電素子は接続端子２１．２２．２３
．２４および７ａ。FIG. 7 is a sectional view showing the structure of such a conventional piezoelectric vibrating component. In the figure, 11 to 14 represent piezoelectric elements in which vibrating electrodes are formed on both main surfaces of a piezoelectric ceramic substrate, and these piezoelectric elements are connected to connection terminals 21, 22, and 23.
．． 24 and 7a.
７ｂ、７ｃとともに積層されてケース２０内に保持され
ている。端子？ａ、７ｂ、７ｃはこの回路の入出力端子
として外部に引き出されている。なお、前記圧電素子と
接続端子とともにスプリング端子２５が挿入されていて
、各圧電素子と接続端子を適正圧力で保持している。It is stacked together with 7b and 7c and held in the case 20. Terminal? A, 7b, and 7c are drawn out to the outside as input/output terminals of this circuit. Note that a spring terminal 25 is inserted together with the piezoelectric element and the connecting terminal, and holds each piezoelectric element and the connecting terminal with appropriate pressure.
ＴＣ）発明が解決しようとする問題点
上記従来例の圧電振動部品は圧電素子と接続端子との積
層構造であるため、ケースなどの積層保持手段が必要で
あり、部品が複雑化しまた大型化するという問題があっ
た。さらに、圧電振動部品を構成する圧電素子は回路基
板に対して垂直方向に配列されるため、圧電振動部品お
よび圧電振動部品が実装さた基板の高さが高くなるとい
う問題があった。TC) Problems to be Solved by the Invention Since the piezoelectric vibrating component of the above conventional example has a laminated structure of a piezoelectric element and a connecting terminal, a means for holding the lamination such as a case is required, making the component complicated and large. There was a problem. Furthermore, since the piezoelectric elements constituting the piezoelectric vibrating component are arranged in a direction perpendicular to the circuit board, there is a problem that the height of the piezoelectric vibrating component and the board on which the piezoelectric vibrating component is mounted becomes high.
この発明は、このような従来の問題点を解消して、回路
基板に対して表面実装を行うことを可能とした圧電振動
部品および圧電振動部品実装基板を提供することを目的
としている。An object of the present invention is to solve these conventional problems and provide a piezoelectric vibrating component and a piezoelectric vibrating component mounting board that can be surface mounted on a circuit board.
（ｄ１問題点を解決するための手段
この発明の圧電振動部品は、圧電セラミクス基板の両主
表面に振動電極が形成されるとともに、第１の主表面に
設けられた振動電極を前記基板の側面を介して第２の主
表面の一部に回り込ませることによって接続端子を形成
したことを特徴としている。(Means for Solving Problem d1) The piezoelectric vibrating component of the present invention has vibrating electrodes formed on both main surfaces of a piezoelectric ceramic substrate, and a vibrating electrode provided on the first main surface is connected to a side surface of the substrate. The connecting terminal is characterized in that the connecting terminal is formed by wrapping around a part of the second main surface via the connecting terminal.
また、この発明の圧電振動部品実装基板は、圧電セラミ
クス基板の両主表面に振動電極が形成され、第１の主表
面に形成された振動電極を前記基板の側面を介して第２
の主表面の一部に回り込ませたことによって接続端子が
形成された圧電振動部品と、この圧電振動部品の第２の
主表面に形成された振動電極および接続端子を接続する
接続部が形成された基板部とから構成したことを特徴と
している。Further, in the piezoelectric vibrating component mounting board of the present invention, vibrating electrodes are formed on both main surfaces of the piezoelectric ceramic substrate, and the vibrating electrode formed on the first main surface is connected to a second vibrating electrode through the side surface of the substrate.
A piezoelectric vibrating component has a connecting terminal formed by wrapping around a part of the main surface of the piezoelectric vibrating component, and a connecting portion is formed to connect the vibrating electrode and the connecting terminal formed on the second main surface of the piezoelectric vibrating component. It is characterized in that it is composed of a base plate section.
（ｅ）作用
上記構成による圧電振動部品は圧電セラミクス基板の第
１の主表面に設けられた電極がその基板の側面を介して
第２の主表面の一部まで回り込ませて形成されている。(e) Function The piezoelectric vibrating component having the above configuration is formed by extending the electrode provided on the first main surface of the piezoelectric ceramic substrate to a part of the second main surface via the side surface of the substrate.
すなわち第２の主表面には振動電極と第１の主表面に設
けられた振動電極の接続端子が形成されているため、こ
の第２の主表面を接続端子と接する面として用いること
ができ、圧電振動部品を接続端子間に挟持することなく
信号の入出力を行うことが可能となる。That is, since the vibration electrode and the connection terminal of the vibration electrode provided on the first main surface are formed on the second main surface, this second main surface can be used as a surface in contact with the connection terminal, It becomes possible to input and output signals without sandwiching the piezoelectric vibrating component between connection terminals.
また、この発明の圧電振動部品実装基板によれば、圧電
振動部品は圧電セラミクス基板の両主表面に振動電極が
形成され、第２の主表面には第１の主表面に形成された
振動電極の接続端子が形成されていて、基板部には前記
圧電振動部品の第２の主表面に形成された振動電極およ
び接続端子を接続する接続部が形成されていて、圧電振
動部品の第２の主表面が基板部の表面に対向して実装さ
れている。このため、圧電振動部品を基板部に対して並
行に実装することにより実装基板全体を低背化すること
ができる。Further, according to the piezoelectric vibrating component mounting board of the present invention, the piezoelectric vibrating component has vibrating electrodes formed on both main surfaces of the piezoelectric ceramic substrate, and vibrating electrodes formed on the first main surface are formed on the second main surface. A connection terminal is formed on the substrate portion, and a connection portion for connecting the vibration electrode and the connection terminal formed on the second main surface of the piezoelectric vibrating component is formed, The main surface is mounted to face the surface of the substrate section. Therefore, by mounting the piezoelectric vibrating component in parallel to the substrate part, the height of the entire mounting board can be reduced.
（ｆ）実施例
第１図はこの発明の実施例である圧電振動部品の外観を
表す斜視図である。(f) Embodiment FIG. 1 is a perspective view showing the appearance of a piezoelectric vibrating component which is an embodiment of the present invention.
圧電振動部品１は圧電セラミクス基板２の第１の主表面
に振動電極４が形成され、第２の主表面に振動電極３が
形成されている。図に示すように第１の主表面に形成さ
れている振動電極４は圧電セラミクス基板２の側面を介
して第２の主表面の一部に回り込ませて電極４ａが形成
されている。In the piezoelectric vibrating component 1, a vibrating electrode 4 is formed on the first main surface of a piezoelectric ceramic substrate 2, and a vibrating electrode 3 is formed on the second main surface. As shown in the figure, the vibrating electrode 4 formed on the first main surface is wrapped around a part of the second main surface via the side surface of the piezoelectric ceramic substrate 2 to form an electrode 4a.
この電極４ａは振動電極４の接続端子として用いられる
。なお、第２の主表面に形成されている振動電極３は前
記接続端子４ａと短絡しないように接続端子４ａが形成
される領域を除いた部分にのみ振動電極３が形成されて
いる。This electrode 4a is used as a connection terminal for the vibrating electrode 4. Note that the vibrating electrode 3 formed on the second main surface is formed only in a portion excluding the area where the connecting terminal 4a is formed so as not to short-circuit with the connecting terminal 4a.
これらの各電極は圧電セラミクス基板の両主表面および
側面の各面についてＡｇペーストを印刷し、焼き付ける
ことによって形成される。Each of these electrodes is formed by printing and baking Ag paste on both main surfaces and side surfaces of the piezoelectric ceramic substrate.
このようにして構成された圧電振動部品は第２の主表面
に形成された振動電極３および接続端子４ａを信号の入
出力端子として用いることができる。すなわちこの第２
の主表面を回路基板に形成された接続部に対向させて接
続することにより基板部に圧電振動部品を実装すること
ができる。第２図はその場合の実装例を表す断面図であ
る。The piezoelectric vibrating component configured in this manner can use the vibrating electrode 3 and the connecting terminal 4a formed on the second main surface as input/output terminals for signals. That is, this second
The piezoelectric vibrating component can be mounted on the circuit board by connecting the main surface of the circuit board so as to face the connection part formed on the circuit board. FIG. 2 is a sectional view showing an example of implementation in that case.
同図において５は回路基板を表し、その表面に配線パタ
ーン６ａおよび６ｂが形成されている。In the figure, 5 represents a circuit board, on the surface of which wiring patterns 6a and 6b are formed.
これらの配線パターンの上部には導電性接着剤８ａおよ
び８ｂが印刷され、さらにその上部に前記圧電振動部品
の第２の主表面を基板表面と対向させて接着させる。こ
のようにして圧電振動部品の第２の主表面に形成された
振動電極３は配線基板５の配線パターン６ａと接続され
、接続端子４ａは６ｂと接続される。Conductive adhesives 8a and 8b are printed on top of these wiring patterns, and further, the second main surface of the piezoelectric vibrating component is bonded to the top thereof so as to face the substrate surface. The vibrating electrode 3 thus formed on the second main surface of the piezoelectric vibrating component is connected to the wiring pattern 6a of the wiring board 5, and the connecting terminal 4a is connected to 6b.
次に複数の圧電振動部品を回路基板上に実装して一つの
フィルタ回路を構成する場合について説明する。Next, a case will be described in which a plurality of piezoelectric vibrating components are mounted on a circuit board to form one filter circuit.
第３図は回路基板５の表面に四つの圧電振動部品１１〜
１４を実装した際の外観を表す斜視図であり、第６図は
その回路図を表し、いわゆるラダーフィルタを構成して
いる。第６図に示すように回路基板５の表面には配線パ
ターン６が形成されていて、各圧電振動部品は第２図に
示した例と同様にしておのおの第２の主表面に形成され
た振動電極および接続端子が配線パターンと接続されて
いる。なお、回路基板５の周辺部に形成された電極７ａ
、７ｂ、７ｃ、７ｄは信号の入出力端子を表し、この回
路基板の上部に保護カバーを被せることによってフィル
タとして用いることのできる一つの部品が構成される。FIG. 3 shows four piezoelectric vibrating components 11~ on the surface of the circuit board 5.
6 is a perspective view showing the external appearance when the device 14 is mounted, and FIG. 6 shows its circuit diagram, which constitutes a so-called ladder filter. As shown in FIG. 6, a wiring pattern 6 is formed on the surface of the circuit board 5, and each piezoelectric vibrating component receives vibration formed on its second main surface in the same manner as the example shown in FIG. The electrodes and connection terminals are connected to the wiring pattern. Note that the electrode 7a formed on the periphery of the circuit board 5
, 7b, 7c, and 7d represent signal input/output terminals, and by covering the top of this circuit board with a protective cover, one component that can be used as a filter is constructed.
第４図は保護カバー９を被せた場合の断面の状態を表す
図である。この図からも明らかなように複数の圧電振動
部品を実装する場合でも各圧電振動部品は積層すること
なく回路基板表面に実装されて、全体として低背化され
る。FIG. 4 is a diagram showing a cross-sectional state when the protective cover 9 is covered. As is clear from this figure, even when a plurality of piezoelectric vibrating components are mounted, each piezoelectric vibrating component is mounted on the surface of the circuit board without being stacked, and the overall height can be reduced.
上記実施例は圧電セラミクス基板の第１の主表面に形成
された振動電極の接続端子を圧電セラミクス基板の側面
の一部を介して回り込ませた例であったが、たとえば第
５図に示すように圧電セラミクス基板の側面の全面を用
いて電極を回り込ませて、第２の主表面に接続端子４ａ
を形成することも可能である。In the above embodiment, the connection terminal of the vibrating electrode formed on the first main surface of the piezoelectric ceramic substrate was routed through a part of the side surface of the piezoelectric ceramic substrate. The electrode is wrapped around the entire side surface of the piezoelectric ceramic substrate, and the connection terminal 4a is attached to the second main surface.
It is also possible to form
（尊発明の効果
以上のようにこの発明の圧電振動部品によれば、圧電セ
ラミクス基板の第２の主表面に第１の主表面の振動電極
の接続端子が形成されたため、この面だけで信号の入出
力を行うことができる。したがって圧電振動部品を挟持
するための特別な接続端子が不要となる。このため部品
点数が削減されて小型化およびコストダウンをはかるこ
とができる。また、この発明の圧電振動部品実装基板に
よれば、回路基板表面に複数の圧電振動部品を実装した
場合でも各圧電振動部品は積層する必要がなく、回路基
板全体を低背化することができ、電子機器への実装が容
易となる。(As described above, according to the piezoelectric vibrating component of the present invention, the connection terminal of the vibrating electrode on the first main surface is formed on the second main surface of the piezoelectric ceramic substrate, so that a signal can be generated only on this surface. Therefore, there is no need for special connection terminals for holding the piezoelectric vibrating parts.This reduces the number of parts, making it possible to downsize and reduce costs.Furthermore, this invention According to the piezoelectric vibrating component mounting board of , even when multiple piezoelectric vibrating components are mounted on the circuit board surface, there is no need to stack each piezoelectric vibrating component, and the overall height of the circuit board can be reduced, making it suitable for electronic devices. implementation becomes easy.
【図面の簡単な説明】
第１図はこの発明の実施例である圧電振動部品の外観を
表す斜視図、第２図は圧電振動部品の回路基板上への実
装状態を表す断面図、第３図は複数の圧電振動部品を実
装した回路基板の外観を表す斜視図、第４図は同基板に
保護カバーを被せた状態における断面図、第５図は他の
実施例に係る圧電振動部品の外観を表す斜視図、第６図
は第３図に示したフィルタ回路を表す図、第７図は従来
の圧電振動部品の実装状態を表す図である。
１−圧電振動部品、
２−圧電セラミクス基板、
３．４−振動電極、
４ａ−接続端子、
５−回路基板、
５ａ、５ｂ−配線パターン、
３ａ、３ｂ−導電性接着剤。[Brief Description of the Drawings] Fig. 1 is a perspective view showing the appearance of a piezoelectric vibrating component according to an embodiment of the present invention, Fig. 2 is a cross-sectional view showing the mounting state of the piezoelectric vibrating part on a circuit board, and Fig. 3 The figure is a perspective view showing the appearance of a circuit board on which a plurality of piezoelectric vibrating components are mounted, FIG. 4 is a cross-sectional view of the circuit board with a protective cover covered, and FIG. FIG. 6 is a perspective view showing the external appearance, FIG. 6 is a view showing the filter circuit shown in FIG. 3, and FIG. 7 is a view showing the mounting state of a conventional piezoelectric vibrating component. 1-piezoelectric vibrating component, 2-piezoelectric ceramic substrate, 3.4-vibrating electrode, 4a-connecting terminal, 5-circuit board, 5a, 5b-wiring pattern, 3a, 3b-conductive adhesive.
Claims (2)
されるとともに、第１の主表面に設けられた振動電極を
前記基板の側面を介して第２の主表面の一部に回り込ま
せて接続端子としたことを特徴とする圧電振動部品。(1) Vibrating electrodes are formed on both main surfaces of a piezoelectric ceramic substrate, and the vibrating electrode provided on the first main surface is wrapped around a part of the second main surface via the side surface of the substrate. A piezoelectric vibrating component characterized by having a connection terminal.
ラミクス基板の両主表面に振動電極が形成され、第１の
主表面に形成された振動電極を前記基板の側面を介して
第２の主表面の一部に回り込ませて接続端子とした圧電
振動部品と、この圧電振動部品の第２の主表面に形成さ
れた振動電極および接続端子を接続する接続部が形成さ
れた基板部とからなる圧電振動部品実装基板。(2) A substrate on which a piezoelectric vibrating component is mounted, in which vibrating electrodes are formed on both main surfaces of the piezoelectric ceramic substrate, and the vibrating electrode formed on the first main surface is connected to a second vibrating electrode through the side surface of the substrate. a piezoelectric vibrating component that extends around a part of the main surface of the piezoelectric vibrating component to serve as a connecting terminal, and a substrate portion having a connecting portion for connecting the vibrating electrode and the connecting terminal formed on the second major surface of the piezoelectric vibrating component. A piezoelectric vibrating component mounting board consisting of
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25135086A JPS63104510A (en) | 1986-10-21 | 1986-10-21 | Piezoelectric oscillation parts and substrate loading said parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25135086A JPS63104510A (en) | 1986-10-21 | 1986-10-21 | Piezoelectric oscillation parts and substrate loading said parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63104510A true JPS63104510A (en) | 1988-05-10 |
Family
ID=17221518
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25135086A Pending JPS63104510A (en) | 1986-10-21 | 1986-10-21 | Piezoelectric oscillation parts and substrate loading said parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63104510A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49131593A (en) * | 1973-04-20 | 1974-12-17 | ||
| JPS53126843A (en) * | 1977-04-12 | 1978-11-06 | Matsushita Electric Ind Co Ltd | Ladder-type ceramic filter |
| JPS5518127A (en) * | 1978-07-24 | 1980-02-08 | Matsushita Electric Ind Co Ltd | Piezoelectric ceramic filter |
| JPS59172824A (en) * | 1983-03-19 | 1984-09-29 | Murata Mfg Co Ltd | Ladder type piezoelectric filter |
| JPS59172823A (en) * | 1983-03-19 | 1984-09-29 | Murata Mfg Co Ltd | Ladder type piezoelectric filter |
-
1986
- 1986-10-21 JP JP25135086A patent/JPS63104510A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49131593A (en) * | 1973-04-20 | 1974-12-17 | ||
| JPS53126843A (en) * | 1977-04-12 | 1978-11-06 | Matsushita Electric Ind Co Ltd | Ladder-type ceramic filter |
| JPS5518127A (en) * | 1978-07-24 | 1980-02-08 | Matsushita Electric Ind Co Ltd | Piezoelectric ceramic filter |
| JPS59172824A (en) * | 1983-03-19 | 1984-09-29 | Murata Mfg Co Ltd | Ladder type piezoelectric filter |
| JPS59172823A (en) * | 1983-03-19 | 1984-09-29 | Murata Mfg Co Ltd | Ladder type piezoelectric filter |
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