JPS6298692A - プリント基板の加熱錫メツキ装置とプリント基板の導線パタ−ンと差込み穴に電子部品の端末をハンダ付けする方法 - Google Patents

プリント基板の加熱錫メツキ装置とプリント基板の導線パタ−ンと差込み穴に電子部品の端末をハンダ付けする方法

Info

Publication number
JPS6298692A
JPS6298692A JP61240224A JP24022486A JPS6298692A JP S6298692 A JPS6298692 A JP S6298692A JP 61240224 A JP61240224 A JP 61240224A JP 24022486 A JP24022486 A JP 24022486A JP S6298692 A JPS6298692 A JP S6298692A
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
tin
tin plating
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP61240224A
Other languages
English (en)
Japanese (ja)
Inventor
カスパール・アイデンベルク
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of JPS6298692A publication Critical patent/JPS6298692A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Coating With Molten Metal (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP61240224A 1985-10-11 1986-10-11 プリント基板の加熱錫メツキ装置とプリント基板の導線パタ−ンと差込み穴に電子部品の端末をハンダ付けする方法 Pending JPS6298692A (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE3536304.5 1985-10-11
DE19853536304 DE3536304A1 (de) 1985-10-11 1985-10-11 Verfahren zum verzinnen von leiterplatten und vorrichtung zum durchfuehren dieses verfahrens
DE3539585.0 1985-11-08
DE3545933.6 1985-12-23

Publications (1)

Publication Number Publication Date
JPS6298692A true JPS6298692A (ja) 1987-05-08

Family

ID=6283357

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61240224A Pending JPS6298692A (ja) 1985-10-11 1986-10-11 プリント基板の加熱錫メツキ装置とプリント基板の導線パタ−ンと差込み穴に電子部品の端末をハンダ付けする方法

Country Status (2)

Country Link
JP (1) JPS6298692A (enExample)
DE (1) DE3536304A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108580042A (zh) * 2018-07-09 2018-09-28 湖北金科环保科技股份有限公司 一种废旧电路板的铜锡分离装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19511656C2 (de) * 1995-03-30 1997-11-27 Wieland Werke Ag Partiell feuerverzinntes Band

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6096362A (ja) * 1983-09-09 1985-05-29 ピラーハウス・インターナショナル・リミテッド はんだ装置
JPS60187092A (ja) * 1984-03-07 1985-09-24 近藤　権士 噴流式はんだ槽
JPS6137364A (ja) * 1984-07-30 1986-02-22 Toshiba Seiki Kk ろう付け装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2821959A (en) * 1956-03-29 1958-02-04 Bell Telephone Labor Inc Mass soldering of electrical assemblies
DE2856460C3 (de) * 1978-12-28 1982-02-11 Gebr. Schmid GmbH & Co, 7290 Freudenstadt Vorrichtung zum Aufbringen einer Lotschicht auf eine Leiterplatte
US4277518A (en) * 1979-11-13 1981-07-07 Gyrex Corp. Solder-coating method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6096362A (ja) * 1983-09-09 1985-05-29 ピラーハウス・インターナショナル・リミテッド はんだ装置
JPS60187092A (ja) * 1984-03-07 1985-09-24 近藤　権士 噴流式はんだ槽
JPS6137364A (ja) * 1984-07-30 1986-02-22 Toshiba Seiki Kk ろう付け装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108580042A (zh) * 2018-07-09 2018-09-28 湖北金科环保科技股份有限公司 一种废旧电路板的铜锡分离装置
CN108580042B (zh) * 2018-07-09 2024-04-19 湖北金科环保科技股份有限公司 一种废旧电路板的铜锡分离装置

Also Published As

Publication number Publication date
DE3536304C2 (enExample) 1991-09-12
DE3536304A1 (de) 1987-04-16

Similar Documents

Publication Publication Date Title
US4709846A (en) Apparatus for the continuous hot tinning of printed circuit boards
US9370838B2 (en) Wave soldering nozzle system and method of wave soldering
CA2016716C (en) Shield gas wave soldering
US4401253A (en) Mass soldering system
US2821959A (en) Mass soldering of electrical assemblies
US4410126A (en) Mass soldering system
US4402448A (en) Mass soldering system
US4566624A (en) Mass wave soldering system
US3825164A (en) Apparatus for soldering printed circuit cards
US7918383B2 (en) Methods for placing substrates in contact with molten solder
JPH1093230A (ja) 基板にはんだを供給し、はんだボールを形成する方法及び装置
EP0148650B1 (en) Apparatus for solder removal
GB1602779A (en) Methods and apparatus for mass soldering of printed circuit boards
JPS6298692A (ja) プリント基板の加熱錫メツキ装置とプリント基板の導線パタ−ンと差込み穴に電子部品の端末をハンダ付けする方法
US3893409A (en) Apparatus for solder coating printed circuit boards
US4697730A (en) Continuous solder system
JPS60257971A (ja) 半田付け装置および方法
US4685605A (en) Continuous solder system
JP5165270B2 (ja) はんだ付け装置用整流ノズル、はんだ付け装置
JPH11117053A (ja) オイルブランケットを備えた水平はんだ付け装置
CA1241236A (en) Continuous solder system
US4884738A (en) Method and apparatus for brazing surface components onto a printed circuit board
JP2018111122A (ja) 半田付け装置及び半田付け方法
USRE32982E (en) Mass soldering system
JPH0327301B2 (enExample)