JPS6294560A - Tape-shaped part aggregate - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is mainly used in an electronic component mounting machine that mounts electronic components such as chip resistors and chip multilayer capacitors onto substrates constituting electronic circuits. The present invention relates to a tape-shaped parts assembly.

Conventional technology Regarding electronic component mounting machines, conventional Japanese Patent Application Laid-Open No. 55-1) 86
A component supply device using a tape-shaped component assembly as shown in Japanese Patent No. 98 has been employed.

As shown in FIG. 6, the tape-shaped component assembly P in this device has a large number of component storage sections formed in a row at a predetermined pitch on a tape body a, into which electronic components C are inserted. The electronic component C is held by a sealing tape d attached to the surface of the tape body a.

In the electronic component mounting machine, the tape-shaped component assembly P is intermittently fed in one direction. g is a tape-shaped parts assembly P
h is a tape peeling device that peels off the seal tape d and winds it up.

The electronic component C loaded into the component storage recess is sucked by a vacuum chuck (pink-up means) i, taken out from the tape-shaped component assembly P, and then transferred to the vacuum chuck l.
is mounted at a predetermined position on the board jh.

Problems to be Solved by the Invention As mentioned above, the conventional component supply device is configured to peel off the seal tape d stuck to the surface of the tape body a before the pickup position. There was a problem in that the winding of the seal tape d could become unstable, and the reliability of the pick 72161 of the electronic component C deteriorated. Furthermore, when replacing the tape-like parts assembly P, it is necessary to set the sealing tape d on a tape peeling device, which increases the number of work steps.

Means for Solving the Problems In order to solve the above problems, the present invention stores components in each of a large number of component storage recesses formed in the tape body, and also stores the components in the component storage recesses on the upper surface of the tape body. The tape-shaped parts assembly is provided with a sealing tape for holding the parts inside, and is characterized in that the sealing tape is formed of a film that shrinks in response to heat, light, or a specific solution.

Function: If parts are supplied using the tape-shaped parts assembly of the present invention, it is possible to shrink and open the upper parts of the parts storage recesses of the sealing tape at appropriate positions using heat, light, or a specific solution. Since the parts can be picked up through this opening, the process of peeling off the sealing tape using a tape peeling device and winding it up, which was necessary in the conventional example, becomes unnecessary.

Embodiment FIGS. 1 to 3 show an embodiment of the present invention.

A tape-shaped component assembly 1 used in this embodiment stores electronic components (hereinafter referred to as components) 4 in each of a large number of component storage recesses 3 formed in a line at a predetermined pitch in a tape body 2. A sealing tape 5 for holding the component 4 in the component storage recess 3 is pasted on the upper surface of the tape body 2. The tape body 2 is composed of a thick basic tape 2a having a through hole that forms the component storage recess 3, and a holding tape 2b that is adhered to the back surface of the basic tape 2a and forms the bottom surface of the component storage recess 3. It is also possible to use one in which the basic tape 2a and the holding tape 2b are integrally formed.

Further, as shown in FIG. 2, the sealing tape 5 of the tape-shaped parts assembly 1, in which feed holes 6 are formed at a predetermined pitch on the side edge of the tape body 2, is formed of a heat-sensitive shrink film, In addition, it is oriented so that the direction of contraction is in the longitudinal direction X.

Specifically, a polyester film having a glass transition temperature in the range of 50°C to 150°C and oriented in the longitudinal direction .) can be used for one pot.

In the electronic component mounting machine, the tape-shaped component assembly 1 is moved one pitch at a time in the direction of the arrow in FIG. 1 by a feeding device 7. Then, in the first step A, the sealing tape 5 is cut out at a proper position above the component storage recess by the cutting means 8, and a cutout (cutout) 10 as shown in FIGS. 2 and 3 is formed. Next, in the second culm B, the incision is enlarged around the notch 10 by infrared irradiation by the incision enlarging means 9 consisting of an infrared irradiation device (due to heat-sensitive contraction of the sealing tape 5), and the parts 4 are stored. The concave portion 3 is now in a state where it can be repinned. Thereafter, in a third step C, the component 4 is picked up by the component pickup means 1) and mounted at a predetermined position on the printed circuit board 12. In addition, in FIG. 1, 20 is an infrared shielding plate. The shape of the incision 10 and the direction of contraction of the seal tape 5 are not limited to those shown in the above embodiments, and may be modified in various ways.

Another embodiment of the invention is shown in FIGS. 4 and 5.

In this embodiment, the incision means 8 in the above embodiment is omitted, and instead, a tape-shaped component assembly 1a is used in which an incision 10a is previously formed in a suitable position above the component storage recess of the heat-sensitive shrinkable sealing tape 5. It is characterized by the fact that it was used.

In this embodiment, as shown in FIG. 5, an H-shaped incision 10a made of perforation lines is formed in the seal tape 5 in advance, and by irradiating it with infrared rays from the incision large number means 9. , the infrared irradiated portion of the seal tape 5 can be contracted to open the incision 10a.

In addition to the above-mentioned embodiments, the present invention can be applied in various ways! It can be configured in three ways. For example, the seal tape 5 can be made of a photosensitive shrink film that shrinks in response to light. As this photosensitive shrink film, it is preferable to use a film of polyethyl acrylate having a spiropyran structure in the cross-linked portion.
It is preferable to irradiate ultraviolet rays or the like to a specific location of the seal tape 5 to form an opening through which the component 4 can be picked up. It is also possible to configure the seal tape 5 with a film that shrinks in response to a specific solution. As this shrink film, it is preferable to use a collagen film. In this case, a small amount of the oxalizing solution is dropped onto a specific part of the sealing tape using a specific solution dropping device to create an opening that allows the component 4 to be picked up. It is good to form.

Effects of the Invention By supplying parts using the tape-shaped parts assembly of the present invention, it is possible to eliminate the need for winding the seal tape using a tape peeling device, which was previously necessary, and to reduce reliability due to poor winding. In addition to being able to solve the problem of deterioration, there is no need to set the sealing tape in the tape peeling device when replacing the tape-shaped parts assembly, which has the effect of reducing work man-hours and increasing work efficiency. .

[Brief explanation of drawings]

Fig. 1 is a longitudinal cross-sectional side view showing an embodiment of the present invention set in a parts supply device, Fig. 2 is a perspective view of its main parts, and Fig. 3 is a plan view of an embodiment of the present invention. FIG. 4 is a longitudinal sectional side view showing another embodiment of the present invention in a state where it is inserted into a parts supply device, FIG. 5 is a perspective view of its main parts, and FIG. 6 is a longitudinal sectional side view showing a conventional example. 1, la------------ Tape-shaped parts assembly 2----- Tape body 3---- −−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−)
・----1・1 part 5, 5a----1---Seal tape 10, 10a----
−−−１−−−−−−１−−１−−−−All open agent Patent attorney Toshio Nakao 1 person Figure 2 Figure 3 Figure 10 ・ ・ written monthly

Claims (2)

[Claims] (1) A tape shape in which components are stored in each of a number of component storage recesses formed in the tape body, and a sealing tape is provided on the top surface of the tape body to hold the components in the component storage recesses. 1. A tape-shaped parts assembly, characterized in that the sealing tape is made of a film that shrinks in response to heat, light, or a specific solution. (2) The tape-shaped component assembly according to claim 1, wherein the seal tape has an incision formed in advance at an upper portion of each component storage recess.