JPS6292679U - - Google Patents
Info
- Publication number
- JPS6292679U JPS6292679U JP18532385U JP18532385U JPS6292679U JP S6292679 U JPS6292679 U JP S6292679U JP 18532385 U JP18532385 U JP 18532385U JP 18532385 U JP18532385 U JP 18532385U JP S6292679 U JPS6292679 U JP S6292679U
- Authority
- JP
- Japan
- Prior art keywords
- terminal electrodes
- solder resists
- width
- insulating substrate
- wider
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 2
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18532385U JPS6292679U (zh) | 1985-11-29 | 1985-11-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18532385U JPS6292679U (zh) | 1985-11-29 | 1985-11-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6292679U true JPS6292679U (zh) | 1987-06-13 |
Family
ID=31133841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18532385U Pending JPS6292679U (zh) | 1985-11-29 | 1985-11-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6292679U (zh) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0593069U (ja) * | 1992-02-17 | 1993-12-17 | 台灣杜邦股▲ふん▼有限公司 | プリント回路基板 |
| JP2006059996A (ja) * | 2004-08-19 | 2006-03-02 | Toshiba Corp | プリント配線板設計方法、プリント配線板、プリント回路板、プリント配線板の設計ツールおよび電子機器 |
| JP2013041647A (ja) * | 2011-08-17 | 2013-02-28 | Dainippon Printing Co Ltd | サスペンション用基板 |
-
1985
- 1985-11-29 JP JP18532385U patent/JPS6292679U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0593069U (ja) * | 1992-02-17 | 1993-12-17 | 台灣杜邦股▲ふん▼有限公司 | プリント回路基板 |
| JP2006059996A (ja) * | 2004-08-19 | 2006-03-02 | Toshiba Corp | プリント配線板設計方法、プリント配線板、プリント回路板、プリント配線板の設計ツールおよび電子機器 |
| JP4709512B2 (ja) * | 2004-08-19 | 2011-06-22 | 株式会社東芝 | 電子機器 |
| JP2013041647A (ja) * | 2011-08-17 | 2013-02-28 | Dainippon Printing Co Ltd | サスペンション用基板 |