JPS6290951A - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS6290951A JPS6290951A JP60231702A JP23170285A JPS6290951A JP S6290951 A JPS6290951 A JP S6290951A JP 60231702 A JP60231702 A JP 60231702A JP 23170285 A JP23170285 A JP 23170285A JP S6290951 A JPS6290951 A JP S6290951A
- Authority
- JP
- Japan
- Prior art keywords
- electrode plate
- hollow insulator
- semiconductor element
- insulator
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 33
- 239000012212 insulator Substances 0.000 claims abstract description 27
- 229920005989 resin Polymers 0.000 claims abstract description 12
- 239000011347 resin Substances 0.000 claims abstract description 12
- 238000007789 sealing Methods 0.000 claims abstract 2
- 239000000758 substrate Substances 0.000 claims 1
- 239000000919 ceramic Substances 0.000 abstract description 5
- 238000003466 welding Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 229910052573 porcelain Inorganic materials 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60231702A JPS6290951A (ja) | 1985-10-16 | 1985-10-16 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60231702A JPS6290951A (ja) | 1985-10-16 | 1985-10-16 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6290951A true JPS6290951A (ja) | 1987-04-25 |
| JPH0342701B2 JPH0342701B2 (enrdf_load_stackoverflow) | 1991-06-28 |
Family
ID=16927660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60231702A Granted JPS6290951A (ja) | 1985-10-16 | 1985-10-16 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6290951A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1906443A2 (en) | 2006-09-26 | 2008-04-02 | Mitsubishi Electric Corporation | Pressure-contact semiconductor device |
-
1985
- 1985-10-16 JP JP60231702A patent/JPS6290951A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1906443A2 (en) | 2006-09-26 | 2008-04-02 | Mitsubishi Electric Corporation | Pressure-contact semiconductor device |
| EP1906443A3 (en) * | 2006-09-26 | 2008-12-03 | Mitsubishi Electric Corporation | Pressure-contact semiconductor device |
| US8456001B2 (en) | 2006-09-26 | 2013-06-04 | Mitsubishi Electric Corporation | Pressure-contact semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0342701B2 (enrdf_load_stackoverflow) | 1991-06-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE69433428T2 (de) | Durch ein gehäuse umschlossener verschliessbarer halbleiterscheibenhalter | |
| JPS59198740A (ja) | 樹脂封止形半導体複合素子 | |
| WO2015124093A1 (zh) | 高气密性装置 | |
| US5436407A (en) | Metal semiconductor package with an external plastic seal | |
| US3328650A (en) | Compression bonded semiconductor device | |
| US3992717A (en) | Housing for a compression bonded encapsulation of a semiconductor device | |
| US3335336A (en) | Glass sealed ceramic housings for semiconductor devices | |
| JPS6290951A (ja) | 半導体装置 | |
| GB1398361A (en) | Integrally housed electric semiconductor bridge assembly | |
| US3065390A (en) | Electrical devices having hermetically saled envelopes | |
| US4349831A (en) | Semiconductor device having glass and metal package | |
| JPS5683048A (en) | Semiconductor device | |
| US4068368A (en) | Closure for semiconductor device and method of construction | |
| JP2002353524A (ja) | ペルチェユニット及びその製造方法 | |
| US3188536A (en) | Silicon rectifier encapsulation | |
| JPS5863826A (ja) | 半導体圧力変換器 | |
| JPS57157550A (en) | Semiconductor device | |
| JPS62155564A (ja) | 電力用半導体装置 | |
| JPH0328509Y2 (enrdf_load_stackoverflow) | ||
| JPS62128547A (ja) | 半導体装置 | |
| KR100483042B1 (ko) | 표면 탄성파 필터의 세라믹 패키지 시일링방법 및 장치 | |
| JPS62128537A (ja) | 平形半導体装置 | |
| JPH0245963A (ja) | 半導体装置 | |
| JPH0365019B2 (enrdf_load_stackoverflow) | ||
| US3299327A (en) | Housing for a three terminal semiconductor device having two insulation tube sections |