JPS628998Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a wrapping device used for machining with high surface accuracy in terms of surface roughness and flatness.

2. Description of the Related Art Conventionally, a wrapping device is known as a device for polishing a magnetic head assembly or a semiconductor thin plate to a predetermined size and giving it a mirror finish. Figures 1 and 2 show an example of a conventional wrapping device using a single-sided wrapping method.
The thin plate 1 is attached to a support 2 having good flatness with an adhesive 3, and the thin plate 1 is placed on the lapping plate 4 so as to be in contact with the lapping plate 4. The wrapping device is device frame 5C.
A stopper 5b is provided for this purpose. In this way, when the lap board 4 is rotated, the guard link 5
A and the support body 2 provided therein do not move in the direction of rotation of the chip plate by a stopper 5b, and thus rotate, and the surface of the thin plate 1 is polished by a predetermined thickness with a lapping agent.

A weight (not shown) is provided to apply weight to the support 2 during polishing in the one-sided wrapping device, so as to improve the mold polishing effect.
This weight is provided for each support 2 placed on the lap board, and
It consists of a weighted plate of a size corresponding to

However, the arrangement of the load plates of a size corresponding to the support 2 is done manually, and misalignment is likely to occur when placing them on each support. This may lead to uneven polishing. In addition, since double-sided wrapping equipment polishes from both sides, highly parallel processing is possible. However, if the workpiece is thin and small, it is difficult to put it in and out of the support, and the support itself is thin (thickness (up to about 0.1 mm), warping is likely to occur, and since the workpiece is a thin plate, it is likely to be damaged by the support during polishing. As explained above, with conventional wrapping equipment, polishing may lack uniformity, the support itself cannot be thickened, so the support may warp, it may be difficult to insert the workpiece into the carrier, or there may be problems during polishing. The drawback was that it was easily damaged.

The object of the present invention is to provide a wrapping device which eliminates the above-mentioned drawbacks.

Therefore, in the present invention, the workpiece is fixed on a support, the support is provided on the lapping plate so that the workpiece comes into contact with the lapping plate, and a lapping agent is provided between the support and the lapping plate. In a lapping device that polishes the workpiece by supplying the support and rotating the support, a weighting plate is provided that applies a common weight to a plurality of supports provided on the lapping plate, and The contact surface on the support side is made of a material with low frictional resistance, and the lapping agent is supplied only to the lapping plate.

The present invention will be described below based on one embodiment with reference to the drawings. FIG. 3 is a cross-sectional view of one embodiment of the present invention, and FIG.
The figure shows a cross-sectional view of one embodiment of the present invention, Fig. 5 is an explanatory view of the circular surface plate, and Fig. 6 is a cross-sectional view of the carrier. As shown in Fig. 5, the workpiece 1 is attached to the circular surface plate 6. As shown in Fig. 6, the circular surface plate 6 is attached to the carrier 9.
The circular plate 6 on the carrier 9 is inserted into the hollow hole A and placed on the lower wrapping plate 11 shown in FIG.
A ring-shaped enclosure 13 is provided around the outer periphery of the circular surface plate 6
The upper wrapping plate 10 is placed on the shaping plate 6 to cover the outer periphery of the
The upper wrapping plate 10 is used as the load plate since this embodiment is intended for a general double-sided wrapping device. The circular surface of the upper wrapping plate 10 is made of Teflon material with low friction resistance to prevent heat generation due to friction on the circular surface. In other words, the above-mentioned wrapping plate has the sole purpose of applying a load to the circular surface, and the circular surface is made of Teflon material as described above to prevent heat generation when the circular surface is rotated. The carrier 9 is provided with a gear around its periphery, and meshes with the outer peripheral gear 7 and the inner peripheral gear 8, and the inner peripheral gear 8 is attached to the shaft 16. The shaft 16 and the outer peripheral gear 7 are rotated by a drive means not shown. The lapping agent is supplied from the lapping agent distributor 17 to the lower wrapping plate 1 through the lapping agent injection pipe 14 from several points on the outer periphery.
The structure is such that injection is only into 1.

FIG. 4 is a top view of the plane -' of FIG. 3, in which the carrier 9, the outer gear 7, and the inner gear 8 are meshed with each other. Therefore, when the outer gear 7 and the inner gear 8 rotate in the direction of the arrow, the carrier 9 rotates and revolves in the direction of the arrow. Incidentally, a circular surface plate 6 shown in FIG. 5 is inserted into the hollow hole of the carrier 9 with the surface to which the workpiece is bonded downward, and is placed on the lower lap plate 11. The upper lap plate has four carriers 9 and a surface plate 6.
A common weight can be applied to cover the Fifth
The figure shows a workpiece placed on a circular surface plate, and a thin plate 1 is bonded to the circular surface plate 6 in a circularly symmetrical manner in a well-balanced manner.

Figure 6 shows a carrier with tooth profiles on its outer periphery;
A circular cut-out hole A is provided at an eccentric position of the carrier 9 in which a circular surface plate 6 can be housed with a narrow gap, and a narrow groove 15 communicating with the outside is provided. This groove 15 prevents the lapping agent from accumulating in the hollow hole A of the carrier 9 more than a certain amount. Also, carrier 9
The grooves 15 of the lapping agent prevent the extremely large particles of the lapping agent from staying there, thereby preventing scratches from occurring on the surface of the workpiece.

This is because even if the extremely large particles flow into the grooves 15, due to rotation during polishing, the lapping agent flows toward the outer periphery on the opposite side to the moving direction of the carrier 9, and the extremely large particles are trapped in the grooves 15 of the carrier 9. This is because it is extremely rare for the particles to stay in the hole A.

Now, due to the rotation of the outer gear 7 and the inner gear 8,
The carrier 9 revolves and rotates, the circular surface plate 6 inside the carrier 9 is slid, and the surface of the thin plate 1 comes into contact with the lower lapping plate 11 and is polished by a lapping agent.
By using a structure in which the thin plate is bonded to a surface plate and polished, there is no need to reduce the thickness of the carrier to 0.1 mm as in conventional methods, and it can be made thicker, which eliminates the tendency for the carrier to warp and the thin plate to be damaged by the carrier during polishing. You can prevent it from happening.

Further, the circular surface plates used are, for example, a set of four, and the difference in parallelism thickness between each surface plate is adjusted to within 1 μm. Since the same number of workpieces are bonded to each surface plate in a circularly symmetrical manner in a well-balanced manner, by wrapping the four surfaces at the same time, the four surfaces can be finished with uniform dimensional accuracy.

In addition, the upper lap plate surface has four carriers and a surface plate that are weighted evenly to reduce frictional resistance.
In addition, the wrapping agent is supplied only to the lower wrapping board.
Since we prevent it from adhering to the surface of the upper lapping plate and the 4th surface plate, there is almost no change in the 4th surface plate due to the lapping agent, and only the workpiece to which the surface plate is adhered will be affected by the lapping agent, so the wear due to the lapping agent will be immediate. This results in wear of the workpiece. Therefore, by inserting the four surface plates to which the workpieces are bonded between the upper and lower lapping disks and lapping, only the workpieces bonded to the surface plates are polished and a uniform surface is obtained. Note that the rotation during polishing is gentle, and almost no centrifugal force is applied, so even if the lapping agent is supplied from the outside, the lapping agent will flow in from the gap between the carrier and the lapping plate without any problem. can be done.

Automatic measurement is now possible by providing a wrapping device with a detector as shown in FIG. 7A. In FIG. 7A, if the electric micrometer needle 18 is set to a predetermined level of polishing using the micrometer needle up and down movement screw 20 (minor portions are performed as shown in FIG. 7B) and wrapping is performed, as the workpiece thin plate 1 is polished, The upper lapping plate 10 is lowered and comes into contact with the anvil receiver 19 and the electric micrometer 18 attached to the upper lapping plate 10, and the amount of polishing is detected and the driving of the device is stopped, thus making automatic measurement possible. Incidentally, FIG. 7B is an enlarged view of section D in FIG. 7A, showing the polishing amount set knob 21, the pointer position 22 at the time of zero setting or the end of polishing, and the zero set knob 23. Furthermore, the ring-shaped enclosure 13 on the eccentric carrier 9 is intended to prevent the injected lapping agent from directly entering the eccentric carrier 9. Scratches occur on the surface of the workpiece because a large number of extremely large particles are mixed in. Therefore, the lapping agent injected onto the carrier 9 is once dropped onto the lower lapping plate 11, and then
The gap between the particle and the eccentric carrier 9 prevents the entry of extremely large particles, resulting in a certain degree of sorting.
Scratches can be prevented from occurring.

Although the present invention has been described above based on embodiments, it is not limited to these embodiments, and further modified methods are possible based on the present invention. For example, the lapping agent may be injected into the lower lapping board from the inside instead of the outer circumferential side. Also,
The upper lap plate surface may be made of cloth instead of Teflon material, which causes less wear. Further, although the present embodiment has been described using four surface plates, the number of surface plates is not limited, and a plurality of surfaces may be used.

As explained above in the embodiments, according to the present invention, by bonding a thin plate to a surface plate and polishing it, there is no need to reduce the thickness of the carrier, and the carrier is not warped and the thin plate is damaged by the carrier during polishing. It can also be prevented. Furthermore, it is possible to improve the operability of loading and unloading thin plates into and out of the carrier. Furthermore, by installing a ring-shaped enclosure in the surface plate storage area, the polishing surface can be improved. In addition, by reducing the frictional resistance on the surface of the upper lapping plate and supplying the lapping agent only to the lower lapping plate, there is almost no effect on the surface plate, and the amount of wear due to the lapping agent is reduced to the wear of the workpiece. This detector enables automatic measurement and automates wrapping.

[Brief explanation of the drawing]

Fig. 1 is an explanatory diagram of a thin plate bonded to a general carrier, Fig. 2 is a configuration diagram of an embodiment of a conventional single-sided wrapping device, and Fig. 3 is a sectional view of an embodiment of the present invention.
Figure 4 is a plan view of the −' plane of Figure 3 viewed from above, Figure 5 is a diagram of the workpiece placed on a circular surface plate,
FIG. 6 is an explanatory diagram of a carrier groove, and FIG. 7 is an explanatory diagram of an example of a detector of an automatic wrapping device. 1... thin plate, 6... circular surface plate (glass), 7...
...Outer gear, 8...Inner gear, 9...Eccentric carrier, 10...Upper lap plate (Teflon plate), 1
1...Lower lap board, 13...Ring-shaped enclosure, 1
4...Lapping agent injection pipe, 15...Groove, 16...
Shaft, 17... Lupping agent distributor, 18... Electric micrometer needle, 19... Anvil holder, 20... Micrometer needle moving screw, 21... Polishing amount set knob, 22... Zero setting pointer position, 23 ……
Zero set knob.

Claims (1)

[Scope of utility model registration request] The workpiece is fixed on a support, the support is provided on a lapping plate so that the workpiece comes into contact with the lapping plate, and a lapping agent is supplied between the support and the lapping plate, and the support is In a lapping device that polishes a workpiece by rotating its body, a weighting plate is provided that applies a common weight to a plurality of supports provided on the lapping plate, and the contact surface of the weighting plate on the support side is 1. A wrapping device, characterized in that it is made of a material with low frictional resistance, and is configured so that the wrapping agent is supplied only to the wrapping disk.