JPS6284961U - - Google Patents
Info
- Publication number
- JPS6284961U JPS6284961U JP17720085U JP17720085U JPS6284961U JP S6284961 U JPS6284961 U JP S6284961U JP 17720085 U JP17720085 U JP 17720085U JP 17720085 U JP17720085 U JP 17720085U JP S6284961 U JPS6284961 U JP S6284961U
- Authority
- JP
- Japan
- Prior art keywords
- film
- pattern
- circuit board
- connecting terminal
- tail portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 description 1
Description
第１図はこの考案の実施例のフイルム回路基板
の平面図、第２図は同じく斜視図、第３図は従来
例のフイルム回路基板の平面図、第４図は同じく
斜視図、第５図は他の従来のフイルム基板の平面
図である。
１……フイルム回路基板、２……絶縁フイルム
シート、３……テール部、４……端縁部、５……
回路パターン、６……接続用端子パターン、７…
…露出部、８……絶縁レジスト膜。
FIG. 1 is a plan view of a film circuit board according to an embodiment of the invention, FIG. 2 is a perspective view, FIG. 3 is a plan view of a conventional film circuit board, FIG. 4 is a perspective view, and FIG. is a plan view of another conventional film substrate. DESCRIPTION OF SYMBOLS 1...Film circuit board, 2...Insulating film sheet, 3...Tail part, 4...Edge part, 5...
Circuit pattern, 6... Connection terminal pattern, 7...
...Exposed portion, 8...Insulating resist film.
Claims (1)
トと、 前記フイルムシートの少なくとも一面に形成さ
れた所定の回路パターンと、 前記回路パターンに連続して前記テール部まで
導出された接続用端子パターンと、 前記回路パターン及び接続用端子パターン上に
塗布された絶縁レジスト膜と、 を有するフイルム回路基板において、 前記絶縁レジスト膜は、前記接続用端子パター
ンの一部を露出して塗布されるとともに、その露
出部は前記テール部の端縁部から離間した内方位
置に形成されたことを特徴とするフイルム回路基
板。[Claims for Utility Model Registration] An insulating film sheet having a tail portion integrally formed therein, a predetermined circuit pattern formed on at least one surface of the film sheet, and a circuit pattern extending continuously from the circuit pattern to the tail portion. A film circuit board comprising: a connecting terminal pattern; and an insulating resist film coated on the circuit pattern and the connecting terminal pattern, wherein the insulating resist film exposes a part of the connecting terminal pattern. 1. A film circuit board, wherein the film circuit board is coated with a film, and the exposed portion thereof is formed at an inward position spaced apart from an edge portion of the tail portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17720085U JPS6284961U (en) | 1985-11-18 | 1985-11-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17720085U JPS6284961U (en) | 1985-11-18 | 1985-11-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6284961U true JPS6284961U (en) | 1987-05-30 |
Family
ID=31118177
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17720085U Pending JPS6284961U (en) | 1985-11-18 | 1985-11-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6284961U (en) |
-
1985
- 1985-11-18 JP JP17720085U patent/JPS6284961U/ja active Pending
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