JPS6284942U - - Google Patents
Info
- Publication number
- JPS6284942U JPS6284942U JP1985177590U JP17759085U JPS6284942U JP S6284942 U JPS6284942 U JP S6284942U JP 1985177590 U JP1985177590 U JP 1985177590U JP 17759085 U JP17759085 U JP 17759085U JP S6284942 U JPS6284942 U JP S6284942U
- Authority
- JP
- Japan
- Prior art keywords
- led
- enamel
- substrate
- led lamp
- lamp according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 210000003298 dental enamel Anatomy 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 2
- 238000004382 potting Methods 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 229910052742 iron Inorganic materials 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985177590U JPS6284942U (sr) | 1985-11-19 | 1985-11-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985177590U JPS6284942U (sr) | 1985-11-19 | 1985-11-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6284942U true JPS6284942U (sr) | 1987-05-30 |
Family
ID=31118931
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985177590U Pending JPS6284942U (sr) | 1985-11-19 | 1985-11-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6284942U (sr) |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03230586A (ja) * | 1990-02-05 | 1991-10-14 | Mitsubishi Cable Ind Ltd | Ｌｅｄモジュール |
| JP2001332769A (ja) * | 2000-05-22 | 2001-11-30 | Mitsubishi Cable Ind Ltd | 発光ダイオード照明具 |
| JP2006269758A (ja) * | 2005-03-24 | 2006-10-05 | Fujikura Ltd | 発光素子実装用ホーロー基板、発光素子モジュール、表示装置、照明装置及び交通信号機 |
| WO2006132147A1 (ja) | 2005-06-07 | 2006-12-14 | Fujikura Ltd. | 発光素子実装用ホーロー基板とその製造方法、発光素子モジュール、照明装置、表示装置及び交通信号機 |
| WO2006132222A1 (ja) * | 2005-06-07 | 2006-12-14 | Fujikura Ltd. | 発光素子実装用基板、発光素子モジュール、照明装置、表示装置及び交通信号機 |
| WO2006132150A1 (ja) * | 2005-06-07 | 2006-12-14 | Fujikura Ltd. | 発光素子実装用基板および発光素子モジュール |
| WO2006134839A1 (ja) * | 2005-06-13 | 2006-12-21 | Fujikura Ltd. | 発光素子実装用基板、発光モジュール及び照明装置 |
| JP2007013026A (ja) * | 2005-07-04 | 2007-01-18 | Fujikura Ltd | 発光素子モジュール、殺菌ランプ装置、紫外線硬化型樹脂硬化用ランプ装置、照明装置、表示装置及び交通信号機 |
| JP2007013027A (ja) * | 2005-07-04 | 2007-01-18 | Fujikura Ltd | 発光素子実装用ホーロー基板、発光素子モジュール、照明装置、表示装置及び交通信号機 |
| JP2007165735A (ja) * | 2005-12-16 | 2007-06-28 | Drill Center:Kk | Ｌｅｄ実装基板及びその製造方法 |
| WO2007138695A1 (ja) * | 2006-05-31 | 2007-12-06 | Fujikura Ltd. | 発光素子実装用基板とその製造方法、発光素子モジュールとその製造方法、表示装置、照明装置及び交通信号機 |
| WO2007138696A1 (ja) * | 2006-05-31 | 2007-12-06 | Fujikura Ltd. | 発光素子実装用基板、発光素子パッケージ体、表示装置及び照明装置 |
| JP2008091952A (ja) * | 2005-06-07 | 2008-04-17 | Fujikura Ltd | 発光素子実装用ホーロー基板の製造方法および発光素子モジュールの製造方法 |
| JP2009038202A (ja) * | 2007-08-01 | 2009-02-19 | Fujikura Ltd | 発光素子実装用基板、発光素子モジュール、照明装置、表示装置及び交通信号機 |
| JP2010500779A (ja) * | 2006-08-11 | 2010-01-07 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | デバイスチップキャリア、モジュールおよびその製造方法 |
| US7866853B2 (en) | 2004-11-19 | 2011-01-11 | Fujikura Ltd. | Light-emitting element mounting substrate and manufacturing method thereof, light-emitting element module and manufacturing method thereof, display device, lighting device, and traffic light |
| US7980731B2 (en) | 2006-05-30 | 2011-07-19 | Fujikura Ltd. | Light-emitting element mounting substrate, light source, lighting device, display device, traffic signal, and method of manufacturing light-emitting element mounting substrate |
| US10295147B2 (en) | 2006-11-09 | 2019-05-21 | Cree, Inc. | LED array and method for fabricating same |
-
1985
- 1985-11-19 JP JP1985177590U patent/JPS6284942U/ja active Pending
Cited By (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03230586A (ja) * | 1990-02-05 | 1991-10-14 | Mitsubishi Cable Ind Ltd | Ｌｅｄモジュール |
| JP2001332769A (ja) * | 2000-05-22 | 2001-11-30 | Mitsubishi Cable Ind Ltd | 発光ダイオード照明具 |
| US7866853B2 (en) | 2004-11-19 | 2011-01-11 | Fujikura Ltd. | Light-emitting element mounting substrate and manufacturing method thereof, light-emitting element module and manufacturing method thereof, display device, lighting device, and traffic light |
| JP2006269758A (ja) * | 2005-03-24 | 2006-10-05 | Fujikura Ltd | 発光素子実装用ホーロー基板、発光素子モジュール、表示装置、照明装置及び交通信号機 |
| US8382345B2 (en) | 2005-06-07 | 2013-02-26 | Fujikara Ltd. | Porcelain enamel substrate for mounting light emitting device and method of manufacturing the same, light emitting device module, illumination device, display unit and traffic signal |
| WO2006132150A1 (ja) * | 2005-06-07 | 2006-12-14 | Fujikura Ltd. | 発光素子実装用基板および発光素子モジュール |
| WO2006132222A1 (ja) * | 2005-06-07 | 2006-12-14 | Fujikura Ltd. | 発光素子実装用基板、発光素子モジュール、照明装置、表示装置及び交通信号機 |
| US7699500B2 (en) | 2005-06-07 | 2010-04-20 | Fujikura Ltd. | Light-emitting element mounting board, light-emitting element module, lighting device, display device, and traffic signal equipment |
| KR101132421B1 (ko) | 2005-06-07 | 2012-04-03 | 가부시키가이샤후지쿠라 | 발광소자 실장용 기판 및 발광소자 모듈 |
| JP2008091952A (ja) * | 2005-06-07 | 2008-04-17 | Fujikura Ltd | 発光素子実装用ホーロー基板の製造方法および発光素子モジュールの製造方法 |
| JP4629091B2 (ja) * | 2005-06-07 | 2011-02-09 | 株式会社フジクラ | 発光素子実装用ホーロー基板の製造方法および発光素子モジュールの製造方法 |
| WO2006132147A1 (ja) | 2005-06-07 | 2006-12-14 | Fujikura Ltd. | 発光素子実装用ホーロー基板とその製造方法、発光素子モジュール、照明装置、表示装置及び交通信号機 |
| US7537359B2 (en) | 2005-06-07 | 2009-05-26 | Fujikura Ltd. | Substrate for mounting light-emitting element and light-emitting element module |
| US7572039B2 (en) | 2005-06-07 | 2009-08-11 | Fujikura, Ltd. | Porcelain enamel substrate for mounting light emitting device and method of manufacturing the same, light emitting device module, illumination device, display unit and traffic signal |
| WO2006134839A1 (ja) * | 2005-06-13 | 2006-12-21 | Fujikura Ltd. | 発光素子実装用基板、発光モジュール及び照明装置 |
| US7982230B2 (en) | 2005-06-13 | 2011-07-19 | Fujikura Ltd. | Substrate for mounting light emitting element, light emitting module and lighting apparatus |
| KR101017921B1 (ko) * | 2005-06-13 | 2011-03-08 | 가부시키가이샤후지쿠라 | 발광 소자 실장용 기판, 발광 모듈 및 조명 장치 |
| JP2007013026A (ja) * | 2005-07-04 | 2007-01-18 | Fujikura Ltd | 発光素子モジュール、殺菌ランプ装置、紫外線硬化型樹脂硬化用ランプ装置、照明装置、表示装置及び交通信号機 |
| JP4667982B2 (ja) * | 2005-07-04 | 2011-04-13 | 株式会社フジクラ | 発光素子モジュール、殺菌ランプ装置、紫外線硬化型樹脂硬化用ランプ装置、照明装置、表示装置及び交通信号機 |
| JP2007013027A (ja) * | 2005-07-04 | 2007-01-18 | Fujikura Ltd | 発光素子実装用ホーロー基板、発光素子モジュール、照明装置、表示装置及び交通信号機 |
| JP2007165735A (ja) * | 2005-12-16 | 2007-06-28 | Drill Center:Kk | Ｌｅｄ実装基板及びその製造方法 |
| US7980731B2 (en) | 2006-05-30 | 2011-07-19 | Fujikura Ltd. | Light-emitting element mounting substrate, light source, lighting device, display device, traffic signal, and method of manufacturing light-emitting element mounting substrate |
| EP2023407A1 (en) * | 2006-05-31 | 2009-02-11 | Fujikura, Ltd. | Light-emitting device mounting substrate and method for producing same, light-emitting device module and method for manufacturing same, display, illuminating device, and traffic signal system |
| WO2007138696A1 (ja) * | 2006-05-31 | 2007-12-06 | Fujikura Ltd. | 発光素子実装用基板、発光素子パッケージ体、表示装置及び照明装置 |
| US7977696B2 (en) | 2006-05-31 | 2011-07-12 | Fujikura Ltd. | Light-emitting element mounting substrate, light-emitting element package, display device, and illumination device |
| WO2007138695A1 (ja) * | 2006-05-31 | 2007-12-06 | Fujikura Ltd. | 発光素子実装用基板とその製造方法、発光素子モジュールとその製造方法、表示装置、照明装置及び交通信号機 |
| EP2023407A4 (en) * | 2006-05-31 | 2014-01-15 | Fujikura Ltd | ILLUMINATING ELEMENT BRACKET AND METHOD FOR THE PRODUCTION THEREOF, ILLUMINATING ELEMENT MODULE AND MANUFACTURING METHOD THEREFOR, DISPLAY, LIGHTING DEVICE AND TRAFFIC LIGHTING SYSTEM |
| JP2010500779A (ja) * | 2006-08-11 | 2010-01-07 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | デバイスチップキャリア、モジュールおよびその製造方法 |
| US10295147B2 (en) | 2006-11-09 | 2019-05-21 | Cree, Inc. | LED array and method for fabricating same |
| JP2009038202A (ja) * | 2007-08-01 | 2009-02-19 | Fujikura Ltd | 発光素子実装用基板、発光素子モジュール、照明装置、表示装置及び交通信号機 |