JPS6284931U - - Google Patents
Info
- Publication number
- JPS6284931U JPS6284931U JP1985176875U JP17687585U JPS6284931U JP S6284931 U JPS6284931 U JP S6284931U JP 1985176875 U JP1985176875 U JP 1985176875U JP 17687585 U JP17687585 U JP 17687585U JP S6284931 U JPS6284931 U JP S6284931U
- Authority
- JP
- Japan
- Prior art keywords
- flip chip
- outer periphery
- outer end
- solder ball
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/072—
-
- H10W72/877—
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985176875U JPS6284931U (index.php) | 1985-11-19 | 1985-11-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985176875U JPS6284931U (index.php) | 1985-11-19 | 1985-11-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6284931U true JPS6284931U (index.php) | 1987-05-30 |
Family
ID=31117539
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985176875U Pending JPS6284931U (index.php) | 1985-11-19 | 1985-11-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6284931U (index.php) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04152662A (ja) * | 1990-10-17 | 1992-05-26 | Nec Corp | 集積回路パッケージ |
-
1985
- 1985-11-19 JP JP1985176875U patent/JPS6284931U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04152662A (ja) * | 1990-10-17 | 1992-05-26 | Nec Corp | 集積回路パッケージ |