JPS6280299A - Barrel plating device - Google Patents

Abstract

PURPOSE:To thoroughly circulate a plating liquid in a barrel of a plating device by providing spiral feed vanes to apply axial flow in the axial direction of cylindrical boss parts provided to the side wall of the barrel to the inside circumferences of raid boss parts. CONSTITUTION:Small articles to be subjected to a plating treatment are charged into the barrel 4. The barrel 4 begins to rotate when a driving chain 20 is started after an anode metallic plate 37 and cathode leads 15, 16 are energized. The ionized metal is then deposited on the surfaces of the small particles to which minus potential is applied. Since the spiral vanes 35, 36 are provided to the inside circumferences of the cylindrical bosses 29, 30, the plating liquids in the inside and outside of the barrel are forcible circulated according to the rotation of the barrel. The time for the plating treatment is reduced by such constitution and since the plating liquid in the barrel is uniformly stirred, the plating layers of the small articles are made uniform.

Description

[Detailed description of the invention] [Industrial application field]

The present invention relates to a barrel plating device, and more specifically, it has been improved so that the plating solution outside the barrel can be continuously introduced into the barrel by using the rotation of a horizontal barrel, thereby shortening the plating process time. Concerning what has been done.

[Conventional technology]

Barrel plating equipment is a device that is configured to plate a large number of small items at once.It is a barrel that is rotated around a horizontal axis in a plating tank and that holds small items to be plated. Equipped with a shaped perforated barrel. This barrel usually has a pair of left and right bosses with holes provided in the center of both side plates, and these bosses are inserted into the bearing holes of a predetermined bracket to be rotatably supported. The cathode lead is introduced into the barrel through the hole in the bottom. When electricity is passed between the metal anode placed outside the barrel in the plating bath and the cathode introduced into the barrel as described above, the ionized and dissolved metal from the anode contacts the cathode and develops a negative potential. It is deposited on the surface of a given small object, thereby forming a plating layer on the surface of the small object.

[Problems to be solved by the invention]

By the way, in order to form a uniform plating layer on all the small items inside the barrel, it is necessary that the plating solution inside and outside the barrel circulate sufficiently and that the metal ion concentration inside the barrel be kept constant. However, in barrels with conventional structures, although the plating solution is circulated from inside the barrel to outside the barrel due to the centrifugal pumping action caused by the rotation of the barrel, sufficient circulation of the plating solution as described above cannot be achieved. As a result, after energization, not only the ion concentration inside the barrel is extremely lower than the ion concentration outside the barrel, but also inside the barrel.
The basic problem is that the concentration is uneven. As a result, the plating process time becomes longer, and the thickness of the plating layer becomes uneven for each small item, deteriorating the quality of the product. As a temporary solution to this problem, increasing the rotation speed of the barrel or forcibly introducing the plating solution from outside the barrel into the barrel using a separately provided pump is a method.
This is a possible method. However, in the former case, the chance of contact between small objects or the contact opportunity and relative speed of contact between small objects and the inner surface of the barrel increases, and the small objects are damaged by each other or the inner surface of the barrel, resulting in a decrease in the surface quality of the plating layer. It cannot be adopted because another problem arises. Also,
In the latter case, there is an extremely difficult problem in that it is necessary to secure a space for the pump and the pipes, or to take measures to prevent damage to them, and solving this problem requires a huge amount of cost. This invention was devised under the above circumstances.
The objective is to achieve sufficient circulation of the plating solution inside and outside the barrel with a simple configuration.

[Means to solve the problem]

In order to solve the above problems, the barrel type plating apparatus of the present invention takes the following technical measures. When the barrel or boss rotates in a predetermined direction on the inner periphery of the cylindrical boss provided on the side wall of the barrel to rotatably support the barrel relative to the bracket and introduce the cathode lead into the barrel. Provides axial flow in the axial direction of the boss! !
It forms a turning means.

[Action and effect]

When the barrel or boss rotates, the spiral feed means formed on the inner periphery of the boss acts as a so-called axial pump.
A plating solution with a high iodine of 7a near the boss outside the barrel is forcibly fed into the barrel. The plating solution, whose ion concentration has become diluted after completing the metal deposition action on the surface of the small object, flows out of the barrel through the hole in the outer wall of the barrel. This allows sufficient circulation of the plating solution inside and outside the barrel, and maintains the ion concentration of the plating solution inside the barrel at the same high concentration as outside the barrel. As a result, the plating processing time is significantly shortened compared to the conventional method. Further, the spiral feeding means can prevent small objects inside the barrel from escaping from the boss portion. Furthermore, due to the axial pump action of the above-mentioned spiral feeding means, the plating solution inside the barrel is sufficiently agitated, so that the ion concentration in each part of the barrel becomes uniform, and as a result, plating is formed on the surface of small objects. The metal layer thickness becomes uniform. Furthermore, the present invention has a simple configuration in which a spiral feeding means such as a spiral blade is provided on the boss portion that functions as a support shaft for supporting the barrel on the placket, so it does not require much cost to implement. There is almost no need to worry about breakdowns.

[Explanation of Examples]

Embodiments of the present invention will be specifically described below with reference to the drawings. A bracket frame 5 rotatably supports the barrel 4 with the hook extending between the top surfaces of the left and right side walls 2 and 3 of the plating tank 1.
is placed in a removable manner. This bracket frame 5 has a pair of left and right bracket plates 7.8 connected to each other via a connecting plate 6 at the upper part, and each of the bracket plates 7, 8
A pair of front and rear projecting shafts 11a, llb are formed on the outer surface of a slope 9.10 having a predetermined length in the front and rear direction and are fixed to the same. 12a and 12b are installed at a predetermined position on the plating tank 1 by fitting them into substantially U-shaped electrode saddles 13a, 13b, 14a, and 14b fixed to the top surfaces of both the left and right walls. Note that a cathode of a rectifier (not shown) is connected to the saddles 13a and 14a, and this electrode saddle 1
The proximal ends of cathode leads 15 and 16 to be introduced into the barrel 4 are connected to the protruding shafts 11b and 12a that fit into the shafts 3b and 14a, respectively. This allows the above plaque. When the frame 5 is supported by the saddles 13a, 13b, 14a, and 14b, the cathode leads 15, 16 and the cathode of the external rectifier are electrically connected. A rotating shaft 17 is inserted and supported between the pair of bracket plates 7.8, and a sprocket 18.19 is fixed to one end of the rotating shaft 17 and an intermediate portion along the inner surface of the bracket plate 7, respectively. There is. This rotating shaft 17 is rotated by the sprocket 18 meshing with the drive chain 720 as shown in FIG. 2 when the bracket frame 5 is installed on the plating tank 1, and this rotation is caused by The transmission is transmitted to the barrel 4 by the sprocket 19 meshing with the sprocket 21 provided on the outer circumference of the barrel 4. As clearly shown in FIGS. 1 and 3, the barrel 4 has a substantially regular octagonal cylindrical shape, and has an octagonal circumferential plate 22 made of a synthetic resin perforated plate or mesh plate. It is roughly constructed by assembling it into a cylindrical shape and attaching side i23, 24 to both ends thereof. N through hole 25.2 drilled in the center of each side plate 23.24
6, a cylindrical boss 29.30 is welded and fixed to the externally protruding surface via a donut disk-shaped reinforcing plate 27.28. The outer diameters of these two cylindrical bosses 30 correspond to the inner diameters of the bearing holes 31, 32 made in the bracket plate 7.8, and the cylindrical bosses 29.30 are connected to the bearing holes 31. 3
2, this barrel 4 is supported by the bracket frame 5 so as to be rotatable around a horizontal axis. A sprocket 21 that meshes with the sprocket 19 of the rotating shaft 17 is formed on the outer periphery of one of the bottom plates 23 . Further, as clearly shown in FIGS. 2 and 4, a concentric small-diameter boss 33.34 is disposed inside the cylindrical boss 29.30.
A spiral blade 3 is provided in the gap between the cylindrical boss 29 and the cylindrical boss 29, 30.
5.36 is provided. These helical vanes 35, 36 have opposite twisting directions, so that when the barrel 4 rotates, each of the helical vanes 35, 36 together forces the external plating liquid into the barrel. In this example, the small diameter boss 33.34 is connected to the cathode lead 15.1.
6 into the barrel 4 from the outside. In the figure, reference numeral 37 indicates a metal anode plate suspended by an anode rod 38 and immersed in the plating tank, and reference numeral 39 indicates a barrel 4 for charging and discharging small items to be processed in the barrel 4. A lid is shown that is openable and closable on the side Fj, 22. The bracket frame 5, into which small items to be plated are loaded into the barrel 4 outside the plating tank 1, is suspended by a hoist or the like and carried onto the plating tank 1, and then the protruding shaft 11a,
llb, 12a, 12b to electrode saddles 13a, 13b,
It is mounted on the plating layer 1 by fitting it onto the plates 14a and 14b. At this time, the sprocket 18 of the rotating shaft 17 is connected to the drive chain 72.
0, the cathode leads 15,16 are in electrical communication with the cathode of the rectifier, and the barrel 4 is immersed in the plating solution. When electricity is applied between the anode metal plate 37 and the cathode leads 15 and 16 and the drive chain 720 is started, the barrel 4 starts rotating and ionized metal is deposited on the surface of the small object given a negative potential and plated. Processing progresses. In the present invention, the cylindrical boss 29 which is the rotational support part of the barrel 4
．． Since spiral blades 35 and 36 are provided on the inner periphery of barrel 30, as the barrel rotates, these spiral blades 35 and 36
The plating liquid near the outside of the bosses 29 and 30 is forcibly introduced into the barrel, and the plating liquid inside and outside the barrel is forcibly circulated. As a result, the metal ion concentration of the plating solution inside the barrel is maintained at the same level as that outside the barrel, and as a result, the plating process progresses much faster than in the past. Furthermore, since the plating solution inside the barrel is evenly stirred, the plating layer applied to the many small items inside the barrel is made uniform. This also contributes to shortening the plating processing time. Of course, the scope of the invention is not limited to the embodiments described above. For example, in the embodiment, cylindrical bosses with spiral blades are provided on the bottom plates on both sides of the barrel, but the same effect can be expected even if the 1jl blades are provided on only one cylindrical boss. Furthermore, in the embodiment, the small-diameter boss is arranged inside the cylindrical boss, and the spiral blade is provided in the annular gap between the cylindrical boss and the small-diameter boss, but the small-diameter boss may be omitted. At this time, it is necessary to provide a space in the center of the spiral blade for the cathode lead to pass through.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing the overall configuration of the device of the present invention, FIG. 2 is a sectional view taken along line nn in FIG. 1, and FIG. 3 is a -
4 is an exploded perspective view of the main parts of the present invention. 4...Barrel, 5.7.8...Bracket, 15°16...Cathode lead, 23.24...Side plate, 29.
30... Cylindrical boss, 35.36... Spiral feeding means (
spiral vanes).

Claims (1)

[Claims] (1) The barrel or boss part is attached to the inner periphery of the cylindrical boss part provided on the side wall of the barrel in order to rotatably support the barrel relative to the bracket and introduce the cathode lead into the barrel. A barrel plating device characterized by forming a spiral feeding means that provides an axial flow in the axial direction of a boss portion when rotated.