JPS6158559B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a metal ion supply device, and in particular,
The present invention relates to a metal ion supply device that promotes dissolution of plating metal and is suitable for use when supplying a plating solution containing plating metal ions to an electroplating device using an insoluble anode.

When performing electroplating using an insoluble anode, it is necessary to supply plating metal ions from a system other than the anode. Two methods have been used: one method involves dissolving the plating metal in a plating solution, and the other method involves dissolving the plating metal directly into the plating solution.

Among these methods, the former method has excellent solubility of the plating metal and can easily generate plating metal ions, but has the problem of high cost.

On the other hand, compared to the former method, the latter method has
Although this can be done at low cost, there is a problem in that the solubility of the plating metal is poor.

Here, FIG. 1 schematically shows the relationship between the average size d of the plated metal and the time t required from the start of dissolution until reaching a predetermined concentration in the latter method.

A broken line A in FIG. 1 indicates the state of dissolution of the plating metal 2 while the plating metal 2 is immersed in the plating liquid 4 (hereinafter referred to as method A), as shown in FIG. As shown in FIG.
This figure shows the state of dissolution of the plating metal 2 in a state where the plating liquid 4 is stirred (hereinafter referred to as method B).

As is clear from FIG. 1, by stirring, when the size of the plated metal 2 is small,
The dissolution rate increases, but as the size of the plated metal 2 increases, the stirring effect weakens, and furthermore, it becomes impossible to stir the plated metal 2, and the dissolution rate slows down to almost the same level as without stirring. I understand that

Therefore, in the latter method of directly dissolving the plating metal in the plating liquid, in order to promote the dissolution of the plating metal by stirring, it is necessary to reduce the size of the plating metal, and for this purpose, There was a problem that cost and labor increased.

The present invention has been made in view of the above-mentioned conventional problems, and can promote the dissolution of plating metal regardless of its size. Therefore, it is possible to easily and inexpensively remove plating metal ions. An object of the present invention is to provide a metal ion supply device that can be supplied to a metal ion deposition device or the like.

The present invention provides a metal ion supply device in which a plating liquid inflow passage for axially guiding the plating liquid supplied from the outside is formed, and a communication hole for discharging the introduced plating liquid to the outside. is formed on the wall surface, and a hollow plating liquid supply shaft is provided with stirring blades on the outer circumferential surface for stirring the plating metal placed on the outside, and the plating liquid supply shaft is rotated around its axis. A communication hole or gap is provided on the wall surface surrounding the drive device for rotational displacement, the outer periphery of the plating liquid supply shaft and its stirring blade, and through which the plating liquid flows to the outside in order to hold the plating metal. The formed stirring tank and a plating liquid discharge that surrounds the stirring tank and supplies the plating liquid containing plating metal ions to the electroplating device from below to keep it immersed in the plating liquid. The above-mentioned object is achieved by providing a tamping liquid tank provided with a means.

In the present invention, since the plated metal is entirely stirred in the stirring tank, the dissolution of the plated metal can be promoted regardless of the size of the plated metal. In addition, the plating liquid containing plating metal ions is taken out from the bottom of the stirring tank to lower the concentration of plating metal ions in the plating liquid in the stirring tank, which further dissolves the plating metal. can be promoted.

Embodiments of the present invention will be described in detail below with reference to the drawings.

As shown in FIGS. 4 and 5, the metal ion supply device 10 according to the present invention has a plating liquid inflow passage 20A formed therein for guiding the plating liquid 4 supplied from the outside in the axial direction. , a large number of communication holes 20 for discharging the introduced matting liquid 4 to the outside.
A hollow plating liquid supply shaft 20 is formed on the wall surface, and eight stirring blades 22 are arranged on the outer peripheral surface for stirring the plating metal 2 disposed on the outside, and the plating liquid A plating liquid supply shaft rotation device 30 for rotationally displacing the supply shaft 20 around its axis, and a plating liquid supply shaft 20 and its stirring blade 22 within a range that allows rotational displacement of the plating liquid supply shaft 20. for surrounding the outer periphery of and holding the plated metal 2,
A large number of communication holes 40A through which the plating liquid 4 flows out.
is formed on the wall surface of the stirring tank 40;
A plating liquid discharge pipe 50 surrounds the plating liquid 4 and supplies the plating liquid 4 containing plating metal ions from below to the electroplating apparatus (not shown) to hold the plating liquid 4 immersed in the plating liquid 4. A flask liquid tank 60 is provided.

The plating liquid supply shaft 20 has both ends 20C, 20
rotatably supported by a bearing 23 at D;
One end 20C thereof is connected to a plating liquid supply shaft rotating device 30 via a joint 24 to rotate the plating liquid supply shaft 20, and the other end 20D
is connected to a plating liquid introduction pipe 28 that communicates with a plating liquid supply device (not shown) via a joint 26, and is configured to supply plating liquid to the plating liquid inflow passage 20A. The plating liquid can be supplied while the liquid supply shaft 20 is rotating.

The stirring blade 22 has a rectangular shape, and has a long side close to the inner wall of the stirring tank 40 and a short side close to the inner wall of the plating liquid tank 60. It is located in

The stirring tank 40 is formed in a cylindrical shape, and its both ends 40B, 40B are joined to the inner wall of the plating liquid tank 60, and fixed so as to be immersed in the plating liquid 4 above the inside of the plating liquid tank 60. are located, and
A hopper 44 for charging the plated metal 2 (plated metal grains or plated metal pieces) into the stirring tank 40 is installed in the upper center of the figure.

The hopper 44 can freely communicate with the inside of the stirring tank 40 via a switch 46 provided at the lower part thereof, and by opening and closing the switch 46, the plated metal 2 can be placed into the stirring tank 40 when necessary. It is supposed to be invested.

The plating liquid discharge pipe 50 is connected to the plating liquid tank 6.
The plating liquid 4 having reached a predetermined metal ion concentration is directly or indirectly supplied to the next process, such as an electroplating device.

Reference numeral 32 in the figure indicates a sealing material for sealing the inside and outside of the plating liquid tank 60, and 34 indicates a pedestal for fixing the plating liquid supply shaft rotating device 30 and the bearing 23.

Next, the operation of this embodiment will be explained.

First, the plating metal 2 is introduced into the stirring tank 40 from the hopper 44, and then the plating liquid introduction pipe 28
Tangled liquid inflow passage 20A and communication hole 20B
The plating liquid 4 flows into the plating liquid tank 60 through the stirring tank 40, and the stirring tank 40 is immersed in the plating liquid 4.

In this state, the plating liquid supply shaft 20 is rotated by the plating liquid supply shaft rotation device 30, and the stirring tank 40 is rotated.
Stir the plated metal 2 inside.

At this time, in the stirring tank 40, the plating metal 2 and the plating liquid 4 are agitated as a whole while being rubbed against each other, so that dissolution of the plating metal 2 into the plating liquid 4 is promoted.

Furthermore, when stirring the plating metal 2 in the stirring tank 40, by newly supplying the plating liquid into the stirring tank 40 from the communication hole 20B, the plating liquid 4 in the stirring tank 40 can be plated. Since the metal ion concentration is lowered, the dissolution of the plating metal 2 is further promoted.

Since the plating metal 2 is dissolved in the stirring tank 40 and the plating metal ion concentration increases, the plating liquid 4 has a large specific gravity, so it passes through the communication hole 40A formed in the wall of the stirring tank 40. It descends below the plating liquid tank 60.

As a result, the plating metal ion concentration of the plating liquid 4 in the lower part of the plating liquid tank 60 increases and reaches a predetermined concentration. Liquid discharge piping 50
directly or indirectly to the next process, such as an electroplating device.

In this embodiment, by rotating the plating liquid supply shaft 20, the stirring blades 22 are rotated in the stirring tank 40.
Since the plated metal 2 is stirred strongly as a whole, the plated metal 2 can be stirred regardless of the size of the plated metal 2. can greatly promote the dissolution of Moreover, a plating solution with a low ion concentration of the plating metal is supplied to the upper part of the plating solution tank 60, and the plating solution 4 having a predetermined metal ion concentration is supplied from the lower part to the plating solution tank 60. The plating liquid tank 6 is always drained to the outside.
The plating liquid 4 in the upper part of 0 has a low plating metal ion concentration, that is, it is maintained at a plating metal ion concentration that is advantageous for dissolving the plating metal 2, and therefore,
In addition to the effect of stirring the entire plated metal 2 in the stirring tank 40, there is an even better dissolution effect.

The solid line C shown in FIG. 1 above shows the state of melting of the plating metal 2 using the plating metal ion supply device 10 in this embodiment, which is superior to the conventional methods A and B. It represents the solubility.

In addition, in the above embodiment, the stirring blade 22 is
Although the stirring blades were shaped like long plates and were arranged long in the axial direction, the shape and arrangement of the stirring blades are not limited to this. For example, as shown in FIG.
A plurality of stirring blades 29 may be provided discontinuously in the axial direction.

In this case, when stirring plated metal, the stirring plate 2
Since a part of the plated metal 2 is dropped from the gap between the stirring plate 29 and the plated metal 29, the entire plated metal 2 is stirred, so that the plated metal 2 is not concentrated in a specific area, and the plated metal 2 is effectively stirred. 2 can be stirred. Further, the shape of the stirring blade may be a screw-like shape obtained by adding a twist to the stirring blades 22 and 29.

Furthermore, in the above embodiment, the plating liquid supply shaft 20 is rotationally displaced in one direction, thereby rotationally displacing the stirring blade and stirring the plating metal 2. The method is
The present invention is not limited to this, and for example, the plating metal may be stirred by reciprocating rotationally displacing the plating liquid supply shaft to swing the stirring blades.

In this case, the stirring tank can be made smaller compared to the case where the stirring blades are rotated.

As described above, according to the present invention, regardless of the size of the plated metal grains or plated metal pieces, their dissolution can be greatly promoted. Therefore, it has the excellent effect of being able to supply plating metal ions quickly, easily, and at low cost without reducing the size of the plating metal in advance or dissolving the plating metal in the form of chemicals. have

[Brief explanation of the drawing]

FIG. 1 is a diagram showing the relationship between the average size of the plating metal and the time required from the start of dissolution to reaching a predetermined metal ion concentration when the plating metal is directly dissolved in the plating solution; 2 and 3 are cross-sectional views schematically showing the configuration of a conventional apparatus for directly dissolving plating metal into a plating solution, and FIG. 4 is a sectional view showing a plating metal ion supply according to the present invention. A side view including a partial sectional view showing the configuration of an embodiment of the device; FIG. 5 is a sectional view taken along line V-V in FIG. 4;
FIG. 6 is a schematic cross-sectional view showing the configuration of a stirring blade in another embodiment of the plating metal ion supply device according to the present invention. 2...Plating metal, 4...Plating liquid, 10...
Metal ion supply device, 20... plating liquid supply shaft,
20A...Plating liquid inflow passage, 20B...Communication hole, 22, 29...Stirring blade, 30...Plating liquid supply shaft rotation device, 40...Stirring tank, 40A...Communication hole, 50...Mete Plating liquid discharge piping, 60...Plating liquid tank.

Claims (1)

[Claims] 1. A plating liquid inflow passage for axially guiding plating liquid supplied from the outside is formed inside, and a communication hole for discharging the introduced plating liquid to the outside is formed on the wall surface. a hollow plating liquid supply shaft having stirring blades disposed on the outer circumferential surface for stirring the plated metal formed and placed on the outside; and a hollow plating liquid supply shaft that is rotationally displaced about its axis. a driving device for the plating solution, and a communication hole or a gap formed in the wall surface surrounding the outer periphery of the plating solution supply shaft and its stirring blade to allow the plating solution to flow out to the outside for holding the plating metal. A stirring tank and a plating liquid discharge means for surrounding the stirring tank and keeping the plating liquid immersed in the plating liquid and supplying the plating liquid containing plating metal ions to the electroplating device from below are provided. A metal ion supply device characterized by comprising: a dripping liquid tank; and a metal ion supply device.