JPS6361398B2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a barrel plating device, and more specifically, the present invention relates to a barrel plating device, and more specifically, the plating liquid outside the barrel is forcedly and continuously introduced into the barrel by using the rotation of a horizontal barrel. This invention relates to an improved method that can shorten the time required for plating processing.

[Conventional technology]

A barrel plating device is a device configured to apply plating to a large number of small items at once.It is a cylindrical device that is rotated around a horizontal axis in a plating tank and loaded with small items to be plated. Equipped with a perforated barrel. This barrel usually has a pair of left and right bosses with holes provided in the center of both side plates, and these bosses are inserted into the bearing holes of a predetermined bracket to be rotatably supported. The cathode lead is introduced into the barrel through the hole in the bottom.

When electricity is passed between the metal anode placed outside the barrel in the plating tank and the cathode introduced into the barrel as described above, the ionized and dissolved metal from the anode contacts the cathode and develops a negative potential. It is deposited on the surface of a given small object, thereby forming a plating layer on the surface of the small object.

[Problem that the invention seeks to solve]

By the way, in order to form a uniform plating layer on all the small items in the barrel, it is necessary that the plating liquid inside and outside the barrel circulates sufficiently and that the metal ion concentration within the barrel is kept constant.

However, in barrels with conventional structures, although the plating liquid is circulated from the inside of the barrel to the outside of the barrel due to the centrifugal pumping action caused by the rotation of the barrel, sufficient plating liquid circulation as described above cannot be obtained. As a result, after energization, there is a fundamental problem that not only the ion concentration inside the barrel is extremely lower than the ion concentration outside the barrel, but also that the concentration becomes uneven inside the barrel. As a result, the plating processing time becomes longer, and the thickness of the plating layer becomes uneven for each small item, resulting in deterioration of product quality.

Possible means to temporarily solve this problem include increasing the rotational speed of the barrel, or forcibly introducing the plating liquid from outside the barrel into the barrel using a separately provided pump.
However, in the former case, the chances of contact between small objects or the contact opportunity and relative speed of contact between small objects and the inner surface of the barrel increase, and the small objects may damage each other or be damaged by the inner surface of the barrel, resulting in the surface quality of the plating layer being degraded. This method cannot be adopted because another problem arises in that the value decreases. Also, in the latter,
There is an extremely difficult problem in that it is necessary to secure a space for the pump and the pipes, or to take measures to prevent damage to them, and solving this problem requires a huge amount of cost.

The present invention was devised under the above circumstances, and its object is to achieve sufficient circulation of plating liquid inside and outside the barrel with a simple structure.

[Means to solve the problem]

In order to solve the above problems, the barrel type plating device of the present invention takes the following technical measures.

The barrel is rotatably supported with respect to the bracket,
and a spiral feed that provides an axial flow in the axial direction of the boss when the barrel or the boss rotates in a predetermined direction on the inner periphery of the cylindrical boss provided on the side wall of the barrel for introducing the cathode lead into the barrel. forming means.

[Action and effect]

When the barrel or boss rotates, the spiral feeding means formed on the inner periphery of the boss acts as a so-called axial flow pump, forcing the plating liquid with high ion concentration near the boss outside the barrel into the barrel. send to. The plating solution, which has a reduced ion concentration after completing the metal deposition action on the surface of the small object, flows out of the barrel through the hole in the outer wall of the barrel. This results in
The plating solution inside and outside the barrel is sufficiently circulated, and the ion concentration of the plating solution inside the barrel is maintained at the same high concentration as outside the barrel. As a result, the plating processing time is significantly shortened compared to the conventional method. Further, the spiral feeding means can prevent small objects inside the barrel from escaping from the boss portion.

Furthermore, the plating liquid inside the barrel is sufficiently stirred by the axial flow pumping action of the spiral feeding means, so that the ion concentration in each part of the barrel becomes uniform, and as a result, the plating liquid formed on the surface of the small object becomes uniform. The metal layer thickness becomes uniform.

Furthermore, the present invention has a simple configuration in which a spiral feed means such as a spiral blade is provided on the boss portion that functions as a support shaft for supporting the barrel on the bracket, so it does not require much cost to implement. There is almost no need to worry about breakdowns.

[Description of Examples] Examples of the present invention will be specifically described below with reference to the drawings.

A bracket frame 5 rotatably supporting a barrel 4 is removably mounted so as to span between the top surfaces of left and right side walls 2 and 3 of the plating tank 1. This bracket frame 5 has a pair of left and right bracket plates 7 and 8 connected to each other via a connecting plate 6 at the upper part.
A pair of front and rear protruding shafts 11a, 11b are formed on the outer surfaces of plates 9, 10 having a predetermined length in the front and rear direction and fixed to each of the bracket plates 7, 8, respectively.
12a, 12b, substantially U-shaped electrode saddles 13a, 13b, 14 fixed to the top surfaces of both the left and right walls.
It is installed at a predetermined position on the plating tank 1 by fitting it into the holes a and 14b. In addition, the above saddle 13
A, 14a are connected to the cathode of a rectifier (not shown), and protruding shafts 11b, 12a that fit into the electrode saddles 13b, 14a are connected to the proximal ends of cathode leads 15, 16 to be introduced into the barrel 4. are connected to each other. This allows the bracket frame 5 to be attached to the saddles 13a, 13b, 14a, 14b.
When supported, the cathode leads 15, 16 and the cathode of the external rectifier are electrically connected.

A rotating shaft 17 is inserted and supported between the pair of bracket plates 7 and 8, and at one end of this rotating shaft 17 and an intermediate portion along the inner surface of the bracket plate 7,
Sprockets 18 and 19 are fixed, respectively. This rotating shaft 17 is connected to the sprocket 18 when the bracket frame 5 is installed on the plating tank 1.
is rotated by meshing with the drive chain 20 as shown in FIG. communicated.

As clearly shown in FIGS. 1 and 3, the barrel 4 has a substantially regular octagonal cylindrical shape,
It is generally constructed by assembling a circumferential plate 22 made of a synthetic resin perforated plate or a mesh plate into an octagonal tube shape, and attaching side plates 23 and 24 to both ends thereof.
Through hole 2 opened in the center of each side plate 23, 24
5, 26, donut disk-shaped reinforcing plates 27, 2
The cylindrical bosses 29 and 30 are welded and fixed to the externally protruding shape via the cylindrical bosses 8 . Note that this cylindrical boss 29, 3
The outer diameter of 0 corresponds to the inner diameter of the bearing holes 31, 32 made in the bracket plates 7, 8, and by inserting the cylindrical bosses 29, 30 into the bearing holes 31, 32, The barrel 4 is supported by the bracket frame 5 so as to be rotatable around a horizontal axis.
A sprocket 21 that meshes with the sprocket 19 of the rotating shaft 17 is formed on the outer periphery of one of the bottom plates 23 .

Further, as clearly shown in FIGS. 2 and 4, concentric small-diameter bosses 33, 34 are arranged inside the cylindrical bosses 29, 30, and the small-diameter bosses 33, 34 and the cylindrical bosses 33, 34 are arranged concentrically. Boss 29, 30
Spiral blades 35 and 36 are provided in the gap between them. These spiral vanes 35, 36 are twisted in opposite directions, so that when the barrel 4 rotates, the spiral vanes 35, 36 together feed the external plating liquid into the barrel. In addition,
In this example, the small diameter bosses 33 and 34 function as guides for introducing the cathode leads 15 and 16 into the barrel 4 from the outside.

In the figure, the reference numeral 37 indicates a metal anode plate suspended by an anode rod 38 and immersed in the plating bath.
Reference numeral 39 denotes a side plate 22 of the barrel 4 for charging and discharging small items to be plated into the barrel 4.
A lid that can be opened and closed is shown.

The bracket frame 5, into which small items to be plated are charged into the barrel 4 outside the plating tank 1, is carried onto the plating tank 1 while being suspended by a hoist, and then the projecting shafts 11a, 11b, 12a, 12b
It is mounted on the plating layer 1 by fitting it onto the electrode saddles 13a, 13b, 14a, and 14b. At this time, the sprocket 18 of the rotating shaft 17 meshes with the drive chain 20, and the cathode leads 15, 16
is electrically connected to the cathode of the rectifier, and the barrel 4 is
Immersed in plating liquid. When electricity is applied between the anode metal plate 37 and the cathode leads 15 and 16 and the drive chain 20 is started, the barrel 4 starts rotating and ionized metal is deposited on the surface of the small object given a negative potential and plated. Processing progresses.

In the present invention, since the spiral blades 35 and 36 are provided on the inner periphery of the cylindrical bosses 29 and 30, which are the rotational support parts of the barrel 4, the spiral blades 35 and 36 move around the bosses 29 and 30 as the barrel rotates. The plating liquid near the outside is forcibly introduced into the barrel, and the plating liquid inside and outside the barrel is forcibly circulated. As a result, the metal ion concentration of the plating solution inside the barrel is maintained at the same level as that outside the barrel, and as a result, the plating process progresses much faster than in the past. Furthermore, since the plating liquid inside the barrel is evenly stirred, the plating layer applied to the many small objects inside the barrel is made uniform. This also contributes to shortening the plating processing time.

Of course, the scope of the invention is not limited to the embodiments described above. For example, in the embodiment, cylindrical bosses with spiral blades are provided on the bottom plates on both sides of the barrel, but the same effect can be expected even if the spiral blades are provided on only one cylindrical boss. In addition, in the example,
Although the small-diameter boss is arranged inside the cylindrical boss and the spiral blade is provided in the annular gap between the cylindrical boss and the small-diameter boss, the small-diameter boss may be omitted. In addition,
At this time, it is necessary to provide a space in the center of the spiral blade for the cathode lead to pass through.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing the overall configuration of the device of the present invention;
2 is a sectional view taken along the - line in FIG. 1, FIG. 3 is a sectional view taken along the - line in FIG. 2, and FIG. 4 is an exploded perspective view of essential parts of the present invention. 4...Barrel, 5,7,8...Bracket, 1
5, 16... cathode lead, 23, 24... side plate,
29, 30... Cylindrical boss, 35, 36... Spiral feeding means (spiral blade).

Claims (1)

[Claims] 1. On the inner periphery of a cylindrical boss provided on the side wall of the barrel to rotatably support the barrel relative to the bracket and introduce the cathode lead into the barrel,
1. A barrel plating device, characterized in that a spiral feeding means is formed to provide an axial flow in the axial direction of the boss portion when the barrel or the boss portion rotates in a predetermined direction.