JPS6278835A - 半導体素子用樹脂封止装置 - Google Patents

半導体素子用樹脂封止装置

Info

Publication number
JPS6278835A
JPS6278835A JP21861685A JP21861685A JPS6278835A JP S6278835 A JPS6278835 A JP S6278835A JP 21861685 A JP21861685 A JP 21861685A JP 21861685 A JP21861685 A JP 21861685A JP S6278835 A JPS6278835 A JP S6278835A
Authority
JP
Japan
Prior art keywords
plunger
speed
motor
resin
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21861685A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0449255B2 (US20050065096A1-20050324-C00069.png
Inventor
Minoru Tanaka
實 田中
Itaru Matsuo
至 松尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP21861685A priority Critical patent/JPS6278835A/ja
Publication of JPS6278835A publication Critical patent/JPS6278835A/ja
Publication of JPH0449255B2 publication Critical patent/JPH0449255B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP21861685A 1985-09-30 1985-09-30 半導体素子用樹脂封止装置 Granted JPS6278835A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21861685A JPS6278835A (ja) 1985-09-30 1985-09-30 半導体素子用樹脂封止装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21861685A JPS6278835A (ja) 1985-09-30 1985-09-30 半導体素子用樹脂封止装置

Publications (2)

Publication Number Publication Date
JPS6278835A true JPS6278835A (ja) 1987-04-11
JPH0449255B2 JPH0449255B2 (US20050065096A1-20050324-C00069.png) 1992-08-11

Family

ID=16722746

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21861685A Granted JPS6278835A (ja) 1985-09-30 1985-09-30 半導体素子用樹脂封止装置

Country Status (1)

Country Link
JP (1) JPS6278835A (US20050065096A1-20050324-C00069.png)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS578107A (en) * 1980-06-18 1982-01-16 Toshiba Corp Molding apparatus for resin seal
JPS599538U (ja) * 1982-07-12 1984-01-21 内外機材株式会社 半導体素子用樹脂封止装置
JPS615884A (ja) * 1984-06-19 1986-01-11 松下電器産業株式会社 洗濯機の蓋スイツチ
JPS6225888U (US20050065096A1-20050324-C00069.png) * 1985-07-30 1987-02-17

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH641143A5 (fr) * 1978-02-06 1984-02-15 Firmenich & Cie Esters aliphatiques polyinsatures et leur utilisation en tant qu'ingredients aromatisants et parfumants.

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS578107A (en) * 1980-06-18 1982-01-16 Toshiba Corp Molding apparatus for resin seal
JPS599538U (ja) * 1982-07-12 1984-01-21 内外機材株式会社 半導体素子用樹脂封止装置
JPS615884A (ja) * 1984-06-19 1986-01-11 松下電器産業株式会社 洗濯機の蓋スイツチ
JPS6225888U (US20050065096A1-20050324-C00069.png) * 1985-07-30 1987-02-17

Also Published As

Publication number Publication date
JPH0449255B2 (US20050065096A1-20050324-C00069.png) 1992-08-11

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