JPS6278747U - - Google Patents
Info
- Publication number
- JPS6278747U JPS6278747U JP1985170042U JP17004285U JPS6278747U JP S6278747 U JPS6278747 U JP S6278747U JP 1985170042 U JP1985170042 U JP 1985170042U JP 17004285 U JP17004285 U JP 17004285U JP S6278747 U JPS6278747 U JP S6278747U
- Authority
- JP
- Japan
- Prior art keywords
- silicon wafer
- semiconductor device
- electrode plate
- protective electrode
- brazing material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/30—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985170042U JPS6278747U (OSRAM) | 1985-11-05 | 1985-11-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985170042U JPS6278747U (OSRAM) | 1985-11-05 | 1985-11-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6278747U true JPS6278747U (OSRAM) | 1987-05-20 |
Family
ID=31104409
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985170042U Pending JPS6278747U (OSRAM) | 1985-11-05 | 1985-11-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6278747U (OSRAM) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016105508A (ja) * | 2016-02-29 | 2016-06-09 | 株式会社三社電機製作所 | 半導体装置 |
-
1985
- 1985-11-05 JP JP1985170042U patent/JPS6278747U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016105508A (ja) * | 2016-02-29 | 2016-06-09 | 株式会社三社電機製作所 | 半導体装置 |